TWI667779B - 固態成像裝置，固態成像裝置之製造方法及電子設備 - Google Patents

固態成像裝置，固態成像裝置之製造方法及電子設備 Download PDF

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Publication number
TWI667779B
TWI667779B TW104111027A TW104111027A TWI667779B TW I667779 B TWI667779 B TW I667779B TW 104111027 A TW104111027 A TW 104111027A TW 104111027 A TW104111027 A TW 104111027A TW I667779 B TWI667779 B TW I667779B
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TW
Taiwan
Prior art keywords
signal processing
pixel
processing circuit
imaging device
solid
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TW104111027A
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English (en)
Chinese (zh)
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TW201541622A (zh
Inventor
泉原邦彦
Kunihiko Izuhara
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日商新力股份有限公司
Sony Corporation
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Publication of TW201541622A publication Critical patent/TW201541622A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/018—Manufacture or treatment of image sensors covered by group H10F39/12 of hybrid image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/199—Back-illuminated image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
TW104111027A 2014-04-21 2015-04-02 固態成像裝置，固態成像裝置之製造方法及電子設備 TWI667779B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2014-087603 2014-04-21
JP2014087603 2014-04-21
JP2014-129952 2014-06-25
JP2014129952A JP6245474B2 (ja) 2014-04-21 2014-06-25 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器

Publications (2)

Publication Number Publication Date
TW201541622A TW201541622A (zh) 2015-11-01
TWI667779B true TWI667779B (zh) 2019-08-01

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Country Status (7)

Country Link
US (4) US10217785B2 (enExample)
EP (2) EP3565001B1 (enExample)
JP (1) JP6245474B2 (enExample)
KR (5) KR102678404B1 (enExample)
CN (2) CN105940493B (enExample)
TW (1) TWI667779B (enExample)
WO (1) WO2015162867A1 (enExample)

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Also Published As

Publication number Publication date
EP3134918A1 (en) 2017-03-01
JP2015216334A (ja) 2015-12-03
JP6245474B2 (ja) 2017-12-13
US20190189666A1 (en) 2019-06-20
US20170040371A1 (en) 2017-02-09
KR20160145577A (ko) 2016-12-20
KR102506010B1 (ko) 2023-03-06
EP3565001B1 (en) 2022-07-20
US20240332336A1 (en) 2024-10-03
US10217785B2 (en) 2019-02-26
KR20230035463A (ko) 2023-03-13
EP3134918B1 (en) 2019-06-19
KR102383181B1 (ko) 2022-04-06
US10811454B2 (en) 2020-10-20
TW201541622A (zh) 2015-11-01
WO2015162867A1 (en) 2015-10-29
KR102678404B1 (ko) 2024-06-27
EP3565001A1 (en) 2019-11-06
KR20250069695A (ko) 2025-05-19
KR102807159B1 (ko) 2025-05-14
KR20240100469A (ko) 2024-07-01
CN105940493B (zh) 2019-12-17
US12046619B2 (en) 2024-07-23
CN110957339A (zh) 2020-04-03
US20200403020A1 (en) 2020-12-24
CN110957339B (zh) 2024-02-13
KR20220042251A (ko) 2022-04-04
CN105940493A (zh) 2016-09-14

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