JP2015508570A - ウエハ状物品の表面を処理するための装置 - Google Patents

ウエハ状物品の表面を処理するための装置 Download PDF

Info

Publication number
JP2015508570A
JP2015508570A JP2014548288A JP2014548288A JP2015508570A JP 2015508570 A JP2015508570 A JP 2015508570A JP 2014548288 A JP2014548288 A JP 2014548288A JP 2014548288 A JP2014548288 A JP 2014548288A JP 2015508570 A JP2015508570 A JP 2015508570A
Authority
JP
Japan
Prior art keywords
wafer
process chamber
rotary chuck
article
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014548288A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015508570A5 (enExample
Inventor
フランク・ディーター
ロガトシュニーク・ロバート
グライスナー・アンドレアス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research AG
Original Assignee
Lam Research AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research AG filed Critical Lam Research AG
Publication of JP2015508570A publication Critical patent/JP2015508570A/ja
Publication of JP2015508570A5 publication Critical patent/JP2015508570A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014548288A 2011-12-23 2012-12-17 ウエハ状物品の表面を処理するための装置 Pending JP2015508570A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/336,685 2011-12-23
US13/336,685 US9548223B2 (en) 2011-12-23 2011-12-23 Apparatus for treating surfaces of wafer-shaped articles
PCT/IB2012/057383 WO2013093759A1 (en) 2011-12-23 2012-12-17 Apparatus for treating surfaces of wafer-shaped articles

Publications (2)

Publication Number Publication Date
JP2015508570A true JP2015508570A (ja) 2015-03-19
JP2015508570A5 JP2015508570A5 (enExample) 2016-02-12

Family

ID=48653163

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014548288A Pending JP2015508570A (ja) 2011-12-23 2012-12-17 ウエハ状物品の表面を処理するための装置

Country Status (6)

Country Link
US (1) US9548223B2 (enExample)
JP (1) JP2015508570A (enExample)
KR (1) KR20140110970A (enExample)
CN (1) CN104011847A (enExample)
TW (1) TWI559984B (enExample)
WO (1) WO2013093759A1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10269615B2 (en) * 2011-09-09 2019-04-23 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
JP6001896B2 (ja) * 2012-03-27 2016-10-05 株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ 基板洗浄装置およびそれを備えた基板処理装置
US9748120B2 (en) 2013-07-01 2017-08-29 Lam Research Ag Apparatus for liquid treatment of disc-shaped articles and heating system for use in such apparatus
KR102119690B1 (ko) * 2013-12-06 2020-06-08 세메스 주식회사 기판 가열 유닛
US10043686B2 (en) * 2013-12-31 2018-08-07 Lam Research Ag Apparatus for treating surfaces of wafer-shaped articles
US10490426B2 (en) * 2014-08-26 2019-11-26 Lam Research Ag Method and apparatus for processing wafer-shaped articles
US10167552B2 (en) * 2015-02-05 2019-01-01 Lam Research Ag Spin chuck with rotating gas showerhead
JP6625891B2 (ja) * 2016-02-10 2019-12-25 株式会社日立ハイテクノロジーズ 真空処理装置
KR102518220B1 (ko) * 2016-11-09 2023-04-04 티이엘 매뉴팩처링 앤드 엔지니어링 오브 아메리카, 인크. 공정 챔버에서 마이크로전자 기판을 처리하기 위한 자기적으로 부상되고 회전되는 척

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001104860A (ja) * 1999-10-13 2001-04-17 Ebara Corp 基板処理装置
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
JP2007527606A (ja) * 2003-06-24 2007-09-27 エスイーゼツト・アクチエンゲゼルシヤフト ディスク様基板の湿式処理装置と方法
JP2009539269A (ja) * 2006-05-30 2009-11-12 アプライド マテリアルズ インコーポレイテッド 誘電性ギャップ充填のためのプロセスチャンバ
WO2011010661A1 (ja) * 2009-07-22 2011-01-27 東京エレクトロン株式会社 処理装置及びその動作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT389959B (de) 1987-11-09 1990-02-26 Sez Semiconduct Equip Zubehoer Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben
DE59407361D1 (de) 1993-02-08 1999-01-14 Sez Semiconduct Equip Zubehoer Träger für scheibenförmige Gegenstände
US6485531B1 (en) 1998-09-15 2002-11-26 Levitronix Llc Process chamber
WO2007069433A1 (ja) * 2005-12-16 2007-06-21 Niigata University 非接触型回転処理装置
JP4937278B2 (ja) 2006-03-08 2012-05-23 ラム・リサーチ・アクチエンゲゼルシヤフト 板状物品の流体処理用装置
CN101326629B (zh) * 2006-05-30 2011-05-25 应用材料股份有限公司 填充介电质间隙的制程室
TWI421945B (zh) 2008-11-06 2014-01-01 Applied Materials Inc 含有微定位系統之快速熱處理腔室與處理基材之方法
US8314371B2 (en) 2008-11-06 2012-11-20 Applied Materials, Inc. Rapid thermal processing chamber with micro-positioning system
CN102292806B (zh) * 2008-12-19 2014-06-11 朗姆研究公司 处理盘状制品的设备及操作其的方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001524259A (ja) * 1995-07-10 2001-11-27 シーヴィシー、プラダクツ、インク マイクロエレクトロニクス製造装置用プログラマブル超クリーン電磁サブストレート回転装置及び方法
JP2001104860A (ja) * 1999-10-13 2001-04-17 Ebara Corp 基板処理装置
JP2001351874A (ja) * 2000-06-09 2001-12-21 Ebara Corp 基板回転装置
JP2007527606A (ja) * 2003-06-24 2007-09-27 エスイーゼツト・アクチエンゲゼルシヤフト ディスク様基板の湿式処理装置と方法
JP2009539269A (ja) * 2006-05-30 2009-11-12 アプライド マテリアルズ インコーポレイテッド 誘電性ギャップ充填のためのプロセスチャンバ
WO2011010661A1 (ja) * 2009-07-22 2011-01-27 東京エレクトロン株式会社 処理装置及びその動作方法

Also Published As

Publication number Publication date
TWI559984B (en) 2016-12-01
US20130160260A1 (en) 2013-06-27
US9548223B2 (en) 2017-01-17
KR20140110970A (ko) 2014-09-17
CN104011847A (zh) 2014-08-27
WO2013093759A1 (en) 2013-06-27
TW201341059A (zh) 2013-10-16

Similar Documents

Publication Publication Date Title
JP2015508570A (ja) ウエハ状物品の表面を処理するための装置
CN105390416B (zh) 用于处理晶片状物件的方法和装置
KR101434708B1 (ko) 기판의 액처리 장치 및 액처리 방법
US10269615B2 (en) Apparatus for treating surfaces of wafer-shaped articles
TWI625818B (zh) 晶圓形物件之液體處理方法與設備
KR102382682B1 (ko) 웨이퍼-형상 물체들의 표면들을 처리하기 위한 장치
TW201342456A (zh) 用以處理晶圓狀物體之裝置及方法
TWI651779B (zh) 晶圓狀物件之表面的處理設備
JP2017038041A (ja) ウエハ形状物品を処理するためのデュアルモードチャンバ
JP6322450B2 (ja) ウエハ状物品の表面を処理するための装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20151216

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20151216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20161004

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20161227

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170216

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170411

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170829