JP2015513211A5 - - Google Patents

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Publication number
JP2015513211A5
JP2015513211A5 JP2014554808A JP2014554808A JP2015513211A5 JP 2015513211 A5 JP2015513211 A5 JP 2015513211A5 JP 2014554808 A JP2014554808 A JP 2014554808A JP 2014554808 A JP2014554808 A JP 2014554808A JP 2015513211 A5 JP2015513211 A5 JP 2015513211A5
Authority
JP
Japan
Prior art keywords
layer
thermoplastic
coating
subbing
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014554808A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015513211A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/022844 external-priority patent/WO2013116071A1/en
Publication of JP2015513211A publication Critical patent/JP2015513211A/ja
Publication of JP2015513211A5 publication Critical patent/JP2015513211A5/ja
Pending legal-status Critical Current

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JP2014554808A 2012-01-30 2013-01-24 一時的な基板支持のための装置、複合積層体、方法、及び材料 Pending JP2015513211A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201261592148P 2012-01-30 2012-01-30
US61/592,148 2012-01-30
US201261616568P 2012-03-28 2012-03-28
US61/616,568 2012-03-28
PCT/US2013/022844 WO2013116071A1 (en) 2012-01-30 2013-01-24 Apparatus, hybrid laminated body, method, and materials for temporary substrate support

Publications (2)

Publication Number Publication Date
JP2015513211A JP2015513211A (ja) 2015-04-30
JP2015513211A5 true JP2015513211A5 (https=) 2016-03-03

Family

ID=48905714

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014554808A Pending JP2015513211A (ja) 2012-01-30 2013-01-24 一時的な基板支持のための装置、複合積層体、方法、及び材料

Country Status (6)

Country Link
US (1) US20150017434A1 (https=)
EP (1) EP2810300A4 (https=)
JP (1) JP2015513211A (https=)
KR (1) KR20140128355A (https=)
TW (1) TW201338104A (https=)
WO (1) WO2013116071A1 (https=)

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ITTO20120854A1 (it) * 2012-09-28 2014-03-29 Stmicroelectronics Malta Ltd Contenitore a montaggio superficiale perfezionato per un dispositivo integrato a semiconduttori, relativo assemblaggio e procedimento di fabbricazione
JP6193813B2 (ja) * 2014-06-10 2017-09-06 信越化学工業株式会社 ウエハ加工用仮接着材料、ウエハ加工体及びこれらを使用する薄型ウエハの製造方法
JP6486735B2 (ja) * 2015-03-17 2019-03-20 東芝メモリ株式会社 半導体製造方法および半導体製造装置
JP2017022213A (ja) * 2015-07-08 2017-01-26 凸版印刷株式会社 プリント配線基板
US11830756B2 (en) * 2020-04-29 2023-11-28 Semiconductor Components Industries, Llc Temporary die support structures and related methods
JP6564301B2 (ja) * 2015-10-26 2019-08-21 東京応化工業株式会社 支持体分離方法
JP6463664B2 (ja) * 2015-11-27 2019-02-06 信越化学工業株式会社 ウエハ加工体及びウエハ加工方法
JP6255500B1 (ja) * 2016-03-09 2017-12-27 技術研究組合次世代３Ｄ積層造形技術総合開発機構 ３次元積層造形システム、３次元積層造形方法、積層造形制御装置およびその制御方法と制御プログラム
WO2018062467A1 (ja) * 2016-09-30 2018-04-05 ボンドテック株式会社 基板接合方法および基板接合装置
WO2019106846A1 (ja) * 2017-12-01 2019-06-06 日立化成株式会社 半導体装置の製造方法、仮固定材用樹脂組成物、及び仮固定材用積層フィルム
KR102680045B1 (ko) * 2019-12-09 2024-06-28 쓰리엠 이노베이티브 프로퍼티즈 컴파니 접착 필름
JP7523932B2 (ja) 2020-03-30 2024-07-29 株式会社ディスコ レーザー加工装置
KR102718468B1 (ko) 2020-07-10 2024-10-16 삼성전자주식회사 반도체 패키지 제조 방법
US11996384B2 (en) 2020-12-15 2024-05-28 Pulseforge, Inc. Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications
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KR20240016994A (ko) 2021-06-03 2024-02-06 도쿄엘렉트론가부시키가이샤 기판 처리 방법
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