JP2015220370A5 - - Google Patents

Download PDF

Info

Publication number
JP2015220370A5
JP2015220370A5 JP2014103609A JP2014103609A JP2015220370A5 JP 2015220370 A5 JP2015220370 A5 JP 2015220370A5 JP 2014103609 A JP2014103609 A JP 2014103609A JP 2014103609 A JP2014103609 A JP 2014103609A JP 2015220370 A5 JP2015220370 A5 JP 2015220370A5
Authority
JP
Japan
Prior art keywords
wafer
silicon wafer
cleaning
ppb
haze value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014103609A
Other languages
English (en)
Japanese (ja)
Other versions
JP6311446B2 (ja
JP2015220370A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014103609A priority Critical patent/JP6311446B2/ja
Priority claimed from JP2014103609A external-priority patent/JP6311446B2/ja
Priority to TW104101629A priority patent/TWI553722B/zh
Priority to CN201510171396.0A priority patent/CN105097444B/zh
Publication of JP2015220370A publication Critical patent/JP2015220370A/ja
Publication of JP2015220370A5 publication Critical patent/JP2015220370A5/ja
Application granted granted Critical
Publication of JP6311446B2 publication Critical patent/JP6311446B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014103609A 2014-05-19 2014-05-19 シリコンウェーハの製造方法 Active JP6311446B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014103609A JP6311446B2 (ja) 2014-05-19 2014-05-19 シリコンウェーハの製造方法
TW104101629A TWI553722B (zh) 2014-05-19 2015-01-19 Silicon wafer manufacturing method and silicon wafer
CN201510171396.0A CN105097444B (zh) 2014-05-19 2015-04-13 硅晶片的制造方法及硅晶片

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014103609A JP6311446B2 (ja) 2014-05-19 2014-05-19 シリコンウェーハの製造方法

Publications (3)

Publication Number Publication Date
JP2015220370A JP2015220370A (ja) 2015-12-07
JP2015220370A5 true JP2015220370A5 (enExample) 2016-06-02
JP6311446B2 JP6311446B2 (ja) 2018-04-18

Family

ID=54577621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014103609A Active JP6311446B2 (ja) 2014-05-19 2014-05-19 シリコンウェーハの製造方法

Country Status (3)

Country Link
JP (1) JP6311446B2 (enExample)
CN (1) CN105097444B (enExample)
TW (1) TWI553722B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6432497B2 (ja) * 2015-12-10 2018-12-05 信越半導体株式会社 研磨方法
JP6641197B2 (ja) * 2016-03-10 2020-02-05 株式会社荏原製作所 基板の研磨装置および研磨方法
JP7327974B2 (ja) * 2019-04-01 2023-08-16 株式会社ディスコ ウェーハの分割方法
JP7556426B1 (ja) * 2023-05-30 2024-09-26 株式会社Sumco シリコンウェーハの洗浄方法、シリコンウェーハの製造方法、及びシリコンウェーハ
CN116852183B (zh) * 2023-08-02 2024-04-02 山东有研半导体材料有限公司 一种用于大型晶圆研磨机改善晶圆形貌的研磨工艺
CN117161839B (zh) * 2023-11-01 2024-02-06 山东有研艾斯半导体材料有限公司 一种改善硅抛光片边缘机械损伤的方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521412A (ja) * 1991-07-10 1993-01-29 Fujitsu Ltd 半導体基板の処理方法
JP2000315635A (ja) * 1999-04-30 2000-11-14 Mitsubishi Materials Silicon Corp 張り合わせ用シリコンウェーハおよびこれを用いた張り合わせ基板の製造方法
JP2004291150A (ja) * 2003-03-27 2004-10-21 Tungaloy Corp 立方晶窒化硼素焼結体回転工具
JP4683233B2 (ja) * 2004-09-30 2011-05-18 信越半導体株式会社 半導体ウェーハの製造方法
WO2006035864A1 (ja) * 2004-09-30 2006-04-06 Shin-Etsu Handotai Co., Ltd. Ｓｏｉウエーハの洗浄方法
US8337282B2 (en) * 2006-09-06 2012-12-25 Nitta Haas Incorporated Polishing pad
JP2009252413A (ja) * 2008-04-02 2009-10-29 Kobe Steel Ltd 電子線源
US20110300776A1 (en) * 2010-06-03 2011-12-08 Applied Materials, Inc. Tuning of polishing process in multi-carrier head per platen polishing station
JP2012001798A (ja) * 2010-06-21 2012-01-05 Yokogawa Electric Corp 電解装置用電極の製造方法
WO2012002525A1 (ja) * 2010-07-02 2012-01-05 株式会社Sumco シリコンウェーハの研磨方法

Similar Documents

Publication Publication Date Title
JP2015220370A5 (enExample)
JP2016138278A5 (enExample)
JP2014179160A5 (enExample)
EP3307483A4 (en) GRINDING WITH SHAPED GRINDING PARTICLES
TW201611949A (en) Polishing pad and method for making the same
JP2017536254A5 (enExample)
HUE061299T2 (hu) H2SO4 használata elektrolitként fémek simítására és polírozására szolgáló eljárásokban szabad szilárd anyagokon keresztüli ionszállítással
JP2014187348A5 (enExample)
WO2015187390A3 (en) Scalable nucleic acid-based nanofabrication
TW201612292A (en) Polishing agent and fabricating method thereof, method for polishing substrate, and polishing agent set and fabricating method thereof
JP2014077204A5 (enExample)
EP3692107A4 (en) SURFACE-TREATED ABRASIVE ARTICLES FOR TUNGSTEN POLISHING APPLICATIONS
SG10201907376RA (en) Polishing composition
PL3535561T3 (pl) Urządzenie i zastosowanie urządzenia do pomiaru stężenia, wielkości i potencjału zeta nanocząstek w cieczach w trybie światła rozproszonego i w trybie fluorescencyjnym
MY187480A (en) Polishing liquid composition for magnetic disk substrate
MY186105A (en) Polishing composition
Falconer et al. Generalized dimensions of images of measures under Gaussian processes
MY181185A (en) Method for manufacturing magnetic-disk substrate, method for manufacturing magnetic-disk, filtering apparatus, and method for providing polishing liquid
Malagón On linear differential equations with reductive Galois group
TWD177006S (zh) 半導體製造裝置用附設研磨部之清洗刷之部分
MY176743A (en) Polishing composition
TWD173082S (zh) 半導體製造裝置用附設研磨部之清洗刷之部分
TWD173084S (zh) 半導體製造裝置用附設研磨部之清洗刷之部分
JP2016140650A5 (enExample)
GB201701361D0 (en) All in one claning/washing/polishing surface cleaner for automotive make impurity/ dusty/snowy free surface hand held compact design,size,shape & use