CN104011847A - 用于处理晶片状物品的表面的装置 - Google Patents

用于处理晶片状物品的表面的装置 Download PDF

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Publication number
CN104011847A
CN104011847A CN201280063592.0A CN201280063592A CN104011847A CN 104011847 A CN104011847 A CN 104011847A CN 201280063592 A CN201280063592 A CN 201280063592A CN 104011847 A CN104011847 A CN 104011847A
Authority
CN
China
Prior art keywords
wafer
process chamber
rotary chuck
plate
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280063592.0A
Other languages
English (en)
Chinese (zh)
Inventor
迪特尔·弗兰克
罗伯特·罗加特施尼
安德烈亚斯·格莱斯纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of CN104011847A publication Critical patent/CN104011847A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7608—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
CN201280063592.0A 2011-12-23 2012-12-17 用于处理晶片状物品的表面的装置 Pending CN104011847A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/336,685 US9548223B2 (en) 2011-12-23 2011-12-23 Apparatus for treating surfaces of wafer-shaped articles
US13/336,685 2011-12-23
PCT/IB2012/057383 WO2013093759A1 (en) 2011-12-23 2012-12-17 Apparatus for treating surfaces of wafer-shaped articles

Publications (1)

Publication Number Publication Date
CN104011847A true CN104011847A (zh) 2014-08-27

Family

ID=48653163

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280063592.0A Pending CN104011847A (zh) 2011-12-23 2012-12-17 用于处理晶片状物品的表面的装置

Country Status (6)

Country Link
US (1) US9548223B2 (enExample)
JP (1) JP2015508570A (enExample)
KR (1) KR20140110970A (enExample)
CN (1) CN104011847A (enExample)
TW (1) TWI559984B (enExample)
WO (1) WO2013093759A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109923659A (zh) * 2016-11-09 2019-06-21 东京毅力科创Fsi公司 用于在处理室中处理微电子衬底的磁悬浮且旋转的卡盘

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269615B2 (en) * 2011-09-09 2019-04-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP6001896B2 (ja) * 2012-03-27 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄装置およびそれを備えた基板処理装置
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
KR102119690B1 (ko) * 2013-12-06 2020-06-08 세메스 주식회사 기판 가열 유닛
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US10490426B2 (en) * 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6625891B2 (ja) * 2016-02-10 2019-12-25 株式会社日立ハイテクノロジーズ 真空処理装置
GB201900912D0 (en) * 2019-01-23 2019-03-13 Lam Res Ag Apparatus for processing a wafer, and method of controlling such an apparatus

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101308766A (zh) * 2003-06-24 2008-11-19 Sez股份公司 湿处理盘状基片的部件和方法
CN101395700A (zh) * 2006-03-08 2009-03-25 Sez股份公司 用于流体处理板状物品的装置
CN101454482A (zh) * 2006-05-30 2009-06-10 应用材料股份有限公司 用于填充介电质间隙的处理室
US20100289200A1 (en) * 2005-12-16 2010-11-18 Nigata University Noncontact Rotating Processor
CN102210017A (zh) * 2008-11-06 2011-10-05 应用材料股份有限公司 含有微定位系统的快速热处理腔室
CN102292806A (zh) * 2008-12-19 2011-12-21 朗姆研究公司 处理盘状制品的设备及操作其的方法

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AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
EP0611274B1 (de) 1993-02-08 1998-12-02 SEZ Semiconductor-Equipment Zubehör für die Halbleiterfertigung AG Träger für scheibenförmige Gegenstände
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
JP3798589B2 (ja) * 1999-10-13 2006-07-19 株式会社荏原製作所 基板処理方法及び基板処理装置
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
US20070277734A1 (en) * 2006-05-30 2007-12-06 Applied Materials, Inc. Process chamber for dielectric gapfill
TWI505370B (zh) 2008-11-06 2015-10-21 Applied Materials Inc 含有微定位系統之快速熱處理腔室與處理基材之方法
JP5533335B2 (ja) * 2009-07-22 2014-06-25 東京エレクトロン株式会社 処理装置及びその動作方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101308766A (zh) * 2003-06-24 2008-11-19 Sez股份公司 湿处理盘状基片的部件和方法
US20100289200A1 (en) * 2005-12-16 2010-11-18 Nigata University Noncontact Rotating Processor
CN101395700A (zh) * 2006-03-08 2009-03-25 Sez股份公司 用于流体处理板状物品的装置
CN101454482A (zh) * 2006-05-30 2009-06-10 应用材料股份有限公司 用于填充介电质间隙的处理室
CN102210017A (zh) * 2008-11-06 2011-10-05 应用材料股份有限公司 含有微定位系统的快速热处理腔室
CN102292806A (zh) * 2008-12-19 2011-12-21 朗姆研究公司 处理盘状制品的设备及操作其的方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109923659A (zh) * 2016-11-09 2019-06-21 东京毅力科创Fsi公司 用于在处理室中处理微电子衬底的磁悬浮且旋转的卡盘
CN109923659B (zh) * 2016-11-09 2024-03-12 东京毅力科创Fsi公司 用于在处理室中处理微电子衬底的磁悬浮且旋转的卡盘

Also Published As

Publication number Publication date
JP2015508570A (ja) 2015-03-19
WO2013093759A1 (en) 2013-06-27
US9548223B2 (en) 2017-01-17
TWI559984B (en) 2016-12-01
TW201341059A (zh) 2013-10-16
US20130160260A1 (en) 2013-06-27
KR20140110970A (ko) 2014-09-17

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
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Application publication date: 20140827