JP2015520432A5 - - Google Patents

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Publication number
JP2015520432A5
JP2015520432A5 JP2015503274A JP2015503274A JP2015520432A5 JP 2015520432 A5 JP2015520432 A5 JP 2015520432A5 JP 2015503274 A JP2015503274 A JP 2015503274A JP 2015503274 A JP2015503274 A JP 2015503274A JP 2015520432 A5 JP2015520432 A5 JP 2015520432A5
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JP
Japan
Prior art keywords
drivers
driver
semiconductor die
additional
die
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JP2015503274A
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English (en)
Japanese (ja)
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JP2015520432A (ja
JP6082803B2 (ja
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Priority claimed from US13/431,674 external-priority patent/US8587340B2/en
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Publication of JP2015520432A publication Critical patent/JP2015520432A/ja
Publication of JP2015520432A5 publication Critical patent/JP2015520432A5/ja
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Publication of JP6082803B2 publication Critical patent/JP6082803B2/ja
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JP2015503274A 2012-03-27 2013-03-13 スケーラブルドライバを含む装置及び方法 Active JP6082803B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/431,674 2012-03-27
US13/431,674 US8587340B2 (en) 2012-03-27 2012-03-27 Apparatuses including scalable drivers and methods
PCT/US2013/030900 WO2013148199A1 (en) 2012-03-27 2013-03-13 Apparatuses including scalable drivers and methods

Publications (3)

Publication Number Publication Date
JP2015520432A JP2015520432A (ja) 2015-07-16
JP2015520432A5 true JP2015520432A5 (enExample) 2016-05-12
JP6082803B2 JP6082803B2 (ja) 2017-02-15

Family

ID=49234090

Family Applications (1)

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JP2015503274A Active JP6082803B2 (ja) 2012-03-27 2013-03-13 スケーラブルドライバを含む装置及び方法

Country Status (7)

Country Link
US (3) US8587340B2 (enExample)
EP (1) EP2831876B1 (enExample)
JP (1) JP6082803B2 (enExample)
KR (1) KR101936980B1 (enExample)
CN (1) CN104285254B (enExample)
TW (1) TWI570739B (enExample)
WO (1) WO2013148199A1 (enExample)

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* Cited by examiner, † Cited by third party
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US9042160B1 (en) * 2014-07-03 2015-05-26 Sandisk Technologies Inc. Memory device with resistive random access memory (ReRAM)
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US9378778B1 (en) 2015-06-14 2016-06-28 Darryl G. Walker Package including a plurality of stacked semiconductor devices including a capacitance enhanced through via and method of manufacture
US20210125040A1 (en) * 2019-10-24 2021-04-29 International Business Machines Corporation 3d neural inference processing unit architectures

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