JP2015225883A - ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ及びヘテロ接合バイポーラトランジスタ - Google Patents
ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ及びヘテロ接合バイポーラトランジスタ Download PDFInfo
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- JP2015225883A JP2015225883A JP2014108047A JP2014108047A JP2015225883A JP 2015225883 A JP2015225883 A JP 2015225883A JP 2014108047 A JP2014108047 A JP 2014108047A JP 2014108047 A JP2014108047 A JP 2014108047A JP 2015225883 A JP2015225883 A JP 2015225883A
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- 239000000203 mixture Substances 0.000 claims abstract description 55
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims abstract description 18
- 230000007423 decrease Effects 0.000 claims abstract description 11
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 claims abstract description 8
- 230000003247 decreasing effect Effects 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 22
- 229910045601 alloy Inorganic materials 0.000 description 10
- 239000000956 alloy Substances 0.000 description 10
- 238000009825 accumulation Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
- H01L29/7378—Vertical transistors comprising lattice mismatched active layers, e.g. SiGe strained layer transistors
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/08—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
- H01L29/0804—Emitter regions of bipolar transistors
- H01L29/0817—Emitter regions of bipolar transistors of heterojunction bipolar transistors
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
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- H01L29/1004—Base region of bipolar transistors
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- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
- H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
- H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
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- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66242—Heterojunction transistors [HBT]
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/6631—Bipolar junction transistors [BJT] with an active layer made of a group 13/15 material
- H01L29/66318—Heterojunction transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/73—Bipolar junction transistors
- H01L29/737—Hetero-junction transistors
- H01L29/7371—Vertical transistors
Abstract
Description
101 基板
102 サブコレクタ層
103 コレクタ層
104 ベース層
105 エミッタ層
106 エミッタコンタクト層
107 第1のノンアロイ層
108 第2のノンアロイ層
Claims (7)
- GaAsからなるコレクタ層と、
前記コレクタ層上に形成されると共にInGaAsからなるベース層と、
前記ベース層上に形成されると共にInGaPからなるエミッタ層と、
を備えるヘテロ接合バイポーラトランジスタ用エピタキシャルウェハにおいて、
前記ベース層は、前記エミッタ層から前記コレクタ層に向けてIn組成が低下していることを特徴とするヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ。 - 前記ベース層は、In組成の最大値と最小値との差が0.06以下である請求項1に記載のヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ。
- 前記ベース層は、前記エミッタ層から前記コレクタ層に亘るIn組成の平均値が0.16以上0.22以下である請求項1又は2に記載のヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ。
- 前記ベース層は、前記エミッタ層との界面におけるIn組成が0.20である請求項1から3の何れか一項に記載のヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ。
- 前記ベース層は、膜厚が臨界膜厚以下である請求項1から4の何れか一項に記載のヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ。
- 前記ベース層は、前記エミッタ層から前記コレクタ層に向けてIn組成が連続的又は段階的に低下している請求項1から5の何れか一項に記載のヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ。
- 請求項1から6の何れか一項に記載のヘテロ接合バイポーラトランジスタ用エピタキシャルウェハを使用して作製されていることを特徴とするヘテロ接合バイポーラトランジスタ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014108047A JP6200375B2 (ja) | 2014-05-26 | 2014-05-26 | ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ及びヘテロ接合バイポーラトランジスタ |
PCT/JP2015/065060 WO2015182592A1 (ja) | 2014-05-26 | 2015-05-26 | ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ及びヘテロ接合バイポーラトランジスタ |
TW104116827A TW201603272A (zh) | 2014-05-26 | 2015-05-26 | 異質接合雙極性電晶體用磊晶晶圓及異質接合雙極性電晶體 |
US15/312,946 US9865715B2 (en) | 2014-05-26 | 2015-05-26 | Epitaxial wafer for heterojunction bipolar transistor and heterojunction bipolar transistor |
Applications Claiming Priority (1)
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JP2014108047A JP6200375B2 (ja) | 2014-05-26 | 2014-05-26 | ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ及びヘテロ接合バイポーラトランジスタ |
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JP2015225883A true JP2015225883A (ja) | 2015-12-14 |
JP6200375B2 JP6200375B2 (ja) | 2017-09-20 |
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JP2014108047A Active JP6200375B2 (ja) | 2014-05-26 | 2014-05-26 | ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ及びヘテロ接合バイポーラトランジスタ |
Country Status (4)
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US (1) | US9865715B2 (ja) |
JP (1) | JP6200375B2 (ja) |
TW (1) | TW201603272A (ja) |
WO (1) | WO2015182592A1 (ja) |
Families Citing this family (1)
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CN110610991A (zh) * | 2019-09-27 | 2019-12-24 | 厦门市三安集成电路有限公司 | 外延结构和低导通电压晶体管 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669220A (ja) * | 1991-10-09 | 1994-03-11 | Furukawa Electric Co Ltd:The | ヘテロ接合GaAs系バイポーラトランジスタ |
JP2002270817A (ja) * | 2001-03-13 | 2002-09-20 | Nec Corp | バイポーラトランジスタ |
JP2005150487A (ja) * | 2003-11-18 | 2005-06-09 | Hitachi Cable Ltd | ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03124033A (ja) | 1989-10-09 | 1991-05-27 | Fujitsu Ltd | ヘテロ接合バイポーラ・トランジスタ |
US6765242B1 (en) * | 2000-04-11 | 2004-07-20 | Sandia Corporation | Npn double heterostructure bipolar transistor with ingaasn base region |
JP2003273118A (ja) | 2002-03-15 | 2003-09-26 | Hitachi Cable Ltd | へテロ接合バイポーラトランジスタ |
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2014
- 2014-05-26 JP JP2014108047A patent/JP6200375B2/ja active Active
-
2015
- 2015-05-26 TW TW104116827A patent/TW201603272A/zh unknown
- 2015-05-26 US US15/312,946 patent/US9865715B2/en active Active
- 2015-05-26 WO PCT/JP2015/065060 patent/WO2015182592A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0669220A (ja) * | 1991-10-09 | 1994-03-11 | Furukawa Electric Co Ltd:The | ヘテロ接合GaAs系バイポーラトランジスタ |
JP2002270817A (ja) * | 2001-03-13 | 2002-09-20 | Nec Corp | バイポーラトランジスタ |
JP2005150487A (ja) * | 2003-11-18 | 2005-06-09 | Hitachi Cable Ltd | ヘテロ接合バイポーラトランジスタ用エピタキシャルウェハ |
Also Published As
Publication number | Publication date |
---|---|
TW201603272A (zh) | 2016-01-16 |
WO2015182592A1 (ja) | 2015-12-03 |
US20170200816A1 (en) | 2017-07-13 |
US9865715B2 (en) | 2018-01-09 |
JP6200375B2 (ja) | 2017-09-20 |
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