JP2015504463A5 - - Google Patents

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Publication number
JP2015504463A5
JP2015504463A5 JP2014542287A JP2014542287A JP2015504463A5 JP 2015504463 A5 JP2015504463 A5 JP 2015504463A5 JP 2014542287 A JP2014542287 A JP 2014542287A JP 2014542287 A JP2014542287 A JP 2014542287A JP 2015504463 A5 JP2015504463 A5 JP 2015504463A5
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JP
Japan
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polymer
composition
mixture
poly
following structure
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JP2014542287A
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English (en)
Japanese (ja)
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JP2015504463A (ja
JP5918385B2 (ja
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Priority claimed from PCT/US2011/061413 external-priority patent/WO2013074120A1/en
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Publication of JP2015504463A5 publication Critical patent/JP2015504463A5/ja
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JP2014542287A 2011-11-18 2011-11-18 高ガラス転移点ポリマーのための架橋化合物 Active JP5918385B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2011/061413 WO2013074120A1 (en) 2011-11-18 2011-11-18 Crosslinking compounds for high glass transition temperature polymers

Publications (3)

Publication Number Publication Date
JP2015504463A JP2015504463A (ja) 2015-02-12
JP2015504463A5 true JP2015504463A5 (enExample) 2015-04-09
JP5918385B2 JP5918385B2 (ja) 2016-05-18

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ID=45048313

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JP2014542287A Active JP5918385B2 (ja) 2011-11-18 2011-11-18 高ガラス転移点ポリマーのための架橋化合物

Country Status (7)

Country Link
US (1) US9006353B2 (enExample)
EP (1) EP2780392B1 (enExample)
JP (1) JP5918385B2 (enExample)
KR (1) KR101616868B1 (enExample)
CA (1) CA2853977C (enExample)
SG (1) SG11201401834SA (enExample)
WO (1) WO2013074120A1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9257652B2 (en) * 2012-03-05 2016-02-09 Honda Motor Co., Ltd. Photoelectric conversion material, method for producing the same, and organic photovoltaic cell containing the same
EP2909253B1 (en) 2012-10-22 2021-11-10 Delsper LP Cross-linked organic polymer compositions
JP6272908B2 (ja) * 2013-01-28 2018-01-31 デルスパー リミテッド パートナーシップ シーリングおよび耐摩耗性構成部材のための抗押出性組成物
JP6456913B2 (ja) 2013-03-15 2019-01-23 デルスパー リミテッド パートナーシップ エラストマーとしての使用のための架橋有機ポリマー
CN104745054A (zh) * 2015-03-27 2015-07-01 中油新星纳米工程技术有限公司 一种聚天门冬氨酸酯聚脲钛合金纳米重防腐涂料
KR102076855B1 (ko) * 2017-05-22 2020-02-12 단국대학교 산학협력단 고분자형 열가교성 정공 전달 물질 및 이를 이용한 유기발광다이오드
KR102003639B1 (ko) * 2017-05-22 2019-07-25 단국대학교 산학협력단 저분자량 열가교성 정공 전달 물질 및 이를 이용한 유기발광다이오드
JP2022500523A (ja) * 2018-09-11 2022-01-04 グリーン, ツイード テクノロジーズ, インコーポレイテッド 架橋した有機ポリマーを形成するための架橋組成物、有機ポリマー組成物、それを形成する方法、およびそれから製造された成形品
JP7217695B2 (ja) 2019-11-28 2023-02-03 信越化学工業株式会社 有機膜形成用材料、パターン形成方法、及び重合体
EP4157941A4 (en) * 2020-05-24 2024-06-19 Greene, Tweed Technologies, Inc. CROSS-LINKED AROMATIC POLYMER COMPOSITIONS AND METHODS FOR PRODUCING INSULATING COATINGS
JP7792357B2 (ja) * 2023-01-10 2025-12-25 信越化学工業株式会社 レジスト下層膜形成用組成物、パターン形成方法、及びレジスト下層膜形成方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3533997A (en) * 1969-05-28 1970-10-13 Du Pont Crosslinkable polyamide-acids and polyimides and crosslinked polymeric products made therefrom
US3966729A (en) 1975-05-19 1976-06-29 The United States Of America As Represented By The Secretary Of The Air Force Addition curable phenyl-quinoxaline compositions and their synthesis
US4731442A (en) 1986-10-02 1988-03-15 The United States Of America As Represented By The Secretary Of The Air Force High temperature solvent resistant amorphous thermoplastic phenylethynyl quinoxaline resin composition
US5155175A (en) * 1989-12-08 1992-10-13 Intellectual Property Law Dept. Crosslinkable fluorinated polyarylene ether composition
US5114780A (en) 1990-04-17 1992-05-19 Raychem Corporation Electronic articles containing a fluorinated poly(arylene ether) dielectric
EP0443352B1 (en) 1990-02-20 1995-12-06 National Starch and Chemical Investment Holding Corporation Polyimides end-capped with diaryl substituted acetylene
WO1991016370A1 (en) 1990-04-17 1991-10-31 Raychem Corporation Crosslinkable fluorinated aromatic ether compositions
US5179188A (en) 1990-04-17 1993-01-12 Raychem Corporation Crosslinkable fluorinated aromatic ether composition
US5959157A (en) 1995-06-26 1999-09-28 Alliedsignal, Inc. Process for making hydroxy-substituted ethynylated biphenyl compounds
US5874516A (en) 1995-07-13 1999-02-23 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ethers)
US5658994A (en) 1995-07-13 1997-08-19 Air Products And Chemicals, Inc. Nonfunctionalized poly(arylene ether) dielectrics
CN1103329C (zh) 1995-09-12 2003-03-19 陶氏化学公司 乙炔基取代的芳族化合物,其合成,聚合物及其用途
EP0910828B1 (en) 1996-07-09 2001-09-26 BRITISH TELECOMMUNICATIONS public limited company Storage system and storage method for distributed storage
US5945253A (en) 1996-08-29 1999-08-31 Xerox Corporation High performance curable polymers and processes for the preparation thereof
US6060170A (en) 1998-02-25 2000-05-09 Air Products And Chemicals, Inc. Functional groups for thermal crosslinking of polymeric systems
US6184284B1 (en) 1998-08-24 2001-02-06 The Dow Chemical Company Adhesion promoter and self-priming resin compositions and articles made therefrom
US6346296B1 (en) 1999-09-14 2002-02-12 Alliedsignal Inc. Highly stable packaging substrates
US6359091B1 (en) 1999-11-22 2002-03-19 The Dow Chemical Company Polyarylene compositions with enhanced modulus profiles
US6423811B1 (en) 2000-07-19 2002-07-23 Honeywell International Inc. Low dielectric constant materials with polymeric networks
WO2002081546A1 (en) 2001-04-06 2002-10-17 Honeywell International Inc. Low dielectric constant materials and methods of preparation thereof
US7347885B1 (en) 2001-12-10 2008-03-25 The United States Of America As Represented By The Secretary Of The Navy Synthesis of metal nanoparticle compositions from metallic and ethynyl compounds
US6818663B2 (en) 2002-05-17 2004-11-16 Hoffmann-La Roches Diaminothiazoles
US6764873B2 (en) 2002-07-18 2004-07-20 International Business Machines Corporation Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same
JP4575680B2 (ja) * 2004-02-23 2010-11-04 大阪瓦斯株式会社 新規フルオレン化合物
WO2007139271A1 (en) 2006-05-26 2007-12-06 Korea Advanced Institute Of Science And Technology Method for manufacturing a field emitter electrode using the array of carbon nanotubes
US7811499B2 (en) 2006-06-26 2010-10-12 International Business Machines Corporation Method for high density data storage and read-back
US7628938B2 (en) 2006-07-10 2009-12-08 National University Corporation NARA Institute of Science and Technology Photochromic compound and optical functional material
US8119255B2 (en) 2006-12-08 2012-02-21 Universal Display Corporation Cross-linkable iridium complexes and organic light-emitting devices using the same
US20090004488A1 (en) * 2007-06-26 2009-01-01 Doosan Corporation Resine Composition For Printed Circuit Board and Composite Substrate And Copper Laminates Using The Same
DE102008007749A1 (de) 2008-02-05 2009-08-06 Tesa Se Thermisch aktivier- und härtbare Klebefolie insbesondere für die Verklebung von elektronischen Bauteilen und flexiblen gedruckten Leiterbahnen
JP2009202824A (ja) 2008-02-29 2009-09-10 Yazaki Corp 収容箱の放熱構造
US8436106B2 (en) * 2008-07-24 2013-05-07 Schlumberger Technology Corporation Crosslinkers and materials produced using them
CA2733682C (en) 2008-08-12 2014-10-14 Air Products And Chemicals, Inc. Polymeric compositions comprising per(phenylethynyl) arene derivatives
US8236787B2 (en) 2008-12-09 2012-08-07 Synthonics, Inc. Frequency modulated drug delivery (FMDD)
WO2011071340A2 (ko) * 2009-12-11 2011-06-16 한양대학교 산학협력단 투명성과 고내열성을 갖는 폴리아릴렌에테르계 중합체 및 그 제조 방법
JP5598489B2 (ja) * 2011-03-28 2014-10-01 信越化学工業株式会社 ビフェニル誘導体、レジスト下層膜材料、レジスト下層膜形成方法及びパターン形成方法
US8734175B2 (en) * 2011-11-21 2014-05-27 Sondex Wireline Limited Flexible sealing connector

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