JP2015520518A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2015520518A5 JP2015520518A5 JP2015515951A JP2015515951A JP2015520518A5 JP 2015520518 A5 JP2015520518 A5 JP 2015520518A5 JP 2015515951 A JP2015515951 A JP 2015515951A JP 2015515951 A JP2015515951 A JP 2015515951A JP 2015520518 A5 JP2015520518 A5 JP 2015520518A5
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- light emitting
- surface portion
- emitting device
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2012-0061289 | 2012-06-08 | ||
| KR1020120061289A KR101944409B1 (ko) | 2012-06-08 | 2012-06-08 | 발광 소자 패키지 |
| PCT/KR2013/005005 WO2013183950A1 (ko) | 2012-06-08 | 2013-06-07 | 발광 소자 패키지 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015520518A JP2015520518A (ja) | 2015-07-16 |
| JP2015520518A5 true JP2015520518A5 (enExample) | 2016-07-21 |
| JP6230600B2 JP6230600B2 (ja) | 2017-11-15 |
Family
ID=49712284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015515951A Expired - Fee Related JP6230600B2 (ja) | 2012-06-08 | 2013-06-07 | 発光素子パッケージ |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9391117B2 (enExample) |
| EP (1) | EP2860775B1 (enExample) |
| JP (1) | JP6230600B2 (enExample) |
| KR (1) | KR101944409B1 (enExample) |
| CN (1) | CN104396034B (enExample) |
| WO (1) | WO2013183950A1 (enExample) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101871374B1 (ko) * | 2012-04-09 | 2018-06-27 | 엘지이노텍 주식회사 | 발광 램프 |
| JP6275399B2 (ja) | 2012-06-18 | 2018-02-07 | エルジー イノテック カンパニー リミテッド | 照明装置 |
| TWI597863B (zh) * | 2013-10-22 | 2017-09-01 | 晶元光電股份有限公司 | 發光元件及其製造方法 |
| KR102285432B1 (ko) * | 2014-11-18 | 2021-08-04 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 |
| US10461233B2 (en) * | 2015-11-27 | 2019-10-29 | Lg Innotek Co., Ltd. | Light emitting device package and lighting device |
| WO2017191954A1 (ko) | 2016-05-04 | 2017-11-09 | 엘지이노텍 주식회사 | 조명모듈 및 이를 구비한 조명 장치 |
| JP6717079B2 (ja) * | 2016-06-29 | 2020-07-01 | 日亜化学工業株式会社 | 発光装置及びその製造方法、並びにパッケージの製造方法 |
| WO2018131097A1 (ja) * | 2017-01-11 | 2018-07-19 | オリンパス株式会社 | 照明装置及び照明装置を含む内視鏡システム |
| JP6971052B2 (ja) * | 2017-04-20 | 2021-11-24 | 京セラ株式会社 | 半導体装置の製造方法および半導体装置 |
| DE102019134904A1 (de) * | 2019-12-18 | 2021-06-24 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches halbleiterbauelement und verfahren zum betreiben eines optoelektronischen halbleiterbauelements |
| KR102179692B1 (ko) * | 2020-08-03 | 2020-11-17 | 장희관 | 리드갭을 구비한 전장용 사이드뷰 led 패키지 |
| KR20220114910A (ko) * | 2021-02-09 | 2022-08-17 | 엘지이노텍 주식회사 | 발광소자 패키지 및 이를 구비한 조명 장치 |
| US12104755B2 (en) * | 2021-03-30 | 2024-10-01 | Lumileds Llc | Patterned reflective grids for LED arrays and displays |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4912532A (en) * | 1988-08-26 | 1990-03-27 | Hewlett-Packard Company | Electro-optical device with inverted transparent substrate and method for making same |
| EP2267798B1 (de) | 1997-07-29 | 2015-09-30 | OSRAM Opto Semiconductors GmbH | Optoelektronisches Bauelement |
| JP2002314100A (ja) * | 2001-04-19 | 2002-10-25 | Yazaki Corp | 樹脂封止型半導体装置の製造方法 |
| JP2006024794A (ja) * | 2004-07-08 | 2006-01-26 | Sanyo Electric Co Ltd | フルカラー発光ダイオード装置 |
| JP4922555B2 (ja) * | 2004-09-24 | 2012-04-25 | スタンレー電気株式会社 | Led装置 |
| JP5119621B2 (ja) | 2006-04-21 | 2013-01-16 | 日亜化学工業株式会社 | 発光装置 |
| JP4922663B2 (ja) * | 2006-05-18 | 2012-04-25 | スタンレー電気株式会社 | 半導体光学装置 |
| KR100801621B1 (ko) * | 2007-06-05 | 2008-02-11 | 서울반도체 주식회사 | Led 패키지 |
| JP2009152268A (ja) * | 2007-12-19 | 2009-07-09 | Sony Corp | 発光ダイオード、表示装置及び電子機器 |
| JP5426091B2 (ja) * | 2007-12-27 | 2014-02-26 | 豊田合成株式会社 | 発光装置 |
| US8507929B2 (en) * | 2008-06-16 | 2013-08-13 | Koninklijke Philips Electronics N.V. | Semiconductor light emitting device including graded region |
| JP2010034221A (ja) | 2008-07-28 | 2010-02-12 | Sony Corp | 端面発光型半導体レーザおよびその製造方法 |
| KR100993903B1 (ko) | 2008-07-31 | 2010-11-11 | 알티전자 주식회사 | 사이드 뷰 발광 다이오드 패키지 |
| US8368112B2 (en) * | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
| JP5678434B2 (ja) | 2010-02-12 | 2015-03-04 | 東芝ライテック株式会社 | 反射型led照明装置 |
| JP5507330B2 (ja) | 2010-04-27 | 2014-05-28 | ローム株式会社 | Ledモジュール |
| KR20120019750A (ko) * | 2010-08-26 | 2012-03-07 | 엘지이노텍 주식회사 | 발광 소자 |
| US9240395B2 (en) * | 2010-11-30 | 2016-01-19 | Cree Huizhou Opto Limited | Waterproof surface mount device package and method |
| KR101871374B1 (ko) * | 2012-04-09 | 2018-06-27 | 엘지이노텍 주식회사 | 발광 램프 |
-
2012
- 2012-06-08 KR KR1020120061289A patent/KR101944409B1/ko not_active Expired - Fee Related
-
2013
- 2013-06-07 EP EP13800772.9A patent/EP2860775B1/en active Active
- 2013-06-07 US US14/406,159 patent/US9391117B2/en active Active
- 2013-06-07 CN CN201380030136.0A patent/CN104396034B/zh active Active
- 2013-06-07 WO PCT/KR2013/005005 patent/WO2013183950A1/ko not_active Ceased
- 2013-06-07 JP JP2015515951A patent/JP6230600B2/ja not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2015520518A5 (enExample) | ||
| JP2013219357A5 (enExample) | ||
| EP2650590A3 (en) | Light emitting package | |
| EP2477242A3 (en) | Light-emitting device package and method of manufacturing the same | |
| EP4510174A3 (en) | Integrated circuit package having wire-bonded multi-die stack | |
| TW201130165A (en) | Light emitting diode chip having distributed bragg reflector, method of fabricating the same, and light emitting diode package having distributed bragg reflector | |
| JP2014036226A5 (enExample) | ||
| JP2015076617A5 (enExample) | ||
| JP2013093477A5 (enExample) | ||
| EP2562830A3 (en) | Light emitting device package | |
| JP2014030321A5 (enExample) | ||
| TWI533472B (zh) | 半導體發光元件及其製造方法 | |
| EP2642518A3 (en) | Semiconductor light emitting device and method for manufacturing same | |
| TWM485515U (zh) | Led封裝裝置 | |
| CN204289467U (zh) | 一种半导体二极管结构 | |
| CN207731919U (zh) | 一种功率器件封装结构 | |
| JP2014078646A5 (ja) | パワーモジュール | |
| JP2015070200A5 (enExample) | ||
| JP2014192313A5 (ja) | Led発光装置の製造方法及びled発光装置 | |
| CN205385043U8 (zh) | 发光元件 | |
| JP2014096497A5 (enExample) | ||
| CN103943596A (zh) | 一种全包封形式的引线框架 | |
| CN106505136A (zh) | 一种石英玻璃衬底led深紫外倒装芯片 | |
| CN207731924U (zh) | 一种功率器件引线框结构 | |
| JP5815586B2 (ja) | 半導体発光素子 |