JP2015216334A5 - - Google Patents
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- JP2015216334A5 JP2015216334A5 JP2014129952A JP2014129952A JP2015216334A5 JP 2015216334 A5 JP2015216334 A5 JP 2015216334A5 JP 2014129952 A JP2014129952 A JP 2014129952A JP 2014129952 A JP2014129952 A JP 2014129952A JP 2015216334 A5 JP2015216334 A5 JP 2015216334A5
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- signal processing
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- devices
- imaging
- imaging device
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- 238000003384 imaging method Methods 0.000 description 11
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (16)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014129952A JP6245474B2 (ja) | 2014-04-21 | 2014-06-25 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
| TW104111027A TWI667779B (zh) | 2014-04-21 | 2015-04-02 | 固態成像裝置,固態成像裝置之製造方法及電子設備 |
| CN201911263833.6A CN110957339B (zh) | 2014-04-21 | 2015-04-09 | 固态成像装置和电子设备 |
| KR1020227009868A KR102506010B1 (ko) | 2014-04-21 | 2015-04-09 | 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기 |
| KR1020257015066A KR20250069695A (ko) | 2014-04-21 | 2015-04-09 | 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기 |
| KR1020167028470A KR102383181B1 (ko) | 2014-04-21 | 2015-04-09 | 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기 |
| KR1020237007336A KR102678404B1 (ko) | 2014-04-21 | 2015-04-09 | 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기 |
| PCT/JP2015/001990 WO2015162867A1 (en) | 2014-04-21 | 2015-04-09 | Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus |
| EP15718634.7A EP3134918B1 (en) | 2014-04-21 | 2015-04-09 | Solid-state imaging device and manufacturing method of solid-state imaging device |
| KR1020247020532A KR102807159B1 (ko) | 2014-04-21 | 2015-04-09 | 고체 촬상 소자, 고체 촬상 소자의 제조 방법, 및, 전자 기기 |
| US15/302,705 US10217785B2 (en) | 2014-04-21 | 2015-04-09 | Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus |
| EP19181062.1A EP3565001B1 (en) | 2014-04-21 | 2015-04-09 | Solid-state imaging device and manufacturing method of solid-state imaging device |
| CN201580006012.8A CN105940493B (zh) | 2014-04-21 | 2015-04-09 | 固态成像装置、固态成像装置的制造方法和电子设备 |
| US16/284,716 US10811454B2 (en) | 2014-04-21 | 2019-02-25 | Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus |
| US17/014,891 US12046619B2 (en) | 2014-04-21 | 2020-09-08 | Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus |
| US18/744,050 US20240332336A1 (en) | 2014-04-21 | 2024-06-14 | Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014087603 | 2014-04-21 | ||
| JP2014087603 | 2014-04-21 | ||
| JP2014129952A JP6245474B2 (ja) | 2014-04-21 | 2014-06-25 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015216334A JP2015216334A (ja) | 2015-12-03 |
| JP2015216334A5 true JP2015216334A5 (enExample) | 2017-03-23 |
| JP6245474B2 JP6245474B2 (ja) | 2017-12-13 |
Family
ID=53005615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014129952A Active JP6245474B2 (ja) | 2014-04-21 | 2014-06-25 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US10217785B2 (enExample) |
| EP (2) | EP3565001B1 (enExample) |
| JP (1) | JP6245474B2 (enExample) |
| KR (5) | KR102678404B1 (enExample) |
| CN (2) | CN105940493B (enExample) |
| TW (1) | TWI667779B (enExample) |
| WO (1) | WO2015162867A1 (enExample) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6245474B2 (ja) | 2014-04-21 | 2017-12-13 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
| US10847077B2 (en) * | 2015-06-05 | 2020-11-24 | Apple Inc. | Emission control apparatuses and methods for a display panel |
| KR102376504B1 (ko) * | 2015-07-02 | 2022-03-18 | 삼성전자주식회사 | 반도체 소자 |
| US9640108B2 (en) | 2015-08-25 | 2017-05-02 | X-Celeprint Limited | Bit-plane pulse width modulated digital display system |
| US10091446B2 (en) | 2015-12-23 | 2018-10-02 | X-Celeprint Limited | Active-matrix displays with common pixel control |
| US9930277B2 (en) * | 2015-12-23 | 2018-03-27 | X-Celeprint Limited | Serial row-select matrix-addressed system |
| US9928771B2 (en) | 2015-12-24 | 2018-03-27 | X-Celeprint Limited | Distributed pulse width modulation control |
| WO2017149845A1 (ja) * | 2016-02-29 | 2017-09-08 | ソニー株式会社 | 半導体装置 |
| JP6494551B2 (ja) | 2016-03-28 | 2019-04-03 | アンリツ株式会社 | 電界強度分布測定装置及び電界強度分布測定方法 |
| JP6919154B2 (ja) * | 2016-03-31 | 2021-08-18 | ソニーグループ株式会社 | 固体撮像素子、撮像装置、および電子機器 |
| JP2017183658A (ja) | 2016-03-31 | 2017-10-05 | ソニー株式会社 | 固体撮像素子、撮像装置、および電子機器 |
| US10360846B2 (en) | 2016-05-10 | 2019-07-23 | X-Celeprint Limited | Distributed pulse-width modulation system with multi-bit digital storage and output device |
| US10453826B2 (en) | 2016-06-03 | 2019-10-22 | X-Celeprint Limited | Voltage-balanced serial iLED pixel and display |
| CN106454162B (zh) * | 2016-09-06 | 2019-05-31 | 豪威科技(上海)有限公司 | 堆栈式cmos图像传感器及其制造方法 |
| JP7055544B2 (ja) * | 2016-11-29 | 2022-04-18 | ソニーセミコンダクタソリューションズ株式会社 | センサチップおよび電子機器 |
| JP2018101966A (ja) * | 2016-12-22 | 2018-06-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、電子機器、および、固体撮像素子の制御方法 |
| US10832609B2 (en) * | 2017-01-10 | 2020-11-10 | X Display Company Technology Limited | Digital-drive pulse-width-modulated output system |
| US10070090B2 (en) * | 2017-02-03 | 2018-09-04 | SmartSens Technology (U.S.), Inc. | Stacked image sensor pixel cell with selectable shutter modes and in-pixel CDS |
| JP6928746B2 (ja) * | 2017-04-10 | 2021-09-01 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の製造方法、および電子機器 |
| CN110741476B (zh) * | 2017-06-29 | 2023-12-15 | 索尼半导体解决方案公司 | 晶片接合的背照式成像器 |
| TWI649864B (zh) * | 2017-06-30 | 2019-02-01 | 香港商京鷹科技股份有限公司 | 影像感測裝置及影像感測方法 |
| KR102356913B1 (ko) * | 2017-07-03 | 2022-02-03 | 에스케이하이닉스 주식회사 | 이미지 센서 |
| JP7102119B2 (ja) * | 2017-09-29 | 2022-07-19 | キヤノン株式会社 | 半導体装置および機器 |
| US11902696B2 (en) | 2017-10-03 | 2024-02-13 | Sony Semiconductor Solutions Corporation | Infrared imaging device including drive and signal lines configured to electrically connect first and second substrates |
| TWI788430B (zh) * | 2017-10-30 | 2023-01-01 | 日商索尼半導體解決方案公司 | 背面照射型之固體攝像裝置、背面照射型之固體攝像裝置之製造方法、攝像裝置及電子機器 |
| US10529757B2 (en) | 2017-12-15 | 2020-01-07 | Atomera Incorporated | CMOS image sensor including pixels with read circuitry having a superlattice |
| US10608027B2 (en) | 2017-12-15 | 2020-03-31 | Atomera Incorporated | Method for making CMOS image sensor including stacked semiconductor chips and image processing circuitry including a superlattice |
| US10529768B2 (en) | 2017-12-15 | 2020-01-07 | Atomera Incorporated | Method for making CMOS image sensor including pixels with read circuitry having a superlattice |
| WO2019118840A1 (en) * | 2017-12-15 | 2019-06-20 | Atomera Incorporated | Cmos image sensor including stacked semiconductor chips and readout circuitry including a superlattice and related methods |
| US10367028B2 (en) | 2017-12-15 | 2019-07-30 | Atomera Incorporated | CMOS image sensor including stacked semiconductor chips and image processing circuitry including a superlattice |
| US10615209B2 (en) * | 2017-12-15 | 2020-04-07 | Atomera Incorporated | CMOS image sensor including stacked semiconductor chips and readout circuitry including a superlattice |
| US10608043B2 (en) | 2017-12-15 | 2020-03-31 | Atomera Incorporation | Method for making CMOS image sensor including stacked semiconductor chips and readout circuitry including a superlattice |
| JP2019165312A (ja) | 2018-03-19 | 2019-09-26 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置および電子機器 |
| JP2019179782A (ja) * | 2018-03-30 | 2019-10-17 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置および半導体装置の製造方法 |
| JP2020047734A (ja) | 2018-09-18 | 2020-03-26 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
| JP7452962B2 (ja) | 2018-11-16 | 2024-03-19 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
| JP7292860B2 (ja) * | 2018-11-22 | 2023-06-19 | キヤノン株式会社 | 光電変換装置 |
| KR102558301B1 (ko) * | 2018-12-13 | 2023-07-24 | 에스케이하이닉스 주식회사 | 유기 픽셀 어레이 및 무기 픽셀 어레이를 갖는 이미지 센싱 디바이스 |
| TWI872085B (zh) * | 2019-06-26 | 2025-02-11 | 日商索尼半導體解決方案公司 | 攝像裝置 |
| CN120676266A (zh) * | 2019-11-01 | 2025-09-19 | 索尼半导体解决方案公司 | 固态摄像装置 |
| JP7523904B2 (ja) | 2019-12-27 | 2024-07-29 | キヤノン株式会社 | 検査装置および半導体装置の製造方法 |
| JP7583562B2 (ja) * | 2020-09-11 | 2024-11-14 | キヤノン株式会社 | 光電変換装置及び撮像システム |
| JP2021061618A (ja) * | 2020-12-15 | 2021-04-15 | 株式会社ニコン | 撮像素子および撮像装置 |
| JP7646380B2 (ja) | 2021-02-04 | 2025-03-17 | キヤノン株式会社 | 光電変換装置、光電変換システム、移動体 |
| US20240145521A1 (en) * | 2021-03-11 | 2024-05-02 | National University Corporation Shizuoka University | Radiation imaging device |
| WO2023132002A1 (ja) * | 2022-01-05 | 2023-07-13 | キヤノン株式会社 | 光電変換装置、光電変換システム、移動体 |
| JP2024003462A (ja) | 2022-06-27 | 2024-01-15 | キヤノン株式会社 | 撮像素子及び撮像装置 |
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| US4497844A (en) | 1980-08-18 | 1985-02-05 | Fryday Corporation | Method for producing a restructured food product |
| JP2902506B2 (ja) | 1990-08-24 | 1999-06-07 | キヤノン株式会社 | 半導体装置の製造方法及び半導体装置 |
| JP4497844B2 (ja) | 2003-05-30 | 2010-07-07 | キヤノン株式会社 | 固体撮像装置の製造方法 |
| JP4816457B2 (ja) * | 2004-09-02 | 2011-11-16 | ソニー株式会社 | 撮像装置及び撮像結果の出力方法 |
| JP4277216B2 (ja) * | 2005-01-13 | 2009-06-10 | ソニー株式会社 | 撮像装置及び撮像結果の処理方法 |
| JP4979893B2 (ja) * | 2005-03-23 | 2012-07-18 | ソニー株式会社 | 物理量分布検知装置並びに物理情報取得方法および物理情報取得装置 |
| TW200913238A (en) * | 2007-06-04 | 2009-03-16 | Sony Corp | Optical member, solid state imaging apparatus, and manufacturing method |
| JP5820979B2 (ja) * | 2008-12-26 | 2015-11-24 | パナソニックIpマネジメント株式会社 | 固体撮像デバイス |
| JP5521721B2 (ja) * | 2009-08-28 | 2014-06-18 | ソニー株式会社 | 撮像素子およびカメラシステム |
| KR101411800B1 (ko) * | 2009-12-26 | 2014-06-24 | 캐논 가부시끼가이샤 | 고체 촬상 장치 및 촬상 시스템 |
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| CA2835870A1 (en) * | 2011-05-12 | 2012-11-15 | Olive Medical Corporation | Pixel array area optimization using stacking scheme for hybrid image sensor with minimal vertical interconnects |
| JP5953974B2 (ja) * | 2011-09-15 | 2016-07-20 | 富士通セミコンダクター株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP2013172014A (ja) * | 2012-02-21 | 2013-09-02 | Sony Corp | 固体撮像装置およびその製造方法、並びにカメラシステム |
| JP2013182943A (ja) * | 2012-02-29 | 2013-09-12 | Canon Inc | 固体撮像装置の製造方法 |
| JP2013197113A (ja) * | 2012-03-15 | 2013-09-30 | Sony Corp | 固体撮像装置およびカメラシステム |
| US8878325B2 (en) * | 2012-07-31 | 2014-11-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Elevated photodiode with a stacked scheme |
| TWI595637B (zh) * | 2012-09-28 | 2017-08-11 | 新力股份有限公司 | 半導體裝置及電子機器 |
| JP6245474B2 (ja) | 2014-04-21 | 2017-12-13 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器 |
-
2014
- 2014-06-25 JP JP2014129952A patent/JP6245474B2/ja active Active
-
2015
- 2015-04-02 TW TW104111027A patent/TWI667779B/zh not_active IP Right Cessation
- 2015-04-09 US US15/302,705 patent/US10217785B2/en active Active
- 2015-04-09 CN CN201580006012.8A patent/CN105940493B/zh not_active Expired - Fee Related
- 2015-04-09 WO PCT/JP2015/001990 patent/WO2015162867A1/en not_active Ceased
- 2015-04-09 KR KR1020237007336A patent/KR102678404B1/ko active Active
- 2015-04-09 KR KR1020257015066A patent/KR20250069695A/ko active Pending
- 2015-04-09 EP EP19181062.1A patent/EP3565001B1/en active Active
- 2015-04-09 CN CN201911263833.6A patent/CN110957339B/zh active Active
- 2015-04-09 KR KR1020247020532A patent/KR102807159B1/ko active Active
- 2015-04-09 KR KR1020227009868A patent/KR102506010B1/ko active Active
- 2015-04-09 EP EP15718634.7A patent/EP3134918B1/en active Active
- 2015-04-09 KR KR1020167028470A patent/KR102383181B1/ko active Active
-
2019
- 2019-02-25 US US16/284,716 patent/US10811454B2/en active Active
-
2020
- 2020-09-08 US US17/014,891 patent/US12046619B2/en active Active
-
2024
- 2024-06-14 US US18/744,050 patent/US20240332336A1/en active Pending
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