JP2015513813A5 - - Google Patents

Download PDF

Info

Publication number
JP2015513813A5
JP2015513813A5 JP2014555729A JP2014555729A JP2015513813A5 JP 2015513813 A5 JP2015513813 A5 JP 2015513813A5 JP 2014555729 A JP2014555729 A JP 2014555729A JP 2014555729 A JP2014555729 A JP 2014555729A JP 2015513813 A5 JP2015513813 A5 JP 2015513813A5
Authority
JP
Japan
Prior art keywords
module
hdd
analog
hdds
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014555729A
Other languages
English (en)
Japanese (ja)
Other versions
JP6231019B2 (ja
JP2015513813A (ja
Filing date
Publication date
Priority claimed from US13/364,308 external-priority patent/US8754972B2/en
Application filed filed Critical
Publication of JP2015513813A publication Critical patent/JP2015513813A/ja
Publication of JP2015513813A5 publication Critical patent/JP2015513813A5/ja
Application granted granted Critical
Publication of JP6231019B2 publication Critical patent/JP6231019B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014555729A 2012-02-01 2013-02-01 高速画像化のための一体化されたマルチチャネルアナログフロントエンド及びデジタイザ Active JP6231019B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/364,308 US8754972B2 (en) 2012-02-01 2012-02-01 Integrated multi-channel analog front end and digitizer for high speed imaging applications
US13/364,308 2012-02-01
PCT/US2013/024240 WO2013116579A1 (en) 2012-02-01 2013-02-01 Integrated multi-channel analog front end and digitizer for high speed imaging applications

Publications (3)

Publication Number Publication Date
JP2015513813A JP2015513813A (ja) 2015-05-14
JP2015513813A5 true JP2015513813A5 (https=) 2016-03-17
JP6231019B2 JP6231019B2 (ja) 2017-11-15

Family

ID=48869892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014555729A Active JP6231019B2 (ja) 2012-02-01 2013-02-01 高速画像化のための一体化されたマルチチャネルアナログフロントエンド及びデジタイザ

Country Status (7)

Country Link
US (2) US8754972B2 (https=)
EP (1) EP2810244A1 (https=)
JP (1) JP6231019B2 (https=)
CN (1) CN104205160B (https=)
IL (1) IL233867A (https=)
TW (1) TWI562094B (https=)
WO (1) WO2013116579A1 (https=)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793673B2 (en) 2011-06-13 2017-10-17 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US8947521B1 (en) * 2011-08-08 2015-02-03 Kla-Tencor Corporation Method for reducing aliasing in TDI based imaging
US10197501B2 (en) 2011-12-12 2019-02-05 Kla-Tencor Corporation Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
CN102595066B (zh) * 2012-03-05 2013-07-24 天津大学 低功耗数字域累加cmos-tdi图像传感器
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
JP5490330B1 (ja) * 2012-05-24 2014-05-14 オリンパスメディカルシステムズ株式会社 画像データ受信装置及び画像データ伝送システム
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
JP6053398B2 (ja) * 2012-09-03 2016-12-27 キヤノン株式会社 撮像装置の駆動方法、撮像システムの駆動方法、撮像装置、撮像システム
US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
JP6192584B2 (ja) * 2014-04-21 2017-09-06 三菱電機株式会社 撮像装置
US9612993B2 (en) * 2014-06-28 2017-04-04 Intel Corporation Dynamically configurable analog frontend circuitry
US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
CN104219468B (zh) * 2014-09-15 2017-06-20 天津大学 高行频cmos‑tdi图像传感器
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
WO2016161284A1 (en) * 2015-04-03 2016-10-06 Thorlabs, Inc. Simultaneous multi-channel tdi imaging on a multi-tap imager
US9554074B2 (en) * 2015-04-16 2017-01-24 Omnivision Technologies, Inc. Ramp generator for low noise image sensor
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
US9843756B2 (en) 2015-05-27 2017-12-12 Samsung Electronics Co., Ltd. Imaging devices, arrays of pixels receiving photocharges in bulk of select transistor, and methods
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
CN105718850B (zh) * 2015-10-21 2019-06-11 深圳芯启航科技有限公司 应用于指纹传感器的像素点采样方法和装置
US9588240B1 (en) 2015-10-27 2017-03-07 General Electric Company Digital readout architecture for four side buttable digital X-ray detector
US10283557B2 (en) 2015-12-31 2019-05-07 General Electric Company Radiation detector assembly
US10686003B2 (en) 2015-12-31 2020-06-16 General Electric Company Radiation detector assembly
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
CN106027924B (zh) * 2016-05-11 2018-10-23 吉林大学 高性能cmos图像传感器阵列模数转换器的数字校正方法
US10090993B2 (en) * 2016-08-19 2018-10-02 Ali Corporation Packaged circuit
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system
US11237872B2 (en) 2017-05-23 2022-02-01 Kla-Tencor Corporation Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
US10509104B1 (en) * 2018-08-13 2019-12-17 Analog Devices Global Unlimited Company Apparatus and methods for synchronization of radar chips
US11128094B2 (en) * 2018-09-28 2021-09-21 Maxim Integrated Products, Inc. Pin encoded mode selection system
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
US10724964B1 (en) 2019-04-10 2020-07-28 Kla-Tencor Corporation Multi-sensor tiled camera with flexible electronics for wafer inspection
IL282680B2 (en) * 2018-11-15 2025-02-01 Kla Corp Multi-sensor tile camera with flexible electronics for silicon wafer inspection
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
US10820410B2 (en) 2019-03-04 2020-10-27 Quanta Computer Inc. Loop shaped radiation reduction filter for high speed differential signal trace
JP7365823B2 (ja) * 2019-08-23 2023-10-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
US11933717B2 (en) 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
CN111579462B (zh) * 2020-06-20 2024-07-26 中国地震局地质研究所 室内模拟震后断层渗流愈合过程的多物理量测量系统
CN113298690B (zh) * 2021-07-28 2022-07-26 浙江华睿科技股份有限公司 一种图像数据处理方法、装置及电子设备
CN113951849B (zh) * 2021-11-02 2024-02-13 华润微电子控股有限公司 生物信号采集电路及鼠标
CN115459783B (zh) * 2022-09-05 2026-01-16 武汉中旗生物医疗电子有限公司 数据整序系统及方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6178398A (en) * 1997-02-21 1998-09-09 Board Of Regents Of The University And Community College System Of Nevada, The Method and system for computerized high-rate image processing
US6900888B2 (en) 2001-09-13 2005-05-31 Hitachi High-Technologies Corporation Method and apparatus for inspecting a pattern formed on a substrate
JP4022862B2 (ja) * 2002-06-11 2007-12-19 ソニー株式会社 固体撮像装置及びその制御方法
US7408683B2 (en) * 2002-07-15 2008-08-05 Brother Kogyo Kabushiki Kaisha Image sensor for reading image and image reading apparatus including the image sensor
US20040012684A1 (en) * 2002-07-16 2004-01-22 Fairchild Imaging Image reconstruction techniques for charge coupled devices
US6891488B1 (en) * 2003-10-30 2005-05-10 Intel Corporation Sigma-delta conversion with analog, nonvolatile trimmed quantized feedback
JP4311181B2 (ja) 2003-12-05 2009-08-12 ソニー株式会社 半導体装置の制御方法および信号処理方法並びに半導体装置および電子機器
US7952633B2 (en) 2004-11-18 2011-05-31 Kla-Tencor Technologies Corporation Apparatus for continuous clocking of TDI sensors
JP2007149837A (ja) * 2005-11-25 2007-06-14 Tokyo Seimitsu Co Ltd 画像欠陥検査装置、画像欠陥検査システム及び画像欠陥検査方法
JP4888081B2 (ja) * 2006-01-23 2012-02-29 セイコーエプソン株式会社 撮像装置、撮像方法、撮像システム及び画像処理装置
JP2007221453A (ja) * 2006-02-16 2007-08-30 Canon Inc 放射線撮像装置及びその駆動方法
JP2007251463A (ja) * 2006-03-15 2007-09-27 Renesas Technology Corp 半導体集積回路装置
JP4172504B2 (ja) * 2006-06-22 2008-10-29 ソニー株式会社 画像処理装置、撮像装置、および方法
US7817197B2 (en) * 2006-09-21 2010-10-19 Mediatek Singapore Pte Ltd Optical black calibration
DE102007030985B4 (de) 2007-07-04 2009-04-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bildsensor, Verfahren zum Betreiben eines Bildsensors und Computerprogramm
JP2009141401A (ja) * 2007-12-03 2009-06-25 Fujifilm Corp 固体撮像装置
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
US20110019044A1 (en) 2009-07-21 2011-01-27 Weng-Lyang Wang Time Delay Integration Based MOS Photoelectric Pixel Sensing Circuit
US8451354B2 (en) 2010-05-17 2013-05-28 Commissariat A L'energie Atomique Et Aux Energies Alternatives TDI image sensor in CMOS technology with high video capture rate
US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications

Similar Documents

Publication Publication Date Title
JP2015513813A5 (https=)
CN104205160B (zh) 用于高速成像应用的集成式多通道模拟前端和数字化器
JP6004685B2 (ja) 固体撮像装置及びその駆動方法
US20090040352A1 (en) Solid-state image capture device, analog/digital conversion method for solid state image capture device, and image capture device
US20150378954A1 (en) Dynamically configurable analog frontend circuitry
CN107864346B (zh) 无参考时钟的cmos图像传感器、系统和方法
US9083368B2 (en) Image sensor using offset code for counting
JP2012532369A (ja) ノイズを補償するためにクロック信号を調節する技法
KR102261595B1 (ko) 이미지 센서, 및 이를 포함하는 이미지 처리 시스템
US10992894B2 (en) Image sensor, address decoder including clock tree, and image processing system including the image sensor
JP2015111762A5 (https=)
US9424623B2 (en) Image processor
US9635277B2 (en) Image sensor, image sensing method, and image photographing apparatus including image sensor
JP2009033297A (ja) 物理量検知装置およびその駆動方法
US8952314B2 (en) Two-step analog-digital converting circuit and method
CN104023186B (zh) 图像拾取装置及其驱动方法、图像拾取系统及其驱动方法
WO2009028034A1 (ja) 電子デバイスおよび診断装置
TW201720091A (zh) 積體電路以及其串化器/解串化器實體層電路的操作方法
US20210021403A1 (en) Reception device
JP2014017789A (ja) 撮像素子及び撮像装置
JP2012257059A5 (https=)
WO2009087960A1 (ja) データ転送装置およびカメラ
CN104168524A (zh) 数字功放设备的控制电路及其控制方法
CN104394333A (zh) 南极望远镜中ccd驱动的控制系统
WO2017067351A1 (zh) 黑电平的消除方法、系统及具有该系统的图像传感器