IL233867A - Integrated multichannel analog front for high speed imaging applications - Google Patents

Integrated multichannel analog front for high speed imaging applications

Info

Publication number
IL233867A
IL233867A IL233867A IL23386714A IL233867A IL 233867 A IL233867 A IL 233867A IL 233867 A IL233867 A IL 233867A IL 23386714 A IL23386714 A IL 23386714A IL 233867 A IL233867 A IL 233867A
Authority
IL
Israel
Prior art keywords
digitizer
high speed
analog front
imaging applications
integrated multi
Prior art date
Application number
IL233867A
Other languages
English (en)
Hebrew (he)
Other versions
IL233867A0 (en
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of IL233867A0 publication Critical patent/IL233867A0/en
Publication of IL233867A publication Critical patent/IL233867A/en

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/701—Line sensors
    • H04N25/7013—Line sensors using abutted sensors forming a long line
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/711—Time delay and integration [TDI] registers; TDI shift registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/713—Transfer or readout registers; Split readout registers or multiple readout registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
IL233867A 2012-02-01 2014-07-30 Integrated multichannel analog front for high speed imaging applications IL233867A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/364,308 US8754972B2 (en) 2012-02-01 2012-02-01 Integrated multi-channel analog front end and digitizer for high speed imaging applications
PCT/US2013/024240 WO2013116579A1 (en) 2012-02-01 2013-02-01 Integrated multi-channel analog front end and digitizer for high speed imaging applications

Publications (2)

Publication Number Publication Date
IL233867A0 IL233867A0 (en) 2014-09-30
IL233867A true IL233867A (en) 2017-07-31

Family

ID=48869892

Family Applications (1)

Application Number Title Priority Date Filing Date
IL233867A IL233867A (en) 2012-02-01 2014-07-30 Integrated multichannel analog front for high speed imaging applications

Country Status (7)

Country Link
US (2) US8754972B2 (https=)
EP (1) EP2810244A1 (https=)
JP (1) JP6231019B2 (https=)
CN (1) CN104205160B (https=)
IL (1) IL233867A (https=)
TW (1) TWI562094B (https=)
WO (1) WO2013116579A1 (https=)

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US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
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US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
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US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
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US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
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US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
CN104219468B (zh) * 2014-09-15 2017-06-20 天津大学 高行频cmos‑tdi图像传感器
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
WO2016161284A1 (en) * 2015-04-03 2016-10-06 Thorlabs, Inc. Simultaneous multi-channel tdi imaging on a multi-tap imager
US9554074B2 (en) * 2015-04-16 2017-01-24 Omnivision Technologies, Inc. Ramp generator for low noise image sensor
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
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US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
CN105718850B (zh) * 2015-10-21 2019-06-11 深圳芯启航科技有限公司 应用于指纹传感器的像素点采样方法和装置
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US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
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US11237872B2 (en) 2017-05-23 2022-02-01 Kla-Tencor Corporation Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
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IL282680B2 (en) * 2018-11-15 2025-02-01 Kla Corp Multi-sensor tile camera with flexible electronics for silicon wafer inspection
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CN113298690B (zh) * 2021-07-28 2022-07-26 浙江华睿科技股份有限公司 一种图像数据处理方法、装置及电子设备
CN113951849B (zh) * 2021-11-02 2024-02-13 华润微电子控股有限公司 生物信号采集电路及鼠标
CN115459783B (zh) * 2022-09-05 2026-01-16 武汉中旗生物医疗电子有限公司 数据整序系统及方法

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Also Published As

Publication number Publication date
IL233867A0 (en) 2014-09-30
WO2013116579A1 (en) 2013-08-08
JP6231019B2 (ja) 2017-11-15
CN104205160A (zh) 2014-12-10
US9462206B2 (en) 2016-10-04
US8754972B2 (en) 2014-06-17
JP2015513813A (ja) 2015-05-14
TW201337828A (zh) 2013-09-16
EP2810244A1 (en) 2014-12-10
CN104205160B (zh) 2017-07-28
US20140240562A1 (en) 2014-08-28
US20130194445A1 (en) 2013-08-01
TWI562094B (en) 2016-12-11

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