TWI559984B - Device and method for treating surfaces of wafer-shaped articles - Google Patents

Device and method for treating surfaces of wafer-shaped articles

Info

Publication number
TWI559984B
TWI559984B TW101148713A TW101148713A TWI559984B TW I559984 B TWI559984 B TW I559984B TW 101148713 A TW101148713 A TW 101148713A TW 101148713 A TW101148713 A TW 101148713A TW I559984 B TWI559984 B TW I559984B
Authority
TW
Taiwan
Prior art keywords
wafer
shaped articles
treating surfaces
treating
articles
Prior art date
Application number
TW101148713A
Other languages
English (en)
Chinese (zh)
Other versions
TW201341059A (zh
Inventor
Dieter Frank
Robert Rogatschnig
Andreas Gleissner
Original Assignee
Lam Res Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Res Ag filed Critical Lam Res Ag
Publication of TW201341059A publication Critical patent/TW201341059A/zh
Application granted granted Critical
Publication of TWI559984B publication Critical patent/TWI559984B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW101148713A 2011-12-23 2012-12-20 Device and method for treating surfaces of wafer-shaped articles TWI559984B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/336,685 US9548223B2 (en) 2011-12-23 2011-12-23 Apparatus for treating surfaces of wafer-shaped articles

Publications (2)

Publication Number Publication Date
TW201341059A TW201341059A (zh) 2013-10-16
TWI559984B true TWI559984B (en) 2016-12-01

Family

ID=48653163

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101148713A TWI559984B (en) 2011-12-23 2012-12-20 Device and method for treating surfaces of wafer-shaped articles

Country Status (6)

Country Link
US (1) US9548223B2 (enExample)
JP (1) JP2015508570A (enExample)
KR (1) KR20140110970A (enExample)
CN (1) CN104011847A (enExample)
TW (1) TWI559984B (enExample)
WO (1) WO2013093759A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269615B2 (en) * 2011-09-09 2019-04-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP6001896B2 (ja) * 2012-03-27 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄装置およびそれを備えた基板処理装置
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
KR102119690B1 (ko) * 2013-12-06 2020-06-08 세메스 주식회사 기판 가열 유닛
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US10490426B2 (en) * 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6625891B2 (ja) * 2016-02-10 2019-12-25 株式会社日立ハイテクノロジーズ 真空処理装置
KR102518220B1 (ko) * 2016-11-09 2023-04-04 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6440320B1 (en) * 1999-10-13 2002-08-27 Ebara Corporation Substrate processing method and apparatus
TW200505599A (en) * 2003-06-24 2005-02-16 Sez Ag Device and method for wet treating disc-like substrates
TW200739800A (en) * 2006-03-08 2007-10-16 Sez Ag Device for fluid treating plate-like articles
TW200807510A (en) * 2006-05-30 2008-02-01 Applied Materials Inc Process chamber for dielectric gapfill
TW201029070A (en) * 2008-11-06 2010-08-01 Applied Materials Inc Rapid thermal processing chamber with micro-positioning system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
DE59407361D1 (de) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
WO2007069433A1 (ja) * 2005-12-16 2007-06-21 Niigata University 非接触型回転処理装置
CN101326629B (zh) * 2006-05-30 2011-05-25 应用材料股份有限公司 填充介电质间隙的制程室
US8314371B2 (en) 2008-11-06 2012-11-20 Applied Materials, Inc. Rapid thermal processing chamber with micro-positioning system
CN102292806B (zh) * 2008-12-19 2014-06-11 朗姆研究公司 处理盘状制品的设备及操作其的方法
JP5533335B2 (ja) * 2009-07-22 2014-06-25 東京エレクトロン株式会社 処理装置及びその動作方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6440320B1 (en) * 1999-10-13 2002-08-27 Ebara Corporation Substrate processing method and apparatus
TW200505599A (en) * 2003-06-24 2005-02-16 Sez Ag Device and method for wet treating disc-like substrates
TW200739800A (en) * 2006-03-08 2007-10-16 Sez Ag Device for fluid treating plate-like articles
TW200807510A (en) * 2006-05-30 2008-02-01 Applied Materials Inc Process chamber for dielectric gapfill
TW201029070A (en) * 2008-11-06 2010-08-01 Applied Materials Inc Rapid thermal processing chamber with micro-positioning system

Also Published As

Publication number Publication date
JP2015508570A (ja) 2015-03-19
US20130160260A1 (en) 2013-06-27
US9548223B2 (en) 2017-01-17
KR20140110970A (ko) 2014-09-17
CN104011847A (zh) 2014-08-27
WO2013093759A1 (en) 2013-06-27
TW201341059A (zh) 2013-10-16

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