TW201029070A - Rapid thermal processing chamber with micro-positioning system - Google Patents

Abstract

Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described. The methods and apparatus include a sensor system that determines the relative orientations of the substrate and the substrate support.

Description

201029070 VI. Description of the Invention: [Technical Field 1 of the Invention] The present invention discloses a method and related apparatus for rapidly heat-treating a substrate. More specifically, an apparatus and method for rapidly heat treating a substrate including a micropositioning system is disclosed. [Prior Art] 积 Integral circuits have evolved into complex devices that can include millions of transistors, valleys, and resistors on a single wafer. The development of wafer design requires faster circuits and higher circuit densities, all of which require increasingly precise manufacturing processes. The rate-determining heat treatment (RTP) typically involves heating from a light-emitting heat source such as a lamp and/or a resistive heating element. In a conventional RTp system, the substrate is heated to a desired temperature, and then the radiant heat source is turned off to cool the substrate. In some systems, gas can be flowed onto the substrate to enhance cooling. However, as process parameters continue to evolve, temperature rise and heating uniformity during RTP require more precise monitoring and control. The common process used to process substrates (also referred to herein as "day and day") is ion implantation. Ion implantation typically subjects the substrate to a heat treatment performed in a rapid thermal processing (Rtp) chamber. The heat treatment provides a distribution of heat: the ring can heat the substrate from room temperature to about (four) to about 14 Torr. In the conventional RTP system, the robot arm is used to transfer the substrate to one of the RTP chambers, which is supported by the robot. Structure. The substrate needs to be placed on the center of the 4 to facilitate uniform heat distribution on the surface of the substrate. However, 4 201029070 When the substrate is transferred to the structure, the 忒 忒 确 确 确 确 确 确 确 确 确 确 确 确 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板 基板For example, the ^ ° robotic arm may not be able to position several consecutive substrates at the same center position on the structure. The difference in substrate positioning can result in a fine distribution of the surface of the substrate, resulting in a decrease in the yield of the substrate. Some rapid thermal processing devices use a substrate support in the form of a "side, but also bad" to support the substrate or wafer. Gu Mingtian's tomb, as the name suggests, the edge ring only along the edge

The substrate is fixed (usually referred to as a wafer) to minimize contact with the substrate. If the wafer is not centered on the edge ring or other wafer support, the unevenness of the overlap on the wafer side will cause unevenness between the side and the side of the wafer (and wafer support). Sex. Robot placement accuracy is limited to ± 7 o'clock. However, for every -0.' 吋' wafer placed off the center of the wafer struts, the temperature difference between the side and the side of rc can be experienced. Therefore, in order to obtain temperature uniformity in the range of ±2 °C, it is necessary to place the wafer on the wafer support so that the wafer and the wafer support are within ±0.002 同轴 coaxial. Accordingly, in the art, there is a need for a device and method for micropositioning or precisely controlling a substrate on a wafer support in a rapid thermal processing chamber. SUMMARY OF THE INVENTION Aspects of the invention include the use of a micropositioning system to coaxially align a substantially flat substrate with a substrate support in a rapid thermal processing chamber. This action 5 201029070 allows for more uniform heating on the substrate during processing. In accordance with one or more embodiments, the wafer may be centered by adjusting the position of one or more of the wafer, substrate slab, or optional maglev rotor such that the wafer is substantially coaxial with the substrate support On the substrate support. The position of the substrate relative to the substrate support can be monitored by the position sensor system. The position sensor system can provide feedback to the positioning mechanism to accurately and reproducibly achieve the same sleeve alignment of the substrate with the substrate support. In an embodiment, the rapid thermal processing apparatus for processing a flat substrate includes a chamber having a heat source and a first substrate support for securing the substrate to the first position in the chamber. A second substrate support located in the second position is used in the chamber to secure the substrate. In one embodiment, the first substrate support secures the substrate at the periphery during the heat treatment. The second substrate support is movable in one direction to position the substrate proximate or remote from the heat source. A sensor for sensing the position of the substrate relative to the second substrate support is in communication with the actuator 以 to change the position of the substrate relative to the position of the second substrate support in the plane of the substrate. As used herein, in the plane of the substrate, refers to a plane that is substantially parallel to the planar surface of the substrate, e.g., in the x-y plane of a Cartesian coordinate system. The sensor can be configured in a variety of ways. A sensor in accordance with one or more embodiments includes a "study detector. The optical detector can include a light source to direct the beam onto the surface of the substrate. The system can also include a detector positioned to monitor the intensity of the light reflected from the substrate by the return bottle. One or both of the detector and the substrate are movable to provide a relative life between the detector and the substrate. In some embodiments, the sensor proceeds to step 201029070. An electronic controller is provided in communication with the detector, wherein the controller generates a plurality of measurements from the reflection detected by the detector, and calculates a position of the reflection on the surface of the substrate, including determining the measurement Which corresponds to the edge of the substrate. In some embodiments, the optical detector detects the position of the substrate relative to the position of the second substrate support by evaluating the projection of the second substrate support on the substrate or the substrate on the second substrate support. The replacement sensor includes a camera, a lighting system, and a visual image analysis system that measures the center of the second substrate support and the substrate. In other embodiments, the sensor evaluates the projection of the substrate support on the substrate or the substrate on the substrate support to detect the position of the substrate relative to the position of the substrate support. In a detailed embodiment, the first substrate support is selected from the group consisting of a robot blade and a lift pin assembly and the second substrate support is an edge ring. In a particular embodiment, the chamber further includes a chamber cover and at least two position sensors. The at least two position sensors are located on the chamber cover. Reflected beams from the at least two sensors can be transmitted via the chamber cover as desired. In some embodiments, the chamber further includes a liquid or gas nozzle positioned adjacent to the substrate to move the substrate in a plurality of directions. In various embodiments, the chamber further includes a plurality of locating rods oriented in the same plane as the substrate, the aligning rods being adapted to contact the edges of the substrate to urge the substrate in a plurality of directions in the plane of the substrate. 7 201029070 Other embodiments include mechanisms adapted to move the substrate in a plurality of directions in the plane of the substrate. In some embodiments, this is performed by a plurality of locating rods oriented in the same plane as the substrate, substrate support or maglev rotor. The locating rod is positioned to contact the edge of the substrate, substrate support or magnetic float. The rods are capable of pushing the substrate in a plurality of directions (e.g., in a plurality of directions that are flat on the plane of the substrate). According to some embodiments, the substrate support is coupled to the maglev rotor. In the detailed embodiment, the magnetic floating rotor can be moved in a plurality of directions parallel to the plane of the substrate. In one or more embodiments, the maglev rotor is lightly coupled to a mechanism comprising a magnetic field generating device. The mechanism that is coupled to the maglev rotor is adapted to form a magnetic field that can be varied to be in a plurality of planes parallel to the plane of the substrate. Move the suspension rotor in the direction. According to some detailed embodiments, the chamber further includes a magnetic field generating device coupled to the maglev rotor. The magnetic field can be varied to move the floating rotor in a plurality of axial directions in the plane of the substrate. • In some detailed implementations, the chamber further includes a system controller for obtaining a position signal from the sensor and transmitting the signal to one or more electromagnets to adjust the second substrate support relative to the substrate The location. In some particular embodiments, the second substrate support comprises an edge ring that includes alignment marks on an inner surface of the substrate support that are aligned with corresponding alignment marks on the substrate. In one or more embodiments, the first substrate support includes a lift pin for transferring the substrate between the loading blade and the second substrate support. The lift pins can be adapted to pass through openings in the substrate support and contact and lift 8 201029070 substrates. In some embodiments, a mechanism adapted to move the lift pins within the substrate support apertures without moving the axial position of the substrate support is incorporated. The apparatus of one or more of the detailed embodiments is capable of accurately and reproducibly positioning the substrate support and the substrate within about ± 〇.0〇5吋 of the coaxial. In a more detailed embodiment, the substrate and substrate support are positioned within about ± 〇〇〇 2 of the coaxial or within about 0.001 同轴 of the coaxial. Another aspect of the invention is directed to a method of processing a substrate. The method includes transferring a substrate into a processing chamber. Transfer the substrate to a set of lift pins. The position of the edge of the substrate is determined. The position of the substrate relative to the substrate support is adjusted such that the substrate is coaxial with the substrate support. Transfer the substrate to the substrate support. At this time, the substrate is acceptable for processing at any time. The order of such steps will vary depending on the particular embodiment used and should not be considered as a strict sequence of procedures. In some embodiments, the relative position of the substrate relative to the substrate support is adjusted prior to transferring the substrate onto the lift pins. In other embodiments, the relative position relative to the substrate support is adjusted after the substrate is transferred to the lift pins. In various embodiments, the relative position of the substrate relative to the substrate support is adjusted by changing the position of the substrate, the position of the edge ring, or the position of the lift pins. One or more embodiments of the present invention are directed to a method of processing a substrate. The flat substrate with the edges is transferred to the intermediate substrate support in the processing chamber. The position of the edge of the substrate is determined. The position of the substrate relative to the second substrate support is adjusted such that the substrate and the second substrate support are in a substantially central orientation. Transferring the substrate to the second substrate support and processing the substrate 201029070 Plate 0 In a detailed embodiment, the substrate is transferred to the processing chamber on the robot blade. The intermediate substrate support can include a lift pin and can adjust the relative position of the substrate relative to the second substrate support prior to transferring the substrate onto the lift pins.

In a detailed embodiment, the relative position of the substrate relative to the second substrate support can be adjusted by changing one or more of the position of the substrate, the position of the second substrate support member, or the position of the intermediate substrate support. In some particular embodiments, the method further includes the steps of: determining a θ adjustment value for placing the substrate on the second substrate via a space between the substrate and the substrate support that emits a reflected beam from one of the sensors Center position of the support. In other detailed embodiments, the 0 adjustment value is determined by measuring the distance between the at least two positions X and γ between the second substrate support and the substrate, and the at least two sensors are used to determine the β adjustment. At least two locations are again the distance of gamma. In one or more embodiments, the position of the second substrate support is adjusted by applying one or more magnetic fields adjacent the substrate support. According to a detailed embodiment, - or a plurality of sensors are coupled to the control system, the control system being in communication with a plurality of magnets adjacent to the substrate support, and the magnetic field is applied in response to the position obtained by the sensor. The disclosure relates to coaxial positioning, but the invention disclosed herein is not limited to coaxial positioning 'and can be used to position the substrate relative to the substrate support at any specified amount of axial position (eg, within the W-face) and Any position that is better specified Μ θ. The geometric center of the substrate is not necessarily the thermal center of the 10 201029070 substrate. In addition, due to the variability of the substrate support, the optimum position (Γ, θ) with optimum heat treatment reproducibility can be determined even if the wafer is not coaxial with the substrate support. Thus, even if the location is not coaxial with the substrate support, embodiments of the present invention can be used to ensure optimal positioning of the wafer. [Embodiment] Before describing several exemplary embodiments of the present invention, it is understood that the invention is not limited to the details of the construction or process steps set forth in the following description. The invention is capable of other embodiments and of various embodiments. The embodiments described below are generally directed to an RTP system including a micropositioning system for axially aligning a substrate to a substrate support in a plane of the substrate. As used herein, rapid thermal processing or RTp refers to the ability to uniformly heat at a rate of about 50 ° C / sec and higher (eg, 1 〇〇 to i 5 〇 ec / sec, and 200 to 400. [ ] / sec) The typical cooling (cooling) rate of the wafer device or process Rtp cavity is in the range of 8 seconds. Some processes performed in the RTP chamber require that the temperature change on the substrate be less than a few degrees Celsius. Thus, the RTP chamber can include a lamp or other suitable heating system and heating system control that can be as high as 100 to 150 ° c/sec and 200 to 400. Heating at a rate of (:/sec) distinguishes between a rapid thermal processing chamber and other types of thermal chambers that do not have a heating system and heating control system capable of rapid heating at such rates. 201029070 In the illustrated embodiment, RTP The chamber may optionally include a substrate support that is adapted to float and rotate within the chamber without any contact with the inner sidewall of the chamber. Referring now to Figure 1, a rapid thermal processing chamber is shown. Exemplary Embodiment The processing chamber 100 includes a substrate support 1〇4, a chamber body 102 having a wall 1〇8 defining an interior volume 12〇, a bottom portion 110, and a top or cover 112. Walls 1〇8 Typically, at least one substrate access port 148 is included to facilitate access of the substrate 140 (a portion of which is shown in the figure). The access port can be coupled to a transfer chamber (not shown) or a load lock chamber (not shown) and The seal can be selectively sealed with a valve (not shown) such as a slit valve that seals the internal volume 12 〇 from the surrounding atmosphere. In one embodiment, the substrate support 1 〇 4 is annular and the chamber 100 A radiant heat source 106 disposed on an inner diameter of the substrate support member 1-4. The radiant heat source 106 typically includes a plurality of lamps. An example of a modifiable rtp cavity to and a usable substrate support member is disclosed in U.S. Patent No. M. It is described in U.S. Patent Application Publication No. 2/5/191,144.

The Rtp chamber 1〇〇 also includes a cooling block 丨8〇 adjacent to, coupled to, or formed in the top 112. Typically, the cooling blocks 18A are spaced apart from the light source heat source 106 and are opposite each other. The cooling block 18A includes one or more coolant passages from the inlet 181 Α and the outlet 18 ι. The cooling block 180 can be made of a process resistive material such as stainless steel, aluminum, polymer or ceramic material. The coolant passage 184 may comprise a spiral pattern, a rectangular pattern, a circular pattern, or a combination thereof, and may, for example, 12 201029070 cast a cooling block 18 from two or more parts and/or manufacture a cooling block 180 and joining the parts, the channel 184 is integrally formed within the cooling block 180. Additionally or alternatively, the coolant channel 184 can be drilled into the cooling block 180. Inlet 181A and outlet 181B may be coupled to a coolant source 1 82 ' by a valve and a suitable tube and the coolant source 连通 82 is in communication with the controller 丨 24 to control the pressure and/or flow of the fluid disposed therein. The fluid can be water, glycol, gas (N2), helium (He), or other fluids used as a heat exchange medium. In the illustrated embodiment, the substrate support 1 4 can be adapted to magnetically suspend and rotate within the internal volume 12 视 as desired. The substrate support member 104 is shown to be rotatable during processing while being vertically raised and lowered 'and can also be raised or lowered without rotation before, during or after processing." This magnetic levitation and/or magnetic rotation can be The generation of particles is prevented or minimized because it lacks or reduces the moving parts necessary to generally raise/lower and/or rotate the substrate support. Cavity 100 also includes a window σ 114 made of a material that is transparent to heat and light of various wavelengths (which may include light in the infrared (IR) spectrum), and photons from radiant heat source 106 can heat substrate 14 via window U4. . In the embodiment, the window i 14 is made of a quartz material, but it is also possible to make other materials transparent to heat and light, such as sapphire. Window D 114 also includes a plurality of lift pins coupled to the upper surface of the meat port i丨4! The lift pin 144 is adapted to selectively contact and support the base & 14 〇 to transfer the substrate into and out of the chamber 1 . Each of the plurality of lift locks 13 201029070 is configured to minimize energy absorption from the radiant heat source 1〇6 and may be made of the same material (such as quartz material) used for the window 114. A plurality of lift pins 144 are positionable and radially spaced from one another to facilitate coupling to an end effector of a transfer robot (not shown). Alternatively, the emulator and/or the robot can move horizontally and vertically to facilitate transfer of the substrate 140. In one embodiment, radiant heat source 106 includes a lamp assembly formed as follows: one of the outer casings includes a plurality of honeycomb tubes 1600 located in a coolant assembly (not shown), the coolant assembly being constrained To the coolant source 丨83. Coolant source 183 can be one or a combination of water, ethylene glycol, nitrogen (n2), and helium (He). The outer casing walls 108, 11() may be made of a copper material or other suitable material' and have suitable coolant passages formed therein for the flow of coolant from the coolant source 183. The coolant cools the outer casing of the chamber 1 以 such that the outer casing is cooler than the substrate 丨4〇. Each tube 丨6〇 can contain reflectors and high-intensity lamp assemblies or IR emitters to form a honeycomb-like tube configuration. This closely packed hexagonal tube configuration provides high power elegance and good space for radiant energy. Resolution. In one embodiment, the radiant heat source 106 provides sufficient radiant energy to heat treat the substrate, e.g., to anneal the layer of germanium disposed on the substrate 140. The radiant heat source 106 can further include an annular region in which the voltage supplied by the controller 124 to the plurality of tubes 160 can be varied to enhance the radial distribution of energy from the tubes 160. Dynamic control of the heated substrate 140 can be effected by one or more temperature sensors ’ 17 'temperature sensor 117 is adapted to measure temperature at substrate 14 〇. In the illustrated embodiment, the stator assembly i 8 can be selectively circumscribed 201029070 to the wall 〇 8 of the chamber body 102 and coupled to one or more actuator assemblies 122 ′ actuator assembly 122 The elevation of the stator assembly 118 is controlled along the exterior of the chamber body 1 〇2. In an embodiment (not shown), the chamber 1 includes three actuators that are radially disposed about the chamber body (eg, approximately 120 degrees around the chamber body 1〇2). Into 122. The stator assembly U8 is magnetically coupled to the substrate support 104 disposed within the interior volume 12 of the chamber body 102. The substrate support 104 can include or include a magnetic portion to act as a transducer to form a magnetic bearing assembly for lifting and/or rotating the substrate support 104. In one embodiment, at least a portion of the substrate support 1 〇 4 is partially enclosed by a slot (not shown) coupled to the fluid source 186. The fluid source 186 may include heat suitable for use as a substrate support member. The exchange medium is water, ethylene glycol, nitrogen (N2), helium (He) or a combination thereof. The stator assembly 118 can also include a housing 190 to enclose various components and assemblies of the stator assembly 118. In one embodiment, the stator assembly 8 includes a drive coil assembly ι 68 stacked on the suspension coil assembly 170. The drive line Φ ring assembly 丨 68 is adapted to rotate and/or raise/lower the substrate support 104 ′ and the suspension coil assembly 170 can be adapted to passively center the substrate support i 〇 4 in the processing chamber 100 Inside. Alternatively, the rotation and centering functions may be performed by a stator having a single coil assembly. The atmosphere control system 164 is also coupled to the internal reservoir 120 of the chamber body 1〇2. Atmospheric control system 164 typically includes a throttle valve and vacuum mercury for controlling chamber pressure. Atmospheric control system 164 may additionally include a source of gas for providing a process or other gas to internal volume 120. Atmospheric control system 164 may also be adapted to deliver process gases for thermal deposition processes, thermal etch processes 15 201029070, and in-situ cleaning chamber components. The chamber 100 also includes a controller i24, which typically includes a central processing unit (CPU) 130, a support circuit 128, and a memory 126. The cpu u〇 can be one of any form of computer processor that can be used in an industrial configuration that can control various actions and sub-processors. The memory 126 or the computer readable medium can be one or more of the readily available memory, such as random access memory (RAM), read only memory (ROM), floppy disk, hard disk, or any other form. The digital storage (local or remote) is typically coupled to the CPU 130. Support circuit ι28 is coupled to CpiJ 13〇 for supporting controller 124 in a conventional manner. These circuits include cache memory, power supplies, clock circuits, input/output circuits, subsystems, and the like. In one embodiment, each of the actuator assemblies 122 generally includes a precision guide bolt 132 coupled between two flanges ι 34 extending from the wall 1〇8 of the chamber body 1〇2. The guide bolt 132 has a nut 158 that travels axially along the guide screw 132 as the bolt rotates. The coupler 136 is coupled between the stator 118 and the nut 158 such that the recloser 136 moves along the guide bolt 132 as the guide bolt 132 rotates to control the elevation of the stator 118 at the interface with the coupler 136. Thus, when the guide bolt 132 of one of the actuators 122 is rotated to produce a relative displacement between the solenoids 158 of the other actuators 122, the horizontal plane of the stator 118 will be relative to the central axis of the chamber body 102. And change. In one embodiment, a 'motor 138 (such as a stepper or servo motor) is coupled to the guide screw 132 to provide controllable rotation in response to signals from the controller 124. Alternatively, the stator can be controlled by other types of actuators 22 118 16 201029070 Linear position 'such as pneumatic cylinder linear actuators and cam follower hydraulic cylinders, ball bolts, solenoids, 'and others. In embodiments including the optional stator assembly 118, the chamber 1〇〇 may also include one or more sensors 116 that are typically adapted to detect substrate supports within the interior volume 120 of the chamber body m The 感 感 116 of the 〇 4 (or substrate (10)) can be coupled to the chamber body and/or other sub-portions of the processing chamber 1 且 and adapted to provide the indicator substrate support (10) and the chamber body 102 The output of the distance between the top 112 and/or the bottom 11〇 can also detect misalignment of the substrate support 1〇4 and/or the substrate 14〇.

One or more sensors 116 are coupled to a controller 124 that receives an output metric from the sensor 116 and provides a signal or signals to one or more actuator assemblies 122 to rise Or reducing at least a portion of the substrate support 104. The controller 124 can utilize the position metric obtained from the sensor ι 6 to adjust the return stroke of the stator ι 8 at each actuator assembly 122 such that it can be adjusted relative to the central axis of the RTP chamber 100 and/or the radiant heat source 106. The elevation and flatness of the substrate support 104 and the substrate 14 固定 fixed thereto. For example, the controller 124 can provide a plurality of signals to raise the substrate support by action of an actuator 22 to correct axial misalignment of the substrate support 104, or the controller can send a signal All actuators 122 are provided for simultaneous vertical movement of the substrate support 104. The one or more sensors 116 can be ultrasonic, laser, inductive, electrical 17 201029070 sensors capable of detecting the proximity of the substrate support 104 within the chamber body 102. The sensor 116 can be coupled to or coupled to the chamber main 112, however the chamber body capacitive or other type of body 102 is adjacent to and within the top 1〇2, and its position can also be adapted , such as being coupled to the chamber 100

External stator 118. In one embodiment, one or more of the sensors 116 can be coupled to the stator a 8 and the second is adapted to sense the elevation and/or position of the substrate supporting the bull (or substrate 140) through the wall 108. In this embodiment, the wall 8 can include a thinner cross section for the positional sensing through the wall.

The cavity to 100 also includes - or a plurality of temperature sensors 117 that can be adapted to sense the temperature of the substrate 14A before, during, and after processing. In the embodiment depicted in Figure 1, the temperature sensor i 7 passes through the top portion 112, although other locations within and around the chamber body 102 can also be used. The temperature m 117 can be an optical pyrometer, such as a thermometer with a fiber optic probe. The sensor 117 can be adapted to couple to the top 112 in a configuration that senses the entire diameter of the substrate or a portion of the substrate. The sensor 117 can include a sensing region that is substantially equal to the diameter of the substrate, or a pattern of sensing regions that are substantially equal to the radius of the substrate. For example, a plurality of sensors 117 can be coupled to the top portion 112 in a radial or linear configuration to achieve a sensing region that covers the radius or diameter of the substrate. In an embodiment (not shown) a plurality of sensors 117 may be disposed on a line extending radially from the center of the top 112 to a peripheral portion of the top portion 112. In this manner, the radius of the substrate can be monitored by the sensor 117, which will be able to sense the diameter of the substrate during rotation. As described herein, the chamber 100 is adapted to receive a substrate that is oriented upwards toward 201029070, with the deposit receiving side or face side of the substrate facing the top portion 112 and the "back side" of the substrate facing the radiant heat source 1-6. The "face up" orientation allows the energy from the radiant heat source 106 to be absorbed more quickly by the substrate 14 because of the processing involved (i.e., Ni coating), the back side of the substrate sometimes being larger than the front side of the substrate. Low reflectivity. Typically, the unpatterned "face up" orientation presents a more evenly absorbed surface to the radiation source. Although the cooling block 180 and the radiant heat source 1 〇 6 are described as being positioned in the upper and lower portions of the inner volume 120, respectively, the position of the cooling block 180 and the radiant heat source 1 〇 6 can be reversed. For example, the cooling block 180 can be sized and configured to be positioned within the inner diameter of the substrate support 1〇4, and the radiant heat source 106 can be coupled to the top. In this configuration, the quartz window 114 can be placed in radiant heat Between the source 1〇6 and the substrate baffle 104 is a light-emitting heat source 106 such as adjacent to the upper portion of the chamber 1. Although the substrate 14 can more easily absorb heat and indeed absorb the radiant energy more evenly when the back side faces the radiant heat source 1 基板, the substrate 140 can be oriented face up or facing in either configuration. Orientation. According to one or more embodiments, the position of the substrate relative to the substrate support 4 is achieved by detecting the position of the substrate using the position sensor system 22. The position sensor system 220 is used by, for example, The edge of the flat substrate of the Da Zhao is detected to sense the position of the substrate relative to the second substrate support. The edge of the substrate can be measured in a variety of ways. The examples discussed below are not intended to limit the scope of the invention. Other substrate position sensing The 201029070 system 220 is within the scope of the present invention. For example, a particular substrate position sensor system can utilize ultrasonic, laser, inductive, capacitive, or other types of sensors that are capable of detecting the position of the substrate relative to the substrate support. Exemplary substrate position sensor system 220 in U.S. Patent

No. 7,153,185 (the "185 patent") is described in detail. An example of a substrate position detection or sensor system 22 is shown in Section 2A. Light source 225 is used to direct beam 227 onto the surface of substrate 200, which is reflected as a reflected beam 229. The detector 23 1 is positioned to monitor the intensity of the beam 229 reflected from the substrate 2 . One or both of the detector 23 and the substrate 2 can be moved to provide relative motion between the detector 23 and the substrate 2A. The sensor system 220 can further include an electronic controller 235 in communication with the detector, wherein the controller 235 is operable to generate a plurality of measurements from the reflections detected by the detector 23 1 . Electronic controller 235 can include or be coupled to a general purpose programmable digital computer that receives signals from an optical sensor system. The measurement can then be correlated to the radial position by using the substrate plane of the Cartesian x_y coordinate system. The electronic controller 235 can calculate the position at which the reflection occurs on the surface of the substrate by algorithm and/or experimentally determined measurements. Based on the nature of the reflection from the substrate surface, the controller can determine which measurement corresponds to the edge of the substrate. This can be determined by detecting weak reflections from the substrate or no reflection at all. Although the sensor system 220 is shown positioned below the substrate, it will be appreciated that the assembly can advantageously be positioned above the substrate so as not to interfere with the radiation delivered by the lamp 20 201029070 or other heating elements used to heat the substrate. Additionally, the components of sensor system 220 should be positioned to avoid interference with the light pipe and temperature sensing system that can include a thermometer. Particular embodiments of system 220 can include one or more of the following features. Light beam 227 can have a spot size of less than about one millimeter on the surface of the substrate. The system can further include beam focusing optics including refractive optical elements (eg, lenses), reflective optical elements (eg, mirrors), diffractive optical elements (eg, gratings), and/or holographic optical elements (eg, holographic gratings) ). The apparatus can further include a collimating optic positioned to collimate light reflected from the surface of the substrate before the reflected light is detected by the detector. In another embodiment of the optical detector system, as shown in FIG. 2B, the optical detection system can include a light source and detector 252 and is configured to evaluate the second substrate support on the substrate or the substrate Projection on the second substrate support to detect the position of the substrate relative to the position of the second substrate support. In the embodiment shown in Fig. 2B, it is apparent that the detector 252 is positioned to extract the projection of the substrate support (edge ring) 206 on the substrate 200. It should be understood that the light source 250 and the detector 252 can be positioned above the substrate 200 and the substrate support 206 to detect the projection of the substrate 200 on the substrate support 206. In another variation of the optical detection system, a light source or other suitable illumination system 250 can cooperate with the detector 252, which can be a camera and in communication with the visual analysis system 254. A visual analysis system 254, which may include experimental data and/or look-up tables and includes a general purpose computer, may be used to detect the substrate support 2〇6 21 201029070 and the center of the substrate 200. Each of the optical systems described above or any other suitable method for detecting or sensing the relative position of the substrate and the wafer slab can be used in a substrate support and substrate One or both systems are used in combination. Exemplary embodiments of such systems are described further below.

I The individual components of the position sensor system 220 described above can be mounted in the top of the processing chamber or in the cover 112. The sensor assembly can be positioned at different locations along the X and Y axes of the chamber to assist in detecting the center position of the wafer. Alternatively, components of sensor system 220 can be placed in the sidewalls of the processing chamber. Figures 3A and 3B also show an embodiment of a positioning mechanism. In Figure 3A, the substrate 200 is loaded into the chamber on the loading blade 202 (also referred to as the robot blade 2〇2). A plurality of lift pins 2〇4 can protrude through the reflector 214 and lift the substrate 2〇〇 away from the loading blade. The method of accomplishing is: by positioning the lift pin on the outer periphery of the reflector 214 and minimizing the flat area of the robot blade 202 such that the edge of the substrate 2 (10) is suspended beyond at least a portion of the robot blade 202 to allow the lift pin The outer peripheral edge of the substrate is contacted to lift the substrate away from the robot blade iron. Thus, the robot blade 202 can extend between the lift locks 204 in an extended state, thereby enabling the robot blade 2〇2 to be retracted after the pinned lifted substrate 200 has been removed from the robot blade. In another variation, the robot blade 2G2 may have a slot or slit (not shown) at a pre-position aligned with the position of the lift pin to lift the substrate away from the robot 22 201029070 blade. A suitable method for achieving a lift-off of a substrate from a robot blade can be found in U.S. Patent Nos. 6,722,834 and 6,709,218. The holes in the reflector 214 are enlarged to allow the pin to move both in the direction perpendicular to the substrate support in the form of the edge ring 2〇6 (shown by arrow 212) and in the same χγ plane 21〇 as the edge ring 206. . The loading blade 2〇2 can then be extracted from the chamber. The substrate position sensor system can determine the particular adjustments necessary to move the substrate 200 position to a preselected position, which can be determined experimentally in advance. The preselected orientation is an orientation that centers the substrate 2 〇〇 relative to the center of the chamber, which can be determined by the relative position of the substrate to the substrate support 206 in the χ γ plane. Typically, substrate 200 should be centered in the chamber if substrate 2 and substrate support 206 are in a centered orientation while substrate support 2〇6 is centered relative to the cavity to the center. The lift lock 204 can then be moved within the enlarged aperture 208 in the reflector 214 until the base plate 200 is coaxial with the edge ring 206. Once the substrate 200 is in the desired position, the lift pins 204 can be retracted to lower the substrate 2 to the edge ring 206' as shown in FIG. Although sometimes may be required, there is no need to drill or dig the hole into the edge ring 206 when the lift pin 204 does not intersect the edge ring 206. Alternatively, the lift pin 214 can be secured in the reflector 214. The reflector can then move within the same plane 210 as the edge ring 206 and perpendicularly 212 to the edge ring 206. This allows the substrate 200 to be positioned on the edge ring 206. Figure 3C shows a cross-sectional view of the edge ring 206 and the reflector 214. As can be seen, the aperture 208 in the reflector 214 is larger than the diameter of the lift pin 204. 23 201029070 This action allows the lift pin 204 to move in three dimensions to adjust the position of the substrate.

Figure 4 shows an exemplary embodiment of a chamber that does not utilize a positioning mechanism. The substrate 3〇2 is loaded into the chamber 3〇〇 via the opening 32〇 on the loading blade 318 and the loading blade 318 of the branch substrate 3 2 remains in the chamber until the optimum position as described below is obtained. The substrate position sensor system 3〇4 (such as the type described above) can determine whether it is necessary to adjust the position of the substrate 3〇2 relative to the second substrate support 3〇6, wherein the second substrate support 306 is illustrated as The edge ring of the substrate is supported at the edge of the substrate 3〇2. The position of the substrate 3G2 relative to the substrate support 3G6 can be adjusted using a computer or other suitable processor in communication with the substrate sensor positioning system 3〇4 and in communication with the positioning mechanism. Adjustment of the edge ring 3 〇 6 can be performed by applying a yaw force using a radial positioning mechanism that includes a pusher 31 推动 that pushes or moves the edge ring 306 in a desired radial direction. Alternatively, the pusher 31 施加 applies an orientation force to the maglev rotor 3 (10) to move the substrate support 3 in a desired direction. Once the substrate support 3〇6 is positioned coaxially with the substrate 302, the lift pin 312 lifts the substrate 302 from the loading blade. . After the loading blade is removed, the lift pin 312 can then lower the substrate 302 to the substrate support 3〇6, resulting in a coaxially aligned substrate support 306 and substrate 302. The edge ring or the magnetic floating rotor can be moved by applying a directional force in various other ways. Non-limiting examples of radial positioning mechanisms include a series of pusher ring 306 or a locating bar 31 of rotor 308; a gas or liquid nozzle that pushes the edge ring or rotor; or a magnetic field is applied using stator 316 to cause edge ring 306 or rotor 308 to move . Any suitable pusher mechanism, 24 201029070 A pusher mechanism such as a bolt start, hydraulic start or pneumatic start can be used to drive the positioning rod 310. In another embodiment, as shown in FIG. 5, the substrate 402 is loaded into the chamber 400 on the loading blade 4〇4. Substrate position sensor system 406 (such as the type described above) can determine the adjustments necessary for coaxial positioning substrate 4〇2 and edge ring 408. The loading blade 4〇4 can be moved by the pushing mechanism 410 or the motor 412 to position the substrate 4〇2, which is in communication with the substrate position sensor system 406 via a processor or computer. The lift pin 414 lifts the substrate 4〇2 from the loading blade 404. After the loading blade 404 is removed, the lift pin 414 is lowered to lower the substrate 402 onto the edge ring 408 in a coaxial relationship. In yet another embodiment, as shown in Fig. 6, the substrate 502 is brought into the chamber 5 00 on the loading blade 5〇4. The substrate position sensor system 506 of the type described above determines the adjustments necessary to place the substrate 5〇2 and the edge ring 508 in a coaxial relationship. The substrate position sensor system is in communication with a processor or computer and a positioning mechanism. Next, when the substrate 5〇2 is on the loading blade 504, the substrate 502 is moved using a positioning mechanism selected from one or more of a motor-driven positioning rod, a hydraulic or pneumatic positioning rod, a liquid or gas nozzle, or other similar member 51. Push in place. These positioning mechanisms can even be located on the blade itself. Once aligned, the lift pin 512 lifts the substrate 502 away from the loading blade 504. The loading vanes 504 are retracted and the lift pins 512 lower the substrate 502 to the edge ring 508 in a coaxial relationship. In another embodiment, as shown in FIG. 7, the substrate 600 can be coaxially aligned with the edge ring 602 when the substrate 6 is hung on the lift pins 604. In 25 201029070, in these embodiments, the substrate 600' can be pushed from the side by any suitable member by red y A a θ including (but not limited to, ') motor-driven positioning rod 606, hydraulic or pneumatic drive clamp # And / or the pressure of the gas or liquid nozzle through the mouth. Once aligned, the lift lock 604 is retracted to lower the substrate 600 to the edge ring 602 in a coaxial alignment. In the eighth and eighth figures, the other embodiment A is not allowed by the solid armor, and the substrate 7 is allowed to be placed after the substrate 700 has been placed on the edge and the edge ring 702. The edge ring 702 is coaxially aligned. 1 M y λ + This alignment is achieved by any suitable means including, but not limited to, motor tilting of the positioning rod 704, hydraulic or pneumatic drive of the positioning rod or press of a gas or liquid nozzle through the nozzle 7〇6. Once coaxially aligned with the edge ring 702, the substrate 7 is ready for processing. The device of a plurality of detailed embodiments is capable of accurately and reproducibly positioning the edge ring and the substrate within about ±G(9)5 _ of the coaxial. In a more detailed embodiment, the substrate and edge ring are positioned within about ±0 002 同轴 of the coaxial or within the same ± 〇·〇〇1 leaf. • Accordingly, one or more embodiments of the present invention are directed to a rapid thermal processing apparatus for processing substrates. The apparatus includes a chamber including a heat source, the apparatus including a first substrate support member for securing a substrate of the chamber t to the first position, and a substrate for use in the form of a lift pin or robot blade A second substrate support (eg, an edge ring) that is secured to the second location. The second substrate support (in particular embodiments comprising - the edge ring supporting the substrate at the edge of the substrate) is adapted to secure the substrate ' during heat treatment and is movable in one direction to place the substrate near or away from the heat source. Also included is a sensor system 26 for sensing the axial position of the substrate. 201029070 The sensor system is in communication with an actuator that is operable to cause an axis of the substrate relative to the second substrate support The axial position of the device is changed. The first substrate member can function as and can be referred to as a temporary substrate branch. Figure 9A is a top plan view of one embodiment of a substrate support member 9''. Fig. 9B is a cross section of the substrate support member 9GG. The substrate support 900 is formed of an assembly including a plurality of φ pieces including an edge ring 91 〇, a support 920, and a support cylinder 930. The edge ring 910 has an annular shape for facilitating the placement of the substrate 902. As shown in FIG. 9B, the edge ring 91A includes an outer surface 912 and an inner surface 914 that is parallel to the outer surface 912 and recessed from the outer surface 912. The outer surface 912 is thereby located at a higher level than the inner surface 914, and the inner surface 914 has an outer boundary separated by the side walls 91 5 . The side walls 9丨5 may be slightly above the thickness of the substrate 902 to facilitate placement on the inner surface 914. The edge ring 910 can also include a flange 916 that extends downwardly from the outer surface 912. A gap 918 is defined between the outer flange 916 and the side wall 915 to facilitate assembly of the edge ring 910 onto the support ring 920. In an embodiment, the edge ring 910 can be simply disposed on the support ring 920 without the need for attachment members for easy removal and replacement. In a detailed embodiment, the second substrate support can be a thin solid recessed disk. The branch ring 920 includes a thin flat section with an upwardly extending inner flange 922 and a downwardly extending outer flange 924. The upwardly extending inner flange 922 is coupled to the outer flange 916 of the edge ring 910. The flange 924 is coupled to the support cylinder 930 outside of the downward extension. The support cylinder 93〇 will be vertically supported and supplied to the branch ring 920. As shown in Figure 9A, the bottom 932 of the support cylinder 930 27 201029070 can include an erroneous tooth profile that allows air to flow into the support cylinder 93. An alternative embodiment of the edge ring 91() is illustrated in Figure 9C. In this embodiment, inner surface 914 may also include alignment marks 919 that may serve as a reference to facilitate alignment with corresponding alignment marks 9() 4 on substrate 902. In the embodiment, the alignment mark 919 on the inner surface 914 may be formed to protrude and the alignment mark 9〇4 on the rim of the substrate 9〇2 may be a groove. The proper alignment and orientation of the substrate 9G2 on the edge ring 910 can thereby prevent uneven heat distribution due to light leakage and improve heat transfer. As shown in the top view of FIG. 10A and the side view of the first diagram, the position sensing S ΗΠ 4 and 1016 can also be used to break the substrate 1 〇〇 2 relative to the processing chamber to the substrate support 1 〇〇 4 in the 1001. The edge ring is properly centered. In one embodiment, position sensors 1014 and 1016 can be placed over substrate support 1004, such as position sensors 1 〇 14 and 1016 mounted adjacent the chamber cover. The position sensors 1014 and 1016 can include an ultrasonic sensor, an optical sensor, an inductive sensor, and a capacitive sensing capable of detecting the distance between the edge 1006 of the substrate 1002 and the sidewall 1005 of the edge ring 1003. Or other type of position sensor. In another embodiment, the position sensors 1〇14 and 1〇16 can emit light to detect any improper centering of the substrate 1002 relative to the edge ring 1〇〇3. As shown in Fig. 10B, the substrate 1002 can be placed on the edge ring 1003 by lowering the support pins 1?. In order to provide uniform heat treatment on the substrate surface for the substrate 1002, the substrate 1002 can be positioned on the center of the edge ring 1003. The edge ring 1003 can be adjusted to interface with the substrate 1002 by moving the substrate support 28 201029070 1004 ' in the direction of the sense and gamma axes. In order to find the center position of the edge ring 1 003 for the substrate 1 002 to be positioned, the position sensors 1014 and 1016 can be positioned at different positions to help detect the center position. In one embodiment, the position sensor 1〇14 can be mounted on the chamber cover 1015 and is located between a side edge 1〇〇6 of the substrate 1〇〇2 and a side wall 1〇〇5 of the edge ring 1003. The spot is as shown in Figure 1B. In each spot is the distance 1008 between the edge 1006 of the substrate 1002 and the side wall 1005 of the edge ring 1〇〇3. Each spot may correspond to an axis and a distance associated with the particular axis. For example, the spot of position sensor 1 可 14 may correspond to the X axis and the spot of position sensor 1016 may correspond to the γ axis. Each spot may contain a distance 1008 that may be measured by position sensors 1〇14 and 1〇16. In one embodiment, position sensors 1〇14 and 1〇16 can emit light beam 1011 to detect the distance 丨008 within the spot. In another embodiment, the reflected beam 1011 can be a dot or a line. In still another embodiment, the spot size of the dot or line may be no less than 4.5 mm. In still another embodiment, the reflected beam 1011 that can be emitted is in the range of about 25-50 mm. The distance 1 〇〇 8 measured at each spot can be compared to find a θ adjustment value. In an embodiment, the accuracy of the measured distance may have an accuracy in the range of about ± J 〇 μπι or higher. The θ adjustment value includes an adjustable distance of the X-axis and an adjustable distance of the Υ-axis. The adjustable distance is the adjustment required to move the edge ring 3 to the center of the X and Y axes. After the θ adjustment value has been obtained, the edge ring 1003 can then be adjusted to move it to the proper position. The signal can then be sent to the robotic arm to pick up the substrate 1002 from the support pin 1007 and transfer the substrate 1002 to the appropriate 29 201029070 position on the substrate support 1004 for heat treatment. In one embodiment, the distance from the substrate to the edge ring has a range of from about 0 to about 4.342 _. In a particular embodiment the distance from the substrate to the edge ring is about 2.171 mm. In a detailed embodiment, the Θ adjustment value is associated with the associated adjustment information of the 2 positions that can be adjusted by the vertical motion. Figure 10C is a top plan view of a substrate support 1052 in a processing chamber in accordance with another embodiment of the present invention. Alternatively, the distance 10 〇 8 between the edge ring 10% and the substrate 1 54 can also be measured by placing the sensor at the inner side wall of the processing chamber 1〇5〇. In an embodiment, the first light emitter 1 068 can be coupled to one side of the inner sidewall, and the first light receiver 1070 can be lightly coupled to the adjacent sidewall of the sidewall where the first light emitter 1 〇 68 is located. The distance corresponding to the X axis is measured as 1〇58. The second light emitter 1072 can be coupled to another inner sidewall, and the second light receiver 1 74 can be coupled to an adjacent sidewall of the inner sidewall of the second light emitter 1072 to measure the distance corresponding to the Y axis 1 〇 59. The distance between 1 〇 58 and 1 〇 59 • The light beam 1076 transmitted through the light pipe 1 〇 78 by the light emitters 1068 and 1072 can be measured. The beam 1076 can pass through the distances 1058 and 1059 between the edge ring 1 〇 56 and the substrate 1 〇 54 and can be received by the light receivers 1 〇 7 〇 and 1 〇 74. After the distances 1058 and 1〇59 have been obtained and sent back to the system controller 1124, the Θ adjustment value can now be calculated and then the edge ring 1003 can be adjusted according to the θ adjustment value, ie in the direction of the 丫 axis and then moved to The center position at which the substrate can be positioned. Figure 11 shows a simplified isometric view of a detailed embodiment of a rapid thermal processing chamber 1100. Processing chamber 1100 includes the components depicted in Figure 1, 30 201029070 and the equivalent component symbols are identical. The chamber U〇〇 includes one or more sensors 116' that are typically located outside of the chamber and adapted to detect substrate support 1<or substrate within the interior volume 120 of the chamber body 102 140) elevation. The sensor 116 can be coupled to the chamber body 102 and/or other portions of the processing chamber 1100 via a tubular jaw as shown, and adapted to provide an indication substrate support 1〇4 and chamber body 1〇2 The output of the distance between the top 112 and/or the bottom 11〇 can also be used to track the misalignment of the substrate support member 104 and/or the substrate 140. In another embodiment (not shown), the sensor 116 can be placed inside the stator housing 119'. The stator housing 1190 will allow the sensor 3丨6 to move up and down with the stator J丨8. This embodiment will allow the sensor 丨丨6 to obtain a reference point on the ring segment 192. In this embodiment, the signal will likely be constant and will find signal deviations, and the vertical position can be determined based on feedback from motor 138. One or more sensors 116 may be coupled to controller 124, which receives output metrics from sensor 116 and provides one or more signals to one or more actuator assemblies 122 to liter The substrate support 104 is raised or lowered. The controller 124 can utilize the position metric obtained from the sensor 116 to adjust the elevation of the stator 118 at each actuator assembly 122 such that the substrate support 104 and the elevation and flatness of the substrate 14 固定 affixed thereto Both can be adjusted relative to the central axis of the chamber 100 and/or the radiant heat source 〇6. For example, the controller 124 can provide a plurality of signals to raise the substrate slab by the action of the actuator 122 to correct axial misalignment of the substrate support 104, or the controller can provide a signal 31 201029070 to all actuators 122 so that the substrate support 1〇4 is simultaneously moved vertically. The sensor 116 can be fitted to the wall 1 〇 8'. However, other locations within and around the chamber body 1 〇 2 are also suitable, such as the stator 118 coupled to the outside of the chamber 11 。. In one embodiment, one or more of the sensors 116 can be coupled to the stator 118 and adapted to sense the elevation and/or position of the substrate support ι4 (or substrate 140) through the wall 〇8. In such embodiments, the wall 108 can include a relatively thin cross section for sensing the position through the wall 1〇8.

The substrate support member 104 of Fig. 11 includes an annular body 1191 whose inner diameter is sized to receive the radiant heat source 〇6 and other hardware (not shown). The substrate support 104 at least partially includes a magnetic ring segment 1192 and a support segment Π94. The magnetic ring segment 1192 can at least partially comprise a magnetic material (such as a ferrous material) to facilitate magnetic coupling of the substrate support 104 to the stator. The a ferrous material comprises low carbon steel, non-recorded steel, which can include electrical bonds, such as recording. In an embodiment, the magnetic ring segment 1192 includes a plurality of permanent magnets arranged around the central axis. The magnetic ring segment 1192 may additionally include an outer surface having - or a plurality of channels formed therein. In an embodiment, the magnetic ring segment 1192 includes a contoured profile, such as an "E" shape or a "c" shape in which one or more channels are formed. According to one or more embodiments, it is possible to center the substrate 140 on the edge ring 104 by adjusting the position of the magnetic floating substrate support 1〇4, so the substrate splicing member 1G4 and the lift pin 144 are raised before lifting the substrate 14G. Coaxial on. The centering of the substrate can be achieved using a retrospective system comprising a set of optical sensors 丨16 or a vision system in which η is connected to system control @124. The feedback from the system can be used to perform the placement of the substrate 14 201029070. The stator ι 18 can be used to center the edge ring 104 below the substrate 140 with high precision (e.g., 〇 1 &quot; or higher) and can compensate for shifts up to 〇 1〇&quot;. One or more embodiments of the present invention have a robot (not shown) that carries the substrate 14 into the chamber 1100, in which the substrate 14 is moved. To the lift pin 144_L. The I-plate support H) 4 is centered under the base 14 使用 using a variable magnetic field generated by the stator 118 which changes the position of the substrate support in the chamber. Figure 12 shows a top view of an embodiment of a stator assembly 118 having a removed outer casing. The magnetic field strength of a series of electromagnets 12 连通 in communication with the system controller can be adjusted to form an electromagnetic bias that can push/pull the substrate support within the chamber. At least one electromagnet can be biased to push the substrate support and at least one electromagnet can be biased to pull the substrate support. The substrate support can be properly positioned by adjusting the magnetic field strength of the electromagnet 丨 200 at various locations around the stator 118. A sensor i 202 (which may be a vortex ray detector) in communication with the system controller 124 may be used to detect the position of the substrate support within the chamber, thereby providing feedback in the form of a position signal to the system controller 124. Feedback from such sensors 12A can be evaluated by system controller 124, which in turn can provide a signal to bias one or more of the electromagnets to adjust the position of the substrate support. Figure 12 shows about 12 inches apart. The electromagnet 1200 and the sensor 1202 positioned at the position are merely illustrative and should not be construed as limiting the invention. Any suitable number of sensors and electromagnets can be used. For example, system controller 124 can control six electromagnets using feedback from three sensors 33 201029070. Other embodiments of the invention are directed to methods of processing substrates. The method includes transferring a substrate into a processing chamber. Transferring the substrate to the intermediate substrate support member 'The intermediate substrate reading member can be, for example, a set of lift pins. For example, the position of the substrate is determined by debt measurement or multiple substrate edges. Adjusting the position of the I substrate relative to the substrate support (4) is equivalent to the (4) (four) orientation of the substrate and the substrate support. The substrate position sensing is in communication with a positioning mechanism via a central processing unit (e.g., a general purpose computer) that adjusts the position of the substrate relative to the substrate support. The inverse control system can be used to ensure that the relative position of the substrate to the substrate support is optimized until the substrate is substantially coaxially aligned with the substrate support. The substrate is transferred to a second substrate support, which may be an edge ring. At this point the substrate is ready for processing. The specified relative orientation may be the axial alignment of the substrate with the edge ring, or the alignment of the substrate and edge ring based on an empirically determined position. For example, the empirically determined position of the spring energy is not coaxially aligned with the substrate and the edge ring, but can be aligned with the center of the substrate and the center of the edge ring. The robot blade can be used to transfer the substrate to the processing chamber. . Other methods of introducing the intermediate support members into the plurality of lift pins on the lift pin assembly, introducing the substrate into the cavity, and providing the intermediate support are also within the scope of the present invention. The order of such steps will vary depending on the particular embodiment used and should not be considered a strict sequence of procedures. In some embodiments, the relative position of the substrate relative to the edge ring is adjusted prior to transferring the substrate onto the lift pins. 34 201029070 In other embodiments, the relative position relative to the edge ring is adjusted after the substrate is transferred to the lift pin. In various embodiments, the relative position of the substrate relative to the edge ring is adjusted by changing one or more of the position of the substrate, the position of the edge ring, or the position of the lift pins. The detailed embodiment is directed to a method of positioning a substrate on a suspended substrate support in a concentric manner. The substrate is transferred to the processing chamber and placed on the temporary support member. The position of the substrate relative to the substrate support is measured using a sensor. The position of the substrate support is adjusted to bring the substrate support into alignment with the center of the substrate. The substrate is transferred from the temporary support element to the substrate support. In a particular embodiment, the concentric positioning of the substrate on the support comprises the step of biasing at least one magnet to pull the substrate support or to push the substrate support. Other particular embodiments are directed to a substrate processing apparatus including a chamber, a substrate support, a position sensor, and a system controller. The substrate support is placed in the cavity to the center and includes an annular body configured to support the substrate on its upper surface. The substrate support is magnetically coupled to a plurality of electromagnets disposed adjacent to the substrate support. The position sensor can detect the position of the substrate relative to the substrate support. A system controller is in communication with the electromagnet and is operable to bias the at least one electromagnet to move (i.e., push or pull) the substrate support relative to the substrate. "The reference to "an embodiment", "an embodiment", "an" or "an embodiment" or "an embodiment" means the features, structures, materials or features described in connection with the embodiments. All are included in at least one embodiment of the invention. Thus, 35 201029070 throughout the specification, as in the <RTI ID=0.0> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; The appearance of the wording of j does not necessarily mean the same as the embodiment. In addition, the specific features, structures, materials or features may be combined in one or more embodiments in any suitable manner. Although reference has been made herein to specific embodiments. The present invention has been described, but it is to be understood that the embodiments of the present invention are intended to be illustrative of the present invention. The method of claim 4 f / 3 million and the device to carry out various modifications and changes. Therefore, it is expected that the invention includes the modification and variation of the scope of the additional patent application and its equivalent. BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows a simplified isometric view of a rapid thermal processing chamber in accordance with an embodiment of the present invention; Figure 2A shows a location for sensing a substrate in accordance with an embodiment. Partial side view of the positioning system of the sensor system. Figure 2B shows a partial side view of a positioning system having a sensor system for sensing the position of the substrate, according to an embodiment; Figure 3A shows Partial side view of a positioning tether according to an embodiment FIG. 3B shows a partial side view of a positioning tether system according to an embodiment. FIG. 3C shows a positioning system starting from ρ α 根据 according to an embodiment. Partial perspective view, FIG. 4 shows a partial cavity of a cavity according to an embodiment of the present invention, 36 201029070. FIG. 5 shows a partial perspective of a chamber according to an embodiment of the present invention, FIG. A partial perspective ran group of a chamber in accordance with an embodiment of the present invention is shown, and FIG. 7 shows a side view of a positioning mechanism in accordance with one or more embodiments of the present invention; FIG. 8A shows a side view of an embodiment of a positioning mechanism 8B is a side view showing an embodiment of a positioning mechanism; FIG. 9A is a plan view of a substrate member according to one or more embodiments of the present invention; FIG. 9B is a view of one or more embodiments according to the present invention; A cross-sectional view of the substrate support; FIG. 9C is a schematic view of an edge ring according to one or more embodiments of the present invention, and FIG. 10A is a view of the processing chamber φ according to one or more embodiments of the present invention. a top view of the substrate support; FIG. 10B is a cross-sectional view between the edge ring of the substrate support member and the substrate in accordance with one or more embodiments of the present invention; FIG. 10C is a diagram of one or more implementations in accordance with the present invention A top view of a substrate support in a processing chamber; FIG. 11 is a simplified isometric view of a rapid thermal processing chamber in accordance with one or more embodiments of the present invention; and FIG. 12 is a view of one or more of the present invention in accordance with one or more embodiments of the present invention; A top view of the stator assembly with the outer casing of the embodiment removed. 37 201029070 [Major component symbol description] 100 chamber 102 chamber body 104 substrate support / edge ring 106 radiant heat source 108 wall 110 bottom

112 Top 114 Window 116 Sensor 117 Sensor 118 Stator 120 Internal Volume 122 Actuator 124 Controller 126 Memory 128 Support Circuit 130 Central Processing Unit (CPU) 132 Guide Bolt 134 Flange 136 Coupler 138 Motor 38 201029070

140 Substrate 144 Lifting pin 148 Substrate access 埠 158 Nut 160 Tube 164 Atmospheric control system 168 Drive coil assembly 170 Suspension coil assembly 180 Cooling block 181A Inlet 181B Outlet 182 Coolant source 183 Coolant source 184 Channel 186 Fluid Source 190 Housing 192 Ring Section 200 Substrate 202 Loading Blade 204 Pin 206 Substrate Support 208 Hole 210 Plane 212 Arrow 39 201029070 214 Reflector 220 Sensor System 22 5 Light Source 227 Beam 229 Beam 231 Detector 235 Controller 25 0 light source

252 detector 254 visual analysis system 300 chamber 302 substrate 304 substrate position sensor system 306 substrate support 308 rotor 3 1 pusher 312 lift pin 316 sensor 318 loading blade 320 substrate 400 chamber 402 substrate 404 Loading blade 406 substrate position sensor system 40 201029070

408 Edge ring 410 mechanism 412 motor 414 pin 500 chamber 502 substrate 504 loading blade 506 substrate position sensor system 508 edge ring 510 similar member 512 lift pin 600 substrate 602 edge ring 604 lift pin 606 rod 608 nozzle 700 substrate 702 Edge ring 704 rod 706 nozzle 900 substrate support 902 substrate 904 alignment mark 910 edge ring 201029070 912 surface 914 surface 915 side wall 916 flange 918 gap 919 alignment mark

920 support ring 922 flange 924 flange 930 support cylinder 932 bottom 1001 processing chamber 1002 substrate 1003 edge ring 1004 substrate support 1005 side wall 1006 edge 1007 support pin 1008 distance 1011 beam 1014 position sensor 1015 chamber cover 1016 position sense Detector 1050 processing chamber 42 201029070

1052 Substrate Support 'Part 1054 Substrate 1056 Edge Ring 1058 Distance 1059 Distance 1068 Light Emitter 1070 Light Receiver 1072 Light Emitter 1074 Light Receiver 1076 Light Beam 1078 Light Pipe 1100 Chamber 1124 System Controller 1190 Stator Housing 1191 Ring Body 1192 Ring Section 1194 Support Section 1200 Electromagnet 1202 Sensor 43

Claims (1)

201029070 VII. Patent application scope: 1. A rapid thermal processing device for processing a flat substrate, the device comprising: a cavity to 'including a heat source; a first substrate support member for fixing the substrate to a first position in the chamber; a first substrate support member positioned in a second position for fixing the substrate during the heat treatment, the second substrate support member being movable in a direction β to place the substrate Putting it close to or away from the heat source; and a sensor for sensing the position of the substrate relative to the second substrate support, the sensor being in communication with the actuator to change the substrate relative to the second substrate The position of the axial position of the support member. 2. The device of claim 3, wherein the sensor comprises an optical detector. 3. The device of claim 2, wherein the sensor comprises: φ a light source 'for directing a light beam onto a surface of the substrate; and a detector' positioned to monitor The intensity of the light reflected by the substrate, wherein one or both of the detector and the substrate are movable to provide relative motion between the detector and the substrate. 4. The device of claim 3, wherein the sensor further comprises an electronic controller in communication with the detector, wherein the controller generates a plurality of measurements from the reflection detected by the detector And calculating a position at which a reflection occurs on the surface of the substrate includes determining which of the measurements corresponds to an edge of the substrate. The apparatus of claim 2, wherein the sensor is configured to detect by projecting the first substrate support member on the substrate or the substrate on the second substrate support member The position of the substrate relative to the position of the second substrate support is measured. 6. The device of claim 2, wherein the sensor comprises a camera, an illumination system, and a visual image analysis system that detects the second substrate support and the center of the substrate. 7. The device of claim 1, wherein the first substrate support member is selected from the group consisting of a robot blade and a lift pin assembly and the second substrate support member is an edge ring. 8. The device of claim 2, further comprising a chamber cover and at least two position sensors, the at least two position sensors being located on the chamber cover and from the at least two senses One of the reflected beams of the detector can be emitted via the chamber cover as needed. 9. The device of claim 1, further comprising a liquid or gas nozzle positioned adjacent to the substrate to move the substrate in a plurality of axial directions. 10. The device of claim 3, further comprising a plurality of locating rods oriented in the same plane as the substrate, the locating rods being adapted to contact the edge of the substrate for the substrate The substrate is pushed in a plurality of directions in the plane. U. The device of claim 3, wherein the second substrate support is rotated to a maglev rotor. 12. The device of claim 2, further comprising a plurality of 45 201029070 positioning rods positioned to contact the second substrate support or the maglev rotor to be in a plurality parallel to a plane of the substrate The second substrate support or the maglev rotor is pushed in one direction. 13. The apparatus of claim 11 further comprising a magnetic field generating device coupled to the maglev rotor, the magnetic field being changeable to move the floating rotor in a plurality of axial directions in a plane of the substrate. The apparatus of claim 2, further comprising a system controller for obtaining a position signal from the sensor and transmitting a k to one or more electromagnets to adjust the The position of the second substrate support relative to the substrate. 15. If you apply for a patent scope! The device of claim 2, wherein the second substrate support comprises an edge ring, the edge ring comprising an alignment mark on an inner surface of the substrate support, the alignment mark being alignable with a mark on the substrate Aligned. 16. A method of processing a substrate, comprising the steps of: transferring a flat substrate having one edge to an intermediate substrate support member in a processing chamber; determining a position of the edge of the substrate; adjusting the substrate The second substrate is cut to position the substrate and the second substrate member in a substantially central orientation. The substrate is transferred to the second substrate support; and the substrate is heat treated. 17. The method of claim 16, wherein the substrate is transferred to the processing chamber on a robot blade, the intermediate substrate support 46 201029070 includes a lift pin and the substrate is transferred to the lift The relative position of the substrate relative to the second substrate support is adjusted prior to the lifting. 18. The method of claim 16, wherein the relative position of the substrate relative to the second substrate support is by changing one or more positions of the substrate, the position of the second substrate support, or the intermediate substrate The position of the support is adjusted. 19. The method of claim 16, further comprising the step of: transmitting a reflected beam from one of the sensors through a space between the substrate and the substrate support to determine a beta adjustment value to The substrate is placed on a central position of the second substrate support. The method of claim 16, wherein the position of the second substrate support member is adjusted by using - or a plurality of magnetic fields adjacent to the substrate support member. 21. The method of claim 2, wherein the one or more sensors are in communication with the control system, the control system is in communication with a plurality of magnets adjacent to the substrate support, and the magnetic fields are responsive to Applied by a position obtained by the sensor. 22. The method of claim 19, wherein the e adjustment value is determined by measuring at least two locations and distances between the second substrate support and the substrate, and using at least two senses The detector determines the distance of X and γ for the at least two positions of the θ adjustment. 47