JP2015508570A5 - - Google Patents
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- Publication number
- JP2015508570A5 JP2015508570A5 JP2014548288A JP2014548288A JP2015508570A5 JP 2015508570 A5 JP2015508570 A5 JP 2015508570A5 JP 2014548288 A JP2014548288 A JP 2014548288A JP 2014548288 A JP2014548288 A JP 2014548288A JP 2015508570 A5 JP2015508570 A5 JP 2015508570A5
- Authority
- JP
- Japan
- Prior art keywords
- process chamber
- wafer
- rotary chuck
- article
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/336,685 | 2011-12-23 | ||
| US13/336,685 US9548223B2 (en) | 2011-12-23 | 2011-12-23 | Apparatus for treating surfaces of wafer-shaped articles |
| PCT/IB2012/057383 WO2013093759A1 (en) | 2011-12-23 | 2012-12-17 | Apparatus for treating surfaces of wafer-shaped articles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2015508570A JP2015508570A (ja) | 2015-03-19 |
| JP2015508570A5 true JP2015508570A5 (enExample) | 2016-02-12 |
Family
ID=48653163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014548288A Pending JP2015508570A (ja) | 2011-12-23 | 2012-12-17 | ウエハ状物品の表面を処理するための装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9548223B2 (enExample) |
| JP (1) | JP2015508570A (enExample) |
| KR (1) | KR20140110970A (enExample) |
| CN (1) | CN104011847A (enExample) |
| TW (1) | TWI559984B (enExample) |
| WO (1) | WO2013093759A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10269615B2 (en) * | 2011-09-09 | 2019-04-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| JP6001896B2 (ja) * | 2012-03-27 | 2016-10-05 | 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ | 基板洗浄装置およびそれを備えた基板処理装置 |
| US9748120B2 (en) | 2013-07-01 | 2017-08-29 | Lam Research Ag | Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus |
| KR102119690B1 (ko) * | 2013-12-06 | 2020-06-08 | 세메스 주식회사 | 기판 가열 유닛 |
| US10043686B2 (en) * | 2013-12-31 | 2018-08-07 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US10490426B2 (en) * | 2014-08-26 | 2019-11-26 | Lam Research Ag | Method and apparatus for processing wafer-shaped articles |
| US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
| JP6625891B2 (ja) * | 2016-02-10 | 2019-12-25 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
| KR102518220B1 (ko) * | 2016-11-09 | 2023-04-04 | 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. | 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척 |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT389959B (de) | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
| DE59407361D1 (de) | 1993-02-08 | 1999-01-14 | Sez Semiconduct Equip Zubehoer | Träger für scheibenförmige Gegenstände |
| JP2001524259A (ja) * | 1995-07-10 | 2001-11-27 | シーヴィシー、プラダクツ、インク | マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法 |
| US6485531B1 (en) | 1998-09-15 | 2002-11-26 | Levitronix Llc | Process chamber |
| JP3798589B2 (ja) * | 1999-10-13 | 2006-07-19 | 株式会社荏原製作所 | 基板処理方法及び基板処理装置 |
| JP2001351874A (ja) * | 2000-06-09 | 2001-12-21 | Ebara Corp | 基板回転装置 |
| EP1644960B1 (en) * | 2003-06-24 | 2008-12-24 | Sez Ag | Device and method for wet treating disc-like substrates |
| WO2007069433A1 (ja) * | 2005-12-16 | 2007-06-21 | Niigata University | 非接触型回転処理装置 |
| JP4937278B2 (ja) | 2006-03-08 | 2012-05-23 | ラム・リサーチ・アクチエンゲゼルシヤフト | 板状物品の流体処理用装置 |
| CN101326629B (zh) * | 2006-05-30 | 2011-05-25 | 应用材料股份有限公司 | 填充介电质间隙的制程室 |
| US20070277734A1 (en) | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
| TWI421945B (zh) | 2008-11-06 | 2014-01-01 | Applied Materials Inc | 含有微定位系統之快速熱處理腔室與處理基材之方法 |
| US8314371B2 (en) | 2008-11-06 | 2012-11-20 | Applied Materials, Inc. | Rapid thermal processing chamber with micro-positioning system |
| CN102292806B (zh) * | 2008-12-19 | 2014-06-11 | 朗姆研究公司 | 处理盘状制品的设备及操作其的方法 |
| JP5533335B2 (ja) * | 2009-07-22 | 2014-06-25 | 東京エレクトロン株式会社 | 処理装置及びその動作方法 |
-
2011
- 2011-12-23 US US13/336,685 patent/US9548223B2/en active Active
-
2012
- 2012-12-17 WO PCT/IB2012/057383 patent/WO2013093759A1/en not_active Ceased
- 2012-12-17 JP JP2014548288A patent/JP2015508570A/ja active Pending
- 2012-12-17 CN CN201280063592.0A patent/CN104011847A/zh active Pending
- 2012-12-17 KR KR1020147020603A patent/KR20140110970A/ko not_active Ceased
- 2012-12-20 TW TW101148713A patent/TWI559984B/zh active
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