JP2015520377A5 - - Google Patents

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Publication number
JP2015520377A5
JP2015520377A5 JP2015514130A JP2015514130A JP2015520377A5 JP 2015520377 A5 JP2015520377 A5 JP 2015520377A5 JP 2015514130 A JP2015514130 A JP 2015514130A JP 2015514130 A JP2015514130 A JP 2015514130A JP 2015520377 A5 JP2015520377 A5 JP 2015520377A5
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JP
Japan
Prior art keywords
overlay
pattern elements
target
pattern
dummy fill
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Application number
JP2015514130A
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English (en)
Japanese (ja)
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JP6339067B2 (ja
JP2015520377A (ja
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Priority claimed from PCT/US2013/042089 external-priority patent/WO2013177208A1/en
Publication of JP2015520377A publication Critical patent/JP2015520377A/ja
Publication of JP2015520377A5 publication Critical patent/JP2015520377A5/ja
Application granted granted Critical
Publication of JP6339067B2 publication Critical patent/JP6339067B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015514130A 2012-05-22 2013-05-21 直交下層ダミーフィルを有するオーバレイターゲット Active JP6339067B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261650269P 2012-05-22 2012-05-22
US61/650,269 2012-05-22
PCT/US2013/042089 WO2013177208A1 (en) 2012-05-22 2013-05-21 Overlay targets with orthogonal underlayer dummyfill

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018090295A Division JP6570018B2 (ja) 2012-05-22 2018-05-09 オーバレイターゲット、オーバレイ計測を実行するシステム、及び方法

Publications (3)

Publication Number Publication Date
JP2015520377A JP2015520377A (ja) 2015-07-16
JP2015520377A5 true JP2015520377A5 (enExample) 2016-07-07
JP6339067B2 JP6339067B2 (ja) 2018-06-06

Family

ID=49624297

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015514130A Active JP6339067B2 (ja) 2012-05-22 2013-05-21 直交下層ダミーフィルを有するオーバレイターゲット
JP2018090295A Active JP6570018B2 (ja) 2012-05-22 2018-05-09 オーバレイターゲット、オーバレイ計測を実行するシステム、及び方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2018090295A Active JP6570018B2 (ja) 2012-05-22 2018-05-09 オーバレイターゲット、オーバレイ計測を実行するシステム、及び方法

Country Status (5)

Country Link
JP (2) JP6339067B2 (enExample)
KR (2) KR102272361B1 (enExample)
CN (1) CN103814429A (enExample)
SG (1) SG2014008841A (enExample)
WO (1) WO2013177208A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107533020B (zh) * 2015-04-28 2020-08-14 科磊股份有限公司 计算上高效的基于x射线的叠盖测量系统与方法
KR102344379B1 (ko) * 2015-05-13 2021-12-28 삼성전자주식회사 실딩 패턴을 갖는 반도체 소자
KR102454206B1 (ko) * 2016-03-14 2022-10-12 삼성전자주식회사 웨이퍼 정렬 마크 및 웨이퍼 정렬 마크의 오차 측정 방법
IL270171B2 (en) * 2017-04-28 2023-12-01 Asml Netherlands Bv Method and apparatus for metrology and related computer software
US10677588B2 (en) * 2018-04-09 2020-06-09 Kla-Tencor Corporation Localized telecentricity and focus optimization for overlay metrology
CN115485824B (zh) * 2020-05-05 2024-04-16 科磊股份有限公司 用于高表面型态半导体堆叠的计量目标
KR102838579B1 (ko) 2020-12-10 2025-07-28 삼성전자주식회사 반도체 장치
KR102566129B1 (ko) 2022-01-20 2023-08-16 (주) 오로스테크놀로지 모아레 패턴을 형성하는 오버레이 마크, 이를 이용한 오버레이 측정방법, 및 반도체 소자의 제조방법
US20250272812A1 (en) * 2024-02-26 2025-08-28 Kla Corporation Side-by-side off-center die overlay target

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2829211B2 (ja) * 1993-01-07 1998-11-25 株式会社東芝 合せずれ測定方法
JPH07226369A (ja) * 1994-02-09 1995-08-22 Nikon Corp アライメント方法及び装置
JP4038320B2 (ja) * 2000-04-17 2008-01-23 株式会社東芝 半導体集積装置
JP2002124458A (ja) * 2000-10-18 2002-04-26 Nikon Corp 重ね合わせ検査装置および重ね合わせ検査方法
US6716559B2 (en) * 2001-12-13 2004-04-06 International Business Machines Corporation Method and system for determining overlay tolerance
JP4525067B2 (ja) * 2003-12-12 2010-08-18 株式会社ニコン 位置ずれ検出用マーク
US20050286052A1 (en) * 2004-06-23 2005-12-29 Kevin Huggins Elongated features for improved alignment process integration
US7526749B2 (en) * 2005-10-31 2009-04-28 Kla-Tencor Technologies Corporation Methods and apparatus for designing and using micro-targets in overlay metrology
US7291562B2 (en) * 2005-12-09 2007-11-06 Yung-Tin Chen Method to form topography in a deposited layer above a substrate
NL2003404A (en) * 2008-09-16 2010-03-17 Asml Netherlands Bv Inspection method and apparatus, substrate, lithographic apparatus, lithographic processing cell and device manufacturing method.
US8804137B2 (en) * 2009-08-31 2014-08-12 Kla-Tencor Corporation Unique mark and method to determine critical dimension uniformity and registration of reticles combined with wafer overlay capability
NL2006228A (en) * 2010-03-17 2011-09-20 Asml Netherlands Bv Alignment mark, substrate, set of patterning devices, and device manufacturing method.
US9927718B2 (en) * 2010-08-03 2018-03-27 Kla-Tencor Corporation Multi-layer overlay metrology target and complimentary overlay metrology measurement systems

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