JP2014187348A5 - - Google Patents

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Publication number
JP2014187348A5
JP2014187348A5 JP2013177027A JP2013177027A JP2014187348A5 JP 2014187348 A5 JP2014187348 A5 JP 2014187348A5 JP 2013177027 A JP2013177027 A JP 2013177027A JP 2013177027 A JP2013177027 A JP 2013177027A JP 2014187348 A5 JP2014187348 A5 JP 2014187348A5
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JP
Japan
Prior art keywords
load
polishing
less
particularly limited
limit value
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2013177027A
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English (en)
Japanese (ja)
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JP2014187348A (ja
JP6436517B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from JP2013177027A external-priority patent/JP6436517B2/ja
Priority to JP2013177027A priority Critical patent/JP6436517B2/ja
Priority to US14/768,998 priority patent/US9879156B2/en
Priority to KR1020157022114A priority patent/KR102176147B1/ko
Priority to RU2015139807A priority patent/RU2646938C2/ru
Priority to PCT/JP2014/052956 priority patent/WO2014129328A1/ja
Priority to CN201480009493.3A priority patent/CN105027267A/zh
Priority to TW103105100A priority patent/TWI576420B/zh
Publication of JP2014187348A publication Critical patent/JP2014187348A/ja
Publication of JP2014187348A5 publication Critical patent/JP2014187348A5/ja
Publication of JP6436517B2 publication Critical patent/JP6436517B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013177027A 2013-02-20 2013-08-28 研磨用組成物 Active JP6436517B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2013177027A JP6436517B2 (ja) 2013-02-20 2013-08-28 研磨用組成物
PCT/JP2014/052956 WO2014129328A1 (ja) 2013-02-20 2014-02-07 研磨用組成物
KR1020157022114A KR102176147B1 (ko) 2013-02-20 2014-02-07 연마용 조성물
RU2015139807A RU2646938C2 (ru) 2013-02-20 2014-02-07 Полировальная композиция
US14/768,998 US9879156B2 (en) 2013-02-20 2014-02-07 Polishing composition
CN201480009493.3A CN105027267A (zh) 2013-02-20 2014-02-07 研磨用组合物
TW103105100A TWI576420B (zh) 2013-02-20 2014-02-17 A polishing composition, a polishing method, and a method for producing a sapphire substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013031228 2013-02-20
JP2013031228 2013-02-20
JP2013177027A JP6436517B2 (ja) 2013-02-20 2013-08-28 研磨用組成物

Publications (3)

Publication Number Publication Date
JP2014187348A JP2014187348A (ja) 2014-10-02
JP2014187348A5 true JP2014187348A5 (enExample) 2015-10-15
JP6436517B2 JP6436517B2 (ja) 2018-12-12

Family

ID=51391124

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013177027A Active JP6436517B2 (ja) 2013-02-20 2013-08-28 研磨用組成物

Country Status (7)

Country Link
US (1) US9879156B2 (enExample)
JP (1) JP6436517B2 (enExample)
KR (1) KR102176147B1 (enExample)
CN (1) CN105027267A (enExample)
RU (1) RU2646938C2 (enExample)
TW (1) TWI576420B (enExample)
WO (1) WO2014129328A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506913B2 (ja) * 2014-03-31 2019-04-24 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
KR20170047307A (ko) * 2014-08-29 2017-05-04 캐보트 마이크로일렉트로닉스 코포레이션 사파이어 표면을 연마하기 위한 방법 및 조성물
JP5940754B1 (ja) * 2014-10-14 2016-06-29 花王株式会社 サファイア板用研磨液組成物
JP6570382B2 (ja) * 2015-09-09 2019-09-04 デンカ株式会社 研磨用シリカ添加剤及びそれを用いた方法
US9916985B2 (en) * 2015-10-14 2018-03-13 International Business Machines Corporation Indium phosphide smoothing and chemical mechanical planarization processes
CN107011804A (zh) * 2016-01-28 2017-08-04 浙江晶圣美纳米科技有限公司 一种蓝宝石化学机械抛光液
WO2018116890A1 (ja) * 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
RU2635132C1 (ru) * 2017-02-20 2017-11-09 Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") Полировальная суспензия для сапфировых подложек
JP6864519B2 (ja) * 2017-03-31 2021-04-28 株式会社フジミインコーポレーテッド 研磨用組成物、磁気ディスク基板の製造方法および磁気ディスクの研磨方法
EP3792327B1 (en) * 2019-09-11 2025-05-28 Fujimi Incorporated Polishing composition, polishing method and method for manufacturing semiconductor substrate

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132432B2 (ja) * 1999-07-02 2008-08-13 日産化学工業株式会社 研磨用組成物
WO2004053456A2 (en) * 2002-12-09 2004-06-24 Corning Incorporated Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials
US20060196849A1 (en) 2005-03-04 2006-09-07 Kevin Moeggenborg Composition and method for polishing a sapphire surface
JP2008044078A (ja) 2006-08-18 2008-02-28 Sumitomo Metal Mining Co Ltd サファイア基板の研磨方法
KR101715024B1 (ko) * 2006-12-28 2017-03-10 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 사파이어 기판
KR101170030B1 (ko) * 2007-10-05 2012-08-01 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 복합 슬러리를 이용한 사파이어 연마공정
SG176255A1 (en) * 2009-08-19 2012-01-30 Hitachi Chemical Co Ltd Polishing solution for cmp and polishing method

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