SG11201401991PA - Device and method for treating wafer-shaped articles - Google Patents
Device and method for treating wafer-shaped articlesInfo
- Publication number
- SG11201401991PA SG11201401991PA SG11201401991PA SG11201401991PA SG11201401991PA SG 11201401991P A SG11201401991P A SG 11201401991PA SG 11201401991P A SG11201401991P A SG 11201401991PA SG 11201401991P A SG11201401991P A SG 11201401991PA SG 11201401991P A SG11201401991P A SG 11201401991PA
- Authority
- SG
- Singapore
- Prior art keywords
- shaped articles
- treating wafer
- wafer
- treating
- articles
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/307,421 US8974632B2 (en) | 2011-11-30 | 2011-11-30 | Device and method for treating wafer-shaped articles |
| PCT/IB2012/056667 WO2013080106A2 (en) | 2011-11-30 | 2012-11-23 | Device and method for treating wafer-shaped articles |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201401991PA true SG11201401991PA (en) | 2014-08-28 |
Family
ID=48465863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201401991PA SG11201401991PA (en) | 2011-11-30 | 2012-11-23 | Device and method for treating wafer-shaped articles |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8974632B2 (en) |
| KR (1) | KR102033804B1 (en) |
| SG (1) | SG11201401991PA (en) |
| TW (1) | TWI590320B (en) |
| WO (1) | WO2013080106A2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5533335B2 (en) * | 2009-07-22 | 2014-06-25 | 東京エレクトロン株式会社 | Processing apparatus and operation method thereof |
| US10269615B2 (en) | 2011-09-09 | 2019-04-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US8974632B2 (en) * | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
| US9597701B2 (en) * | 2013-12-31 | 2017-03-21 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US10043686B2 (en) * | 2013-12-31 | 2018-08-07 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US9657397B2 (en) * | 2013-12-31 | 2017-05-23 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
| US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
| US9911630B2 (en) | 2015-10-30 | 2018-03-06 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT389959B (en) | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | DEVICE FOR SETTING DISC-SHAPED OBJECTS, ESPECIALLY SILICONE DISC |
| ATE174155T1 (en) | 1993-02-08 | 1998-12-15 | Sez Semiconduct Equip Zubehoer | SUPPORT FOR DISC-SHAPED OBJECTS |
| JPH11354617A (en) * | 1998-06-10 | 1999-12-24 | Sumiere Sez Kk | Substrate processing apparatus and method therefor |
| US6485531B1 (en) | 1998-09-15 | 2002-11-26 | Levitronix Llc | Process chamber |
| AT413162B (en) * | 2001-09-26 | 2005-11-15 | Sez Ag | RINGTONED RECORDING DEVICE FOR A ROTATING SUPPORT FOR RECEIVING A DISCONNECTED OBJECT SUCH AS A SEMICONDUCTOR WAFER |
| DE602004018643D1 (en) | 2003-06-24 | 2009-02-05 | Sez Ag | DEVICE AND METHOD FOR WET TREATMENT OF DISK SUBSTRATES |
| JP4410119B2 (en) | 2005-02-03 | 2010-02-03 | 東京エレクトロン株式会社 | Cleaning device, coating, developing device and cleaning method |
| US8974631B2 (en) | 2006-03-08 | 2015-03-10 | Lam Research Ag | Device for fluid treating plate-like articles |
| US20070277734A1 (en) | 2006-05-30 | 2007-12-06 | Applied Materials, Inc. | Process chamber for dielectric gapfill |
| KR100797079B1 (en) * | 2006-07-12 | 2008-01-22 | 세메스 주식회사 | A method and apparatus for cleaning substrates |
| TWI359456B (en) * | 2006-12-15 | 2012-03-01 | Lam Res Ag | Device and method for wet treating plate-like arti |
| TWI348934B (en) | 2007-08-30 | 2011-09-21 | Lam Res Ag | Apparatus for wet treatment of plate-like articles |
| JP5156661B2 (en) * | 2009-02-12 | 2013-03-06 | 東京エレクトロン株式会社 | Liquid processing apparatus and liquid processing method |
| US8974632B2 (en) * | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
-
2011
- 2011-11-30 US US13/307,421 patent/US8974632B2/en not_active Expired - Fee Related
-
2012
- 2012-11-23 SG SG11201401991PA patent/SG11201401991PA/en unknown
- 2012-11-23 WO PCT/IB2012/056667 patent/WO2013080106A2/en active Application Filing
- 2012-11-23 KR KR1020147014827A patent/KR102033804B1/en active IP Right Grant
- 2012-11-29 TW TW101144754A patent/TWI590320B/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| WO2013080106A3 (en) | 2013-08-01 |
| TW201342456A (en) | 2013-10-16 |
| KR102033804B1 (en) | 2019-10-17 |
| TWI590320B (en) | 2017-07-01 |
| WO2013080106A2 (en) | 2013-06-06 |
| US20130134128A1 (en) | 2013-05-30 |
| KR20140103108A (en) | 2014-08-25 |
| US8974632B2 (en) | 2015-03-10 |
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