TWI576420B - A polishing composition, a polishing method, and a method for producing a sapphire substrate - Google Patents

A polishing composition, a polishing method, and a method for producing a sapphire substrate Download PDF

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Publication number
TWI576420B
TWI576420B TW103105100A TW103105100A TWI576420B TW I576420 B TWI576420 B TW I576420B TW 103105100 A TW103105100 A TW 103105100A TW 103105100 A TW103105100 A TW 103105100A TW I576420 B TWI576420 B TW I576420B
Authority
TW
Taiwan
Prior art keywords
polishing
cerium oxide
oxide particles
particle diameter
polishing composition
Prior art date
Application number
TW103105100A
Other languages
English (en)
Chinese (zh)
Other versions
TW201446952A (zh
Inventor
伊藤潤
堀田和利
杉山博保
森永均
Original Assignee
福吉米股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 福吉米股份有限公司 filed Critical 福吉米股份有限公司
Publication of TW201446952A publication Critical patent/TW201446952A/zh
Application granted granted Critical
Publication of TWI576420B publication Critical patent/TWI576420B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1409—Abrasive particles per se
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/16—Oxides
    • C30B29/20—Aluminium oxides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • H10P52/00—
    • H10P52/402—
    • H10P52/403—

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Metallurgy (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
TW103105100A 2013-02-20 2014-02-17 A polishing composition, a polishing method, and a method for producing a sapphire substrate TWI576420B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013031228 2013-02-20
JP2013177027A JP6436517B2 (ja) 2013-02-20 2013-08-28 研磨用組成物

Publications (2)

Publication Number Publication Date
TW201446952A TW201446952A (zh) 2014-12-16
TWI576420B true TWI576420B (zh) 2017-04-01

Family

ID=51391124

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103105100A TWI576420B (zh) 2013-02-20 2014-02-17 A polishing composition, a polishing method, and a method for producing a sapphire substrate

Country Status (7)

Country Link
US (1) US9879156B2 (enExample)
JP (1) JP6436517B2 (enExample)
KR (1) KR102176147B1 (enExample)
CN (1) CN105027267A (enExample)
RU (1) RU2646938C2 (enExample)
TW (1) TWI576420B (enExample)
WO (1) WO2014129328A1 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6506913B2 (ja) * 2014-03-31 2019-04-24 ニッタ・ハース株式会社 研磨用組成物及び研磨方法
US20160060487A1 (en) * 2014-08-29 2016-03-03 Cabot Microelectronics Corporation Composition and method for polishing a sapphire surface
CN107075345B (zh) * 2014-10-14 2019-03-12 花王株式会社 蓝宝石板用研磨液组合物
JP6570382B2 (ja) * 2015-09-09 2019-09-04 デンカ株式会社 研磨用シリカ添加剤及びそれを用いた方法
US9916985B2 (en) * 2015-10-14 2018-03-13 International Business Machines Corporation Indium phosphide smoothing and chemical mechanical planarization processes
CN107011804A (zh) * 2016-01-28 2017-08-04 浙江晶圣美纳米科技有限公司 一种蓝宝石化学机械抛光液
WO2018116890A1 (ja) * 2016-12-22 2018-06-28 ニッタ・ハース株式会社 研磨用組成物
RU2635132C1 (ru) * 2017-02-20 2017-11-09 Общество с ограниченной ответственностью "Научно-технический центр "Компас" (ООО "НТЦ "Компас") Полировальная суспензия для сапфировых подложек
JP6864519B2 (ja) * 2017-03-31 2021-04-28 株式会社フジミインコーポレーテッド 研磨用組成物、磁気ディスク基板の製造方法および磁気ディスクの研磨方法
EP3792327B1 (en) * 2019-09-11 2025-05-28 Fujimi Incorporated Polishing composition, polishing method and method for manufacturing semiconductor substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201113358A (en) * 2009-08-19 2011-04-16 Hitachi Chemical Co Ltd CMP polishing slurry and polishing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4132432B2 (ja) * 1999-07-02 2008-08-13 日産化学工業株式会社 研磨用組成物
WO2004053456A2 (en) * 2002-12-09 2004-06-24 Corning Incorporated Method using multi-component colloidal abrasives for cmp processing of semiconductor and optical materials
US20060196849A1 (en) * 2005-03-04 2006-09-07 Kevin Moeggenborg Composition and method for polishing a sapphire surface
JP2008044078A (ja) 2006-08-18 2008-02-28 Sumitomo Metal Mining Co Ltd サファイア基板の研磨方法
RU2422259C2 (ru) * 2006-12-28 2011-06-27 Сэнт-Гобэн Керамикс Энд Пластикс, Инк. Способ механической обработки сапфировой подложки
WO2009046296A1 (en) * 2007-10-05 2009-04-09 Saint-Gobain Ceramics & Plastics, Inc. Polishing of sapphire with composite slurries

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201113358A (en) * 2009-08-19 2011-04-16 Hitachi Chemical Co Ltd CMP polishing slurry and polishing method

Also Published As

Publication number Publication date
CN105027267A (zh) 2015-11-04
US9879156B2 (en) 2018-01-30
US20160002500A1 (en) 2016-01-07
KR20150120980A (ko) 2015-10-28
JP2014187348A (ja) 2014-10-02
JP6436517B2 (ja) 2018-12-12
WO2014129328A1 (ja) 2014-08-28
RU2646938C2 (ru) 2018-03-12
TW201446952A (zh) 2014-12-16
RU2015139807A (ru) 2017-03-27
KR102176147B1 (ko) 2020-11-10

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