JP2020524276A5 - - Google Patents

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Publication number
JP2020524276A5
JP2020524276A5 JP2019570044A JP2019570044A JP2020524276A5 JP 2020524276 A5 JP2020524276 A5 JP 2020524276A5 JP 2019570044 A JP2019570044 A JP 2019570044A JP 2019570044 A JP2019570044 A JP 2019570044A JP 2020524276 A5 JP2020524276 A5 JP 2020524276A5
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JP
Japan
Prior art keywords
overlay target
imaging
design
optical system
scattering measurement
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JP2019570044A
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English (en)
Japanese (ja)
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JP2020524276A (ja
JP7018970B2 (ja
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Priority claimed from US15/995,731 external-priority patent/US11112369B2/en
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Publication of JP2020524276A publication Critical patent/JP2020524276A/ja
Publication of JP2020524276A5 publication Critical patent/JP2020524276A5/ja
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Publication of JP7018970B2 publication Critical patent/JP7018970B2/ja
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JP2019570044A 2017-06-19 2018-06-14 撮像ベースオーバーレイ及び散乱計測ベースオーバーレイのためのハイブリッドオーバーレイ標的設計 Active JP7018970B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201762521782P 2017-06-19 2017-06-19
US62/521,782 2017-06-19
US15/995,731 2018-06-01
US15/995,731 US11112369B2 (en) 2017-06-19 2018-06-01 Hybrid overlay target design for imaging-based overlay and scatterometry-based overlay
PCT/US2018/037430 WO2018236653A1 (en) 2017-06-19 2018-06-14 HYBRID RECOVERY TARGET DESIGN FOR IMAGING-BASED RECOVERY AND DIFFUSIOMETRY-BASED RECOVERY

Publications (3)

Publication Number Publication Date
JP2020524276A JP2020524276A (ja) 2020-08-13
JP2020524276A5 true JP2020524276A5 (enExample) 2021-07-26
JP7018970B2 JP7018970B2 (ja) 2022-02-14

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ID=64657997

Family Applications (1)

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JP2019570044A Active JP7018970B2 (ja) 2017-06-19 2018-06-14 撮像ベースオーバーレイ及び散乱計測ベースオーバーレイのためのハイブリッドオーバーレイ標的設計

Country Status (8)

Country Link
US (1) US11112369B2 (enExample)
EP (1) EP3635488A4 (enExample)
JP (1) JP7018970B2 (enExample)
KR (1) KR102353260B1 (enExample)
CN (1) CN110770654B (enExample)
SG (1) SG11201911992TA (enExample)
TW (1) TWI752237B (enExample)
WO (1) WO2018236653A1 (enExample)

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US10795268B2 (en) * 2017-09-29 2020-10-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method and apparatus for measuring overlay errors using overlay measurement patterns
US11809090B2 (en) * 2020-01-30 2023-11-07 Kla Corporation Composite overlay metrology target
US12100574B2 (en) * 2020-07-01 2024-09-24 Kla Corporation Target and algorithm to measure overlay by modeling back scattering electrons on overlapping structures
US11726410B2 (en) * 2021-04-20 2023-08-15 Kla Corporation Multi-resolution overlay metrology targets
US11703767B2 (en) 2021-06-28 2023-07-18 Kla Corporation Overlay mark design for electron beam overlay
US11862524B2 (en) 2021-06-28 2024-01-02 Kla Corporation Overlay mark design for electron beam overlay
US11720031B2 (en) 2021-06-28 2023-08-08 Kla Corporation Overlay design for electron beam and scatterometry overlay measurements
US12044982B2 (en) * 2021-12-02 2024-07-23 Micron Technology, Inc. Apparatuses and methods for diffraction base overlay measurements
US11796925B2 (en) * 2022-01-03 2023-10-24 Kla Corporation Scanning overlay metrology using overlay targets having multiple spatial frequencies
US12094100B2 (en) * 2022-03-03 2024-09-17 Kla Corporation Measurement of stitching error using split targets
US12422363B2 (en) 2022-03-30 2025-09-23 Kla Corporation Scanning scatterometry overlay metrology
US12487190B2 (en) 2022-03-30 2025-12-02 Kla Corporation System and method for isolation of specific fourier pupil frequency in overlay metrology
TWI914562B (zh) 2022-09-22 2026-02-11 聯華電子股份有限公司 疊對圖樣與疊對方法
US20240110780A1 (en) * 2022-09-30 2024-04-04 Kla Corporation Mosaic overlay targets
US12669327B2 (en) 2022-11-23 2026-06-30 Kla Corporation System and method for suppression of tool induced shift in scanning overlay metrology
KR102844370B1 (ko) * 2022-12-07 2025-08-08 (주) 오로스테크놀로지 업샘플링을 이용한 오버레이 측정 방법 및 장치와, 이를 이용한 반도체 소자의 제조 방법
US12235588B2 (en) 2023-02-16 2025-02-25 Kla Corporation Scanning overlay metrology with high signal to noise ratio
US12704790B2 (en) * 2023-04-04 2026-08-11 Kla Corporation System and method for determining overlay measurement of a scanning target

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US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
JP2002231616A (ja) 2001-02-05 2002-08-16 Nikon Corp 位置計測装置及び方法、露光装置及び方法、並びにデバイス製造方法
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US7193715B2 (en) * 2002-11-14 2007-03-20 Tokyo Electron Limited Measurement of overlay using diffraction gratings when overlay exceeds the grating period
US7230703B2 (en) * 2003-07-17 2007-06-12 Tokyo Electron Limited Apparatus and method for measuring overlay by diffraction gratings
US7065737B2 (en) 2004-03-01 2006-06-20 Advanced Micro Devices, Inc Multi-layer overlay measurement and correction technique for IC manufacturing
US20060109463A1 (en) 2004-11-22 2006-05-25 Asml Netherlands B.V. Latent overlay metrology
NL2003588A (en) 2008-12-15 2010-06-16 Asml Holding Nv Reticle inspection systems and method.
US8214771B2 (en) 2009-01-08 2012-07-03 Kla-Tencor Corporation Scatterometry metrology target design optimization
WO2013026598A1 (en) 2011-08-23 2013-02-28 Asml Netherlands B.V. Metrology method and apparatus, and device manufacturing method
US10107621B2 (en) * 2012-02-15 2018-10-23 Nanometrics Incorporated Image based overlay measurement with finite gratings
US9007585B2 (en) * 2012-03-07 2015-04-14 Kla-Tencor Corporation Imaging overlay metrology target and complimentary overlay metrology measurement system
US8913237B2 (en) 2012-06-26 2014-12-16 Kla-Tencor Corporation Device-like scatterometry overlay targets
US9093458B2 (en) * 2012-09-06 2015-07-28 Kla-Tencor Corporation Device correlated metrology (DCM) for OVL with embedded SEM structure overlay targets
WO2014062972A1 (en) * 2012-10-18 2014-04-24 Kla-Tencor Corporation Symmetric target design in scatterometry overlay metrology
US9029810B2 (en) 2013-05-29 2015-05-12 Kla-Tencor Corporation Using wafer geometry to improve scanner correction effectiveness for overlay control
WO2014194095A1 (en) 2013-05-30 2014-12-04 Kla-Tencor Corporation Combined imaging and scatterometry metrology
WO2014205274A1 (en) * 2013-06-19 2014-12-24 Kla-Tencor Corporation Hybrid imaging and scatterometry targets
KR102069253B1 (ko) 2013-07-18 2020-01-22 케이엘에이 코포레이션 스캐터로메트리 측정들을 위한 조명 구성들
CN105900015B (zh) 2013-11-26 2019-07-05 Asml荷兰有限公司 用于光刻度量的方法、设备和衬底
KR101898087B1 (ko) 2013-12-30 2018-09-12 에이에스엠엘 네델란즈 비.브이. 메트롤로지 타겟의 디자인을 위한 장치 및 방법
US9784690B2 (en) * 2014-05-12 2017-10-10 Kla-Tencor Corporation Apparatus, techniques, and target designs for measuring semiconductor parameters
CN113204173B (zh) * 2014-08-28 2024-04-09 Asml荷兰有限公司 检查设备、检查方法和制造方法
US10210606B2 (en) * 2014-10-14 2019-02-19 Kla-Tencor Corporation Signal response metrology for image based and scatterometry overlay measurements
SG11201703585RA (en) * 2014-11-25 2017-06-29 Kla Tencor Corp Analyzing and utilizing landscapes
US20170329231A1 (en) 2014-12-17 2017-11-16 Asml Netherlands B.V Method and apparatus for using patterning device topography induced phase
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry

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