MY186105A - Polishing composition - Google Patents
Polishing compositionInfo
- Publication number
- MY186105A MY186105A MYPI2015703422A MYPI2015703422A MY186105A MY 186105 A MY186105 A MY 186105A MY PI2015703422 A MYPI2015703422 A MY PI2015703422A MY PI2015703422 A MYPI2015703422 A MY PI2015703422A MY 186105 A MY186105 A MY 186105A
- Authority
- MY
- Malaysia
- Prior art keywords
- abrasives
- polishing composition
- less
- silica
- polished
- Prior art date
Links
Abstract
To provide a polishing composition capable of achieving a high polishing rate and a surface accuracy of a surface to be polished sufficient in practice, by using silica abrasives. The polishing composition disclosed here includes abrasives, an acid, and water. The abrasives include silica abrasives A that are other than colloidal silica and have a specific surface area of 2 m2/g or more and 60 m2/g or less and an average particle diameter of 50 nm or more and 15,000 nm or less.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014201431A JP6559410B2 (en) | 2014-09-30 | 2014-09-30 | Polishing composition |
Publications (1)
Publication Number | Publication Date |
---|---|
MY186105A true MY186105A (en) | 2021-06-22 |
Family
ID=55864051
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2015703422A MY186105A (en) | 2014-09-30 | 2015-09-28 | Polishing composition |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6559410B2 (en) |
MY (1) | MY186105A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11781039B2 (en) * | 2016-12-26 | 2023-10-10 | Fujimi Incorporated | Polishing composition and polishing method |
CN110546221B (en) * | 2017-02-24 | 2022-02-22 | 伊鲁米那股份有限公司 | Calcium carbonate slurry |
EP3780069A4 (en) * | 2018-03-28 | 2022-04-06 | Fujimi Incorporated | Gallium compound semiconductor substrate polishing composition |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2656400B2 (en) * | 1991-06-27 | 1997-09-24 | 日本シリカ工業株式会社 | Surface precision abrasive for hard and brittle materials |
JP3719688B2 (en) * | 1995-08-01 | 2005-11-24 | 東ソー・シリカ株式会社 | Method for producing fine powder precipitated silicic acid having abrasiveness |
JP3810588B2 (en) * | 1998-06-22 | 2006-08-16 | 株式会社フジミインコーポレーテッド | Polishing composition |
US6447693B1 (en) * | 1998-10-21 | 2002-09-10 | W. R. Grace & Co.-Conn. | Slurries of abrasive inorganic oxide particles and method for polishing copper containing surfaces |
US6656241B1 (en) * | 2001-06-14 | 2003-12-02 | Ppg Industries Ohio, Inc. | Silica-based slurry |
US20060140877A1 (en) * | 2004-12-23 | 2006-06-29 | Mcgill Patrick D | Methods of producing improved cleaning abrasives for dentifrices |
JP2010034387A (en) * | 2008-07-30 | 2010-02-12 | Sumco Corp | Method of manufacturing semiconductor wafer |
JP2012116734A (en) * | 2010-12-03 | 2012-06-21 | Jgc Catalysts & Chemicals Ltd | Crystalline silica sol and method for producing the same |
JP2012155785A (en) * | 2011-01-25 | 2012-08-16 | Showa Denko Kk | Method for manufacturing substrate for magnetic recording medium |
DE112013005268T5 (en) * | 2012-11-02 | 2015-09-24 | Fujimi Incorporated | polishing composition |
JP6259182B2 (en) * | 2012-12-12 | 2018-01-10 | 株式会社フジミインコーポレーテッド | Polishing liquid for primary polishing of magnetic disk substrate with nickel phosphorus plating |
JP6092623B2 (en) * | 2012-12-28 | 2017-03-08 | 花王株式会社 | Manufacturing method of magnetic disk substrate |
-
2014
- 2014-09-30 JP JP2014201431A patent/JP6559410B2/en active Active
-
2015
- 2015-09-28 MY MYPI2015703422A patent/MY186105A/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP6559410B2 (en) | 2019-08-14 |
JP2016069552A (en) | 2016-05-09 |
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