CN104205160B - 用于高速成像应用的集成式多通道模拟前端和数字化器 - Google Patents

用于高速成像应用的集成式多通道模拟前端和数字化器 Download PDF

Info

Publication number
CN104205160B
CN104205160B CN201380014322.5A CN201380014322A CN104205160B CN 104205160 B CN104205160 B CN 104205160B CN 201380014322 A CN201380014322 A CN 201380014322A CN 104205160 B CN104205160 B CN 104205160B
Authority
CN
China
Prior art keywords
hdd
module
analog
signal
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201380014322.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN104205160A (zh
Inventor
戴维·L·布朗
曼苏尔·克尔马特
兰斯·格拉瑟
亨里克·尼尔森
国武·郑
库尔特·雷曼
肯尼斯·哈奇
亚历克斯·庄
芬卡特拉曼·伊艾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Corp
Original Assignee
KLA Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Corp filed Critical KLA Tencor Corp
Publication of CN104205160A publication Critical patent/CN104205160A/zh
Application granted granted Critical
Publication of CN104205160B publication Critical patent/CN104205160B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/701—Line sensors
    • H04N25/7013—Line sensors using abutted sensors forming a long line
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/711—Time delay and integration [TDI] registers; TDI shift registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/713—Transfer or readout registers; Split readout registers or multiple readout registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
CN201380014322.5A 2012-02-01 2013-02-01 用于高速成像应用的集成式多通道模拟前端和数字化器 Active CN104205160B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/364,308 US8754972B2 (en) 2012-02-01 2012-02-01 Integrated multi-channel analog front end and digitizer for high speed imaging applications
US13/364,308 2012-02-01
PCT/US2013/024240 WO2013116579A1 (en) 2012-02-01 2013-02-01 Integrated multi-channel analog front end and digitizer for high speed imaging applications

Publications (2)

Publication Number Publication Date
CN104205160A CN104205160A (zh) 2014-12-10
CN104205160B true CN104205160B (zh) 2017-07-28

Family

ID=48869892

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380014322.5A Active CN104205160B (zh) 2012-02-01 2013-02-01 用于高速成像应用的集成式多通道模拟前端和数字化器

Country Status (7)

Country Link
US (2) US8754972B2 (https=)
EP (1) EP2810244A1 (https=)
JP (1) JP6231019B2 (https=)
CN (1) CN104205160B (https=)
IL (1) IL233867A (https=)
TW (1) TWI562094B (https=)
WO (1) WO2013116579A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704849B (zh) 2019-03-04 2020-09-11 廣達電腦股份有限公司 高速電路及產生低干擾差分跡線的方法

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793673B2 (en) 2011-06-13 2017-10-17 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US8873596B2 (en) 2011-07-22 2014-10-28 Kla-Tencor Corporation Laser with high quality, stable output beam, and long life high conversion efficiency non-linear crystal
US8947521B1 (en) * 2011-08-08 2015-02-03 Kla-Tencor Corporation Method for reducing aliasing in TDI based imaging
US10197501B2 (en) 2011-12-12 2019-02-05 Kla-Tencor Corporation Electron-bombarded charge-coupled device and inspection systems using EBCCD detectors
US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications
CN102595066B (zh) * 2012-03-05 2013-07-24 天津大学 低功耗数字域累加cmos-tdi图像传感器
US9496425B2 (en) 2012-04-10 2016-11-15 Kla-Tencor Corporation Back-illuminated sensor with boron layer
JP5490330B1 (ja) * 2012-05-24 2014-05-14 オリンパスメディカルシステムズ株式会社 画像データ受信装置及び画像データ伝送システム
US9601299B2 (en) 2012-08-03 2017-03-21 Kla-Tencor Corporation Photocathode including silicon substrate with boron layer
JP6053398B2 (ja) * 2012-09-03 2016-12-27 キヤノン株式会社 撮像装置の駆動方法、撮像システムの駆動方法、撮像装置、撮像システム
US9151940B2 (en) 2012-12-05 2015-10-06 Kla-Tencor Corporation Semiconductor inspection and metrology system using laser pulse multiplier
US9426400B2 (en) 2012-12-10 2016-08-23 Kla-Tencor Corporation Method and apparatus for high speed acquisition of moving images using pulsed illumination
US8929406B2 (en) 2013-01-24 2015-01-06 Kla-Tencor Corporation 193NM laser and inspection system
US9529182B2 (en) 2013-02-13 2016-12-27 KLA—Tencor Corporation 193nm laser and inspection system
US9608399B2 (en) 2013-03-18 2017-03-28 Kla-Tencor Corporation 193 nm laser and an inspection system using a 193 nm laser
US9478402B2 (en) 2013-04-01 2016-10-25 Kla-Tencor Corporation Photomultiplier tube, image sensor, and an inspection system using a PMT or image sensor
US9347890B2 (en) 2013-12-19 2016-05-24 Kla-Tencor Corporation Low-noise sensor and an inspection system using a low-noise sensor
US9748294B2 (en) 2014-01-10 2017-08-29 Hamamatsu Photonics K.K. Anti-reflection layer for back-illuminated sensor
US9410901B2 (en) 2014-03-17 2016-08-09 Kla-Tencor Corporation Image sensor, an inspection system and a method of inspecting an article
US9804101B2 (en) 2014-03-20 2017-10-31 Kla-Tencor Corporation System and method for reducing the bandwidth of a laser and an inspection system and method using a laser
JP6192584B2 (ja) * 2014-04-21 2017-09-06 三菱電機株式会社 撮像装置
US9612993B2 (en) * 2014-06-28 2017-04-04 Intel Corporation Dynamically configurable analog frontend circuitry
US9767986B2 (en) 2014-08-29 2017-09-19 Kla-Tencor Corporation Scanning electron microscope and methods of inspecting and reviewing samples
CN104219468B (zh) * 2014-09-15 2017-06-20 天津大学 高行频cmos‑tdi图像传感器
US9419407B2 (en) 2014-09-25 2016-08-16 Kla-Tencor Corporation Laser assembly and inspection system using monolithic bandwidth narrowing apparatus
US9748729B2 (en) 2014-10-03 2017-08-29 Kla-Tencor Corporation 183NM laser and inspection system
WO2016161284A1 (en) * 2015-04-03 2016-10-06 Thorlabs, Inc. Simultaneous multi-channel tdi imaging on a multi-tap imager
US9554074B2 (en) * 2015-04-16 2017-01-24 Omnivision Technologies, Inc. Ramp generator for low noise image sensor
US9860466B2 (en) 2015-05-14 2018-01-02 Kla-Tencor Corporation Sensor with electrically controllable aperture for inspection and metrology systems
US10748730B2 (en) 2015-05-21 2020-08-18 Kla-Tencor Corporation Photocathode including field emitter array on a silicon substrate with boron layer
US9843756B2 (en) 2015-05-27 2017-12-12 Samsung Electronics Co., Ltd. Imaging devices, arrays of pixels receiving photocharges in bulk of select transistor, and methods
US10462391B2 (en) 2015-08-14 2019-10-29 Kla-Tencor Corporation Dark-field inspection using a low-noise sensor
CN105718850B (zh) * 2015-10-21 2019-06-11 深圳芯启航科技有限公司 应用于指纹传感器的像素点采样方法和装置
US9588240B1 (en) 2015-10-27 2017-03-07 General Electric Company Digital readout architecture for four side buttable digital X-ray detector
US10283557B2 (en) 2015-12-31 2019-05-07 General Electric Company Radiation detector assembly
US10686003B2 (en) 2015-12-31 2020-06-16 General Electric Company Radiation detector assembly
US10313622B2 (en) 2016-04-06 2019-06-04 Kla-Tencor Corporation Dual-column-parallel CCD sensor and inspection systems using a sensor
US10778925B2 (en) 2016-04-06 2020-09-15 Kla-Tencor Corporation Multiple column per channel CCD sensor architecture for inspection and metrology
CN106027924B (zh) * 2016-05-11 2018-10-23 吉林大学 高性能cmos图像传感器阵列模数转换器的数字校正方法
US10090993B2 (en) * 2016-08-19 2018-10-02 Ali Corporation Packaged circuit
US10175555B2 (en) 2017-01-03 2019-01-08 KLA—Tencor Corporation 183 nm CW laser and inspection system
US11237872B2 (en) 2017-05-23 2022-02-01 Kla-Tencor Corporation Semiconductor inspection and metrology systems for distributing job among the CPUs or GPUs based on logical image processing boundaries
US10509104B1 (en) * 2018-08-13 2019-12-17 Analog Devices Global Unlimited Company Apparatus and methods for synchronization of radar chips
US11128094B2 (en) * 2018-09-28 2021-09-21 Maxim Integrated Products, Inc. Pin encoded mode selection system
US10943760B2 (en) 2018-10-12 2021-03-09 Kla Corporation Electron gun and electron microscope
US10724964B1 (en) 2019-04-10 2020-07-28 Kla-Tencor Corporation Multi-sensor tiled camera with flexible electronics for wafer inspection
IL282680B2 (en) * 2018-11-15 2025-02-01 Kla Corp Multi-sensor tile camera with flexible electronics for silicon wafer inspection
US11114491B2 (en) 2018-12-12 2021-09-07 Kla Corporation Back-illuminated sensor and a method of manufacturing a sensor
JP7365823B2 (ja) * 2019-08-23 2023-10-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、撮像装置、および、固体撮像素子の制御方法
US11933717B2 (en) 2019-09-27 2024-03-19 Kla Corporation Sensitive optical metrology in scanning and static modes
CN111579462B (zh) * 2020-06-20 2024-07-26 中国地震局地质研究所 室内模拟震后断层渗流愈合过程的多物理量测量系统
CN113298690B (zh) * 2021-07-28 2022-07-26 浙江华睿科技股份有限公司 一种图像数据处理方法、装置及电子设备
CN113951849B (zh) * 2021-11-02 2024-02-13 华润微电子控股有限公司 生物信号采集电路及鼠标
CN115459783B (zh) * 2022-09-05 2026-01-16 武汉中旗生物医疗电子有限公司 数据整序系统及方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050093725A1 (en) * 2003-10-30 2005-05-05 Mcdaniel Bart R. Sigma-delta conversion with analog, nonvolatile trimmed quantized feedback
CN101094322A (zh) * 2006-06-22 2007-12-26 索尼株式会社 图像处理设备、成像设备及其方法
US20100104173A1 (en) * 2001-09-13 2010-04-29 Minoru Yoshida Method And Apparatus For Inspecting A Pattern Formed On A Substrate
CN102256070A (zh) * 2010-05-17 2011-11-23 原子能和代替能源委员会 具有高视频捕获速率的cmos技术中的图像传感器

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU6178398A (en) * 1997-02-21 1998-09-09 Board Of Regents Of The University And Community College System Of Nevada, The Method and system for computerized high-rate image processing
JP4022862B2 (ja) * 2002-06-11 2007-12-19 ソニー株式会社 固体撮像装置及びその制御方法
US7408683B2 (en) * 2002-07-15 2008-08-05 Brother Kogyo Kabushiki Kaisha Image sensor for reading image and image reading apparatus including the image sensor
US20040012684A1 (en) * 2002-07-16 2004-01-22 Fairchild Imaging Image reconstruction techniques for charge coupled devices
JP4311181B2 (ja) 2003-12-05 2009-08-12 ソニー株式会社 半導体装置の制御方法および信号処理方法並びに半導体装置および電子機器
US7952633B2 (en) 2004-11-18 2011-05-31 Kla-Tencor Technologies Corporation Apparatus for continuous clocking of TDI sensors
JP2007149837A (ja) * 2005-11-25 2007-06-14 Tokyo Seimitsu Co Ltd 画像欠陥検査装置、画像欠陥検査システム及び画像欠陥検査方法
JP4888081B2 (ja) * 2006-01-23 2012-02-29 セイコーエプソン株式会社 撮像装置、撮像方法、撮像システム及び画像処理装置
JP2007221453A (ja) * 2006-02-16 2007-08-30 Canon Inc 放射線撮像装置及びその駆動方法
JP2007251463A (ja) * 2006-03-15 2007-09-27 Renesas Technology Corp 半導体集積回路装置
US7817197B2 (en) * 2006-09-21 2010-10-19 Mediatek Singapore Pte Ltd Optical black calibration
DE102007030985B4 (de) 2007-07-04 2009-04-09 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bildsensor, Verfahren zum Betreiben eines Bildsensors und Computerprogramm
JP2009141401A (ja) * 2007-12-03 2009-06-25 Fujifilm Corp 固体撮像装置
US8624971B2 (en) 2009-01-23 2014-01-07 Kla-Tencor Corporation TDI sensor modules with localized driving and signal processing circuitry for high speed inspection
US20110019044A1 (en) 2009-07-21 2011-01-27 Weng-Lyang Wang Time Delay Integration Based MOS Photoelectric Pixel Sensing Circuit
US8754972B2 (en) * 2012-02-01 2014-06-17 Kla-Tencor Corporation Integrated multi-channel analog front end and digitizer for high speed imaging applications

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100104173A1 (en) * 2001-09-13 2010-04-29 Minoru Yoshida Method And Apparatus For Inspecting A Pattern Formed On A Substrate
US20050093725A1 (en) * 2003-10-30 2005-05-05 Mcdaniel Bart R. Sigma-delta conversion with analog, nonvolatile trimmed quantized feedback
CN101094322A (zh) * 2006-06-22 2007-12-26 索尼株式会社 图像处理设备、成像设备及其方法
CN102256070A (zh) * 2010-05-17 2011-11-23 原子能和代替能源委员会 具有高视频捕获速率的cmos技术中的图像传感器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI704849B (zh) 2019-03-04 2020-09-11 廣達電腦股份有限公司 高速電路及產生低干擾差分跡線的方法
US10820410B2 (en) 2019-03-04 2020-10-27 Quanta Computer Inc. Loop shaped radiation reduction filter for high speed differential signal trace

Also Published As

Publication number Publication date
IL233867A0 (en) 2014-09-30
WO2013116579A1 (en) 2013-08-08
IL233867A (en) 2017-07-31
JP6231019B2 (ja) 2017-11-15
CN104205160A (zh) 2014-12-10
US9462206B2 (en) 2016-10-04
US8754972B2 (en) 2014-06-17
JP2015513813A (ja) 2015-05-14
TW201337828A (zh) 2013-09-16
EP2810244A1 (en) 2014-12-10
US20140240562A1 (en) 2014-08-28
US20130194445A1 (en) 2013-08-01
TWI562094B (en) 2016-12-11

Similar Documents

Publication Publication Date Title
CN104205160B (zh) 用于高速成像应用的集成式多通道模拟前端和数字化器
US8598901B2 (en) Photoelectric conversion system
CN1917374B (zh) 模拟/数字转换装置及半导体装置
EP2482462B1 (en) Data processor, solid-state imaging device, imaging device, and electronic apparatus
JP5067011B2 (ja) 固体撮像装置、撮像装置、電子機器
US10051224B2 (en) Dual sample-and-hold circuit with resistive gain
US11647307B2 (en) CMOS optical sensor with a scalable repairing scheme for repair defective readout channels providing a further function of row noise suppression and corresponding row noise suppression method
EP2371122B1 (en) Dithering techniques to reduce mismatch in multi-channel imaging systems
US20130093910A1 (en) Image sensor and image processing apparatus including the same
US11233967B2 (en) AD conversion circuit, imaging device, and endoscope system
US20100265371A1 (en) Image Sensor Circuit
JP4470839B2 (ja) 半導体装置
US20140211061A1 (en) Solid-state image capture device and drive method therefor
JP2024022565A (ja) 比較器を含むアナログ・デジタル変換回路、及びそれを含むイメージセンサ
Van Blerkom et al. A 1Mpixel, 80k fps Global Shutter CMOS Image Sensor for High Speed Imaging
US20100073539A1 (en) Solid-state imaging device
CN115150570A (zh) 基于数字电路的双采样信号处理电路及显示面板检测设备
KR100737915B1 (ko) 이미지 센서 그리고 그것을 위한 테스트 시스템 및 테스트방법
Beuville et al. High-performance low-noise 128-channel readout-integrated circuit for flat-panel x-ray detector systems
Beuville et al. A high performance, low-noise 128-channel readout integrated circuit for instrumentation and X-ray applications
KR20040095990A (ko) 아날로그 디지탈 변환기의 테스트 회로를 구비한 이미지센서
JP4490740B2 (ja) 信号読出装置及び試験装置
CN108512551A (zh) 采样和保持设备
US9462204B2 (en) Analog to digital converter for imaging device
Ali et al. Single-Ended-to-Differential Sampling Technique for Sigma Delta ADCs in X-Ray Detectors

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant