JP2015211155A - 半導体受光素子、半導体受光素子を作製する方法 - Google Patents
半導体受光素子、半導体受光素子を作製する方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 188
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 150000001875 compounds Chemical class 0.000 claims abstract description 71
- 238000002161 passivation Methods 0.000 claims abstract description 64
- 150000004767 nitrides Chemical class 0.000 claims abstract description 62
- 239000000470 constituent Substances 0.000 claims abstract description 47
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 29
- 239000001301 oxygen Substances 0.000 claims abstract description 29
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 27
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 17
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000758 substrate Substances 0.000 claims description 58
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 36
- 230000031700 light absorption Effects 0.000 claims description 29
- 229910052757 nitrogen Inorganic materials 0.000 claims description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 19
- 229910052710 silicon Inorganic materials 0.000 claims description 19
- 239000010703 silicon Substances 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 12
- -1 nitrogen ions Chemical class 0.000 claims description 8
- 239000012212 insulator Substances 0.000 claims description 7
- 239000012528 membrane Substances 0.000 abstract 3
- 239000010410 layer Substances 0.000 description 166
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 40
- 229910005542 GaSb Inorganic materials 0.000 description 38
- 229910000673 Indium arsenide Inorganic materials 0.000 description 26
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 26
- 235000012239 silicon dioxide Nutrition 0.000 description 20
- 239000000377 silicon dioxide Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 239000013078 crystal Substances 0.000 description 12
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 238000001312 dry etching Methods 0.000 description 8
- 239000003362 semiconductor superlattice Substances 0.000 description 7
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 6
- 238000001039 wet etching Methods 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 229910052785 arsenic Inorganic materials 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052733 gallium Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910052738 indium Inorganic materials 0.000 description 4
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 4
- 238000000851 scanning transmission electron micrograph Methods 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000005121 nitriding Methods 0.000 description 3
- 150000002829 nitrogen Chemical class 0.000 description 3
- 239000001272 nitrous oxide Substances 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- 238000000724 energy-dispersive X-ray spectrum Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 238000001000 micrograph Methods 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 150000002831 nitrogen free-radicals Chemical class 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000009832 plasma treatment Methods 0.000 description 2
- 238000004451 qualitative analysis Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- UYJXRRSPUVSSMN-UHFFFAOYSA-P ammonium sulfide Chemical compound [NH4+].[NH4+].[S-2] UYJXRRSPUVSSMN-UHFFFAOYSA-P 0.000 description 1
- 229910021418 black silicon Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- PZPGRFITIJYNEJ-UHFFFAOYSA-N disilane Chemical compound [SiH3][SiH3] PZPGRFITIJYNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- WPYVAWXEWQSOGY-UHFFFAOYSA-N indium antimonide Chemical compound [Sb]#[In] WPYVAWXEWQSOGY-UHFFFAOYSA-N 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000005596 ionic collisions Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0352—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their shape or by the shapes, relative sizes or disposition of the semiconductor regions
- H01L31/035236—Superlattices; Multiple quantum well structures
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- H01L31/101—Devices sensitive to infrared, visible or ultraviolet radiation
- H01L31/102—Devices sensitive to infrared, visible or ultraviolet radiation characterised by only one potential barrier or surface barrier
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- H01L31/184—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof the active layers comprising only AIIIBV compounds, e.g. GaAs, InP
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Abstract
【解決手段】半導体受光素子11は、構成元素として酸素を含むパッシベーション膜15とメサ構造13の側面13aとの間に窒化層17を有する。窒化層17は、III−V族化合物半導体の構成元素の窒化物を備える。半導体層の構成元素としてのアンチモンは酸化されやすいけれども、窒化層17により、第1化合物半導体層31及び第2化合物半導体層33がパッシベーション膜15の構成元素としての酸素から隔てられる。この窒化層17の配置により、パッシベーション膜15の構成元素としての酸素が、第1化合物半導体層31及び第2化合物半導体層33に接することを回避できる。
【選択図】図1
Description
フォトダイオードのメサ構造の側面とこの側面上のパッシベーション膜とに係る界面にはダングリングボンドが形成される。ダングリングボンドは電子を捕獲するので、上記の界面は電流のリークパスになり得る。このパスに流れるリーク電流は、受光素子、例えば中赤外イメージセンサのような受光素子において暗電流として観察される。
第1導電型半導体領域25:p型半導体 GaSb。
第2導電型半導体領域27:n型半導体 GaSb。
図1には基板側からN-I-Pの積層構造を示すが、p基板(例えばノンドープのGaSb基板)を用いて基板側からP-I-N積層構造としてもよい。
光吸収層23:超格子構造35。
第1化合物半導体層31:GaSb。
第2化合物半導体層33:InAs。
パッシベーション膜:SiO2。
図2を参照しながら、メサ型中赤外イメージセンサの作製を説明する。成長用の基板を準備する。この基板として、例えばGaSb基板51、InAs基板、GaSb基板、InP基板等を用いることができる。本実施例では、図2の(a)部に示されるように、N型GaSb基板51上に半導体積層53を形成する。半導体積層53は、光吸収層53aのための超格子構造と、この光吸収層53aを挟むp型半導体層及びn型半導体層とを含む。引き続く説明では、p型半導体層及びn型半導体層の一方を第1層53bとして参照され、他方を第2層53cとして参照される。超格子構造の形成のために、GaSb層及びInAs層を繰り返し成長する。この成長には、例えば分子線エピタキシー成長法が適用される。超格子構造を構成する半導体層(GaSb層及びInAs層の各々)の厚さは、例えば1nm〜10nmの範囲にあることができる。超格子構造を構成する半導体層の繰り返しは、例えば100〜500層であることができる。第1層53bの材料は、例えばN型のGaSbであり、第1層53bの厚さは500nmである。第2層53cの材料は、例えばP型のGaSbであり、第2層53cの厚さは50nmである。
プラズマ放電の条件の例示。
圧力:0.4Torr。
高周波電源の出力:20W(13.56Mhz)。
ステージ温度:摂氏150度。
プラズマ処理時間:30秒。
窒素流量:200sccm(この値はSI系では、1013hPa、摂氏0度の状態で換算して毎分200cm3の流量)。
窒素源として、窒素ガス、アンモニアガス等を用いることができる。活性化された窒素(例えば窒素イオン及び/又は窒素ラジカル)を含む窒素プラズマに、構成元素としてSb及び/又はGaを含む半導体を適用することにより、プラズマ中の活性化窒素が半導体表面の構成元素(例えばIII族元素)と反応して窒化物を形成する。この結果、基板生産物の表面に窒化層59が形成される。発明者の観察によれば、この窒素プラズマの適用により、半導体超格子構造の側面上の非晶質層の表面が平坦化されていた。この平坦化は、半導体層へのイオンの衝突によって生じていると考えられる。本実施例では、窒化層59の厚みは1nm以上であることが好ましく、これにより酸素イオンや酸素ラジカルの半導体層への打ち込みを抑制が可能である。窒化層の厚みは5nm以下であることが好ましく、これにより窒素イオンや窒素ラジカルによるプラズマダメージを低減可能である。
パッシベーション膜61の成膜条件。
亜酸化窒素の流量:100sccm(この値はSI系では、1013hPa、摂氏0度の状態で換算して毎分100cm3の流量)。
シランの流量:2sccm(この値はSI系では、1013hPa、摂氏0度の状態で換算して毎分2cm3の流量)。
チャンバ内圧力:1.7Torr。
高周波出力:20W。
ステージ温度:摂氏150度。
先に形成された窒化層が、酸化剤から供給される酸素に対するバリアとして働いて、半導体の酸化が表面から更に進むことを回避できる。また、窒化層は、シリコンと酸素とを構成元素として含む化合物が、半導体表面に直接に接する自然酸化物(III族酸化物)に接触すること、及びベースの半導体に接触することを避けることを可能にする。
Claims (4)
- 半導体受光素子であって、
半導体領域上に設けられた光吸収層を含むメサ構造と、
前記メサ構造の側面上に設けられたパッシベーション膜と、
前記メサ構造の前記側面と前記パッシベーション膜との間に設けられた窒化層と、
を備え、
前記光吸収層は、交互に配列された第1化合物半導体層及び第2化合物半導体層を含み、
前記第1化合物半導体層は構成元素としてアンチモンを含み、
前記第2化合物半導体層は、前記第1化合物半導体層の材料と異なり、
前記パッシベーション膜は構成元素として酸素を含む、半導体受光素子。 - 前記パッシベーション膜はシリコン系無機絶縁体を備える、請求項1に記載された半導体受光素子。
- 前記半導体領域は基板を含み、該基板はIII−V族化合物半導体を備え、前記基板は主面及び裏面を有し、前記メサ構造は前記基板の前記主面上に設けられ、前記メサ構造の前記光吸収層は前記基板の前記裏面を通して入射する光を受け、
当該半導体受光素子は前記メサ構造の上面上に設けられた電極を更に備え、
前記窒化層及び前記パッシベーション膜は、前記メサ構造の前記側面上から延在して前記メサ構造の前記上面を覆い、前記電極は前記窒化層及び前記パッシベーション膜の開口を介して前記メサ構造の前記上面に接触を成す、請求項1又は請求項2に記載された半導体受光素子。 - 半導体受光素子を作製する方法であって、
光吸収層を含む半導体積層を基板上に成長する工程と、
前記半導体積層をエッチングして、メサを形成する工程と、
窒素イオンを含むプラズマに前記メサをさらして、前記メサの側面の窒化を行う工程と、
前記窒化の後に、基板上にパッシベーション膜を成長する工程と、
を備え、
前記光吸収層は、交互に配列された第1化合物半導体層及び第2化合物半導体層を含み、
前記第1化合物半導体層は構成元素としてアンチモンを含み、
前記第2化合物半導体層は、前記第1化合物半導体層の材料と異なり、
前記パッシベーション膜は構成元素として酸素を含む、半導体受光素子を作製する方法。
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US14/690,128 US9525087B2 (en) | 2014-04-28 | 2015-04-17 | Light receiving device and method for manufacturing light receiving device |
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JP2016111295A (ja) * | 2014-12-10 | 2016-06-20 | 住友電気工業株式会社 | 半導体受光素子を作製する方法、半導体受光素子 |
JP2019029624A (ja) * | 2017-08-03 | 2019-02-21 | 住友電気工業株式会社 | 受光素子 |
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JP2016111294A (ja) * | 2014-12-10 | 2016-06-20 | 住友電気工業株式会社 | 半導体受光素子を作製する方法 |
JP7027969B2 (ja) * | 2018-03-07 | 2022-03-02 | 住友電気工業株式会社 | 半導体受光素子 |
CN113327914A (zh) * | 2021-05-27 | 2021-08-31 | 武汉新芯集成电路制造有限公司 | 半导体器件及其制造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09205254A (ja) * | 1996-01-26 | 1997-08-05 | Mitsubishi Electric Corp | 半導体装置の製造方法および半導体製造装置並びに半導体レーザの製造方法 |
US5880510A (en) * | 1988-05-11 | 1999-03-09 | Raytheon Company | Graded layer passivation of group II-VI infrared photodetectors |
JP2004538652A (ja) * | 2001-08-09 | 2004-12-24 | コムラーセ アクティエボラーグ | 無汚染レーザーミラーおよびそれらの不動態化を得る方法 |
JP2009206357A (ja) * | 2008-02-28 | 2009-09-10 | Asahi Kasei Electronics Co Ltd | 化合物半導体装置及び化合物半導体装置の製造方法 |
US20110260278A1 (en) * | 2010-02-19 | 2011-10-27 | University Of Iowa Research Foundation | System and Method of Planar Processing of Semiconductors into Detector Arrays |
JP2013093385A (ja) * | 2011-10-24 | 2013-05-16 | Sumitomo Electric Ind Ltd | 受光素子、およびその製造方法 |
JP2013125847A (ja) * | 2011-12-14 | 2013-06-24 | Sumitomo Electric Ind Ltd | 受光素子、その製造方法、光学装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011089949A1 (ja) | 2010-01-25 | 2011-07-28 | アイアールスペック株式会社 | 化合物半導体受光素子アレイ |
DE102010024079A1 (de) * | 2010-06-17 | 2011-12-22 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Halbleiterchips und optoelektronischer Halbleiterchip |
US9184202B2 (en) * | 2013-03-15 | 2015-11-10 | Banpil Photonics, Inc. | Broadband image sensor and manufacturing thereof |
-
2014
- 2014-04-28 JP JP2014092655A patent/JP6265032B2/ja active Active
-
2015
- 2015-04-17 US US14/690,128 patent/US9525087B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5880510A (en) * | 1988-05-11 | 1999-03-09 | Raytheon Company | Graded layer passivation of group II-VI infrared photodetectors |
JPH09205254A (ja) * | 1996-01-26 | 1997-08-05 | Mitsubishi Electric Corp | 半導体装置の製造方法および半導体製造装置並びに半導体レーザの製造方法 |
JP2004538652A (ja) * | 2001-08-09 | 2004-12-24 | コムラーセ アクティエボラーグ | 無汚染レーザーミラーおよびそれらの不動態化を得る方法 |
JP2009206357A (ja) * | 2008-02-28 | 2009-09-10 | Asahi Kasei Electronics Co Ltd | 化合物半導体装置及び化合物半導体装置の製造方法 |
US20110260278A1 (en) * | 2010-02-19 | 2011-10-27 | University Of Iowa Research Foundation | System and Method of Planar Processing of Semiconductors into Detector Arrays |
JP2013093385A (ja) * | 2011-10-24 | 2013-05-16 | Sumitomo Electric Ind Ltd | 受光素子、およびその製造方法 |
JP2013125847A (ja) * | 2011-12-14 | 2013-06-24 | Sumitomo Electric Ind Ltd | 受光素子、その製造方法、光学装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016111295A (ja) * | 2014-12-10 | 2016-06-20 | 住友電気工業株式会社 | 半導体受光素子を作製する方法、半導体受光素子 |
JP2019029624A (ja) * | 2017-08-03 | 2019-02-21 | 住友電気工業株式会社 | 受光素子 |
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