JP2015201623A5 - - Google Patents

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Publication number
JP2015201623A5
JP2015201623A5 JP2015017933A JP2015017933A JP2015201623A5 JP 2015201623 A5 JP2015201623 A5 JP 2015201623A5 JP 2015017933 A JP2015017933 A JP 2015017933A JP 2015017933 A JP2015017933 A JP 2015017933A JP 2015201623 A5 JP2015201623 A5 JP 2015201623A5
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JP
Japan
Prior art keywords
degree
degrees
diffraction
reflector
range
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JP2015017933A
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English (en)
Japanese (ja)
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JP2015201623A (ja
JP5920497B2 (ja
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Application filed filed Critical
Priority claimed from JP2015017933A external-priority patent/JP5920497B2/ja
Priority to JP2015017933A priority Critical patent/JP5920497B2/ja
Priority to KR1020167026854A priority patent/KR20160140660A/ko
Priority to US15/129,848 priority patent/US10411174B2/en
Priority to CN201580017903.3A priority patent/CN106133929B/zh
Priority to PCT/JP2015/059784 priority patent/WO2015152097A1/ja
Priority to TW104110278A priority patent/TW201601353A/zh
Publication of JP2015201623A publication Critical patent/JP2015201623A/ja
Publication of JP2015201623A5 publication Critical patent/JP2015201623A5/ja
Publication of JP5920497B2 publication Critical patent/JP5920497B2/ja
Application granted granted Critical
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015017933A 2014-03-31 2015-01-30 半導体発光装置及び光半導体実装用基板 Expired - Fee Related JP5920497B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2015017933A JP5920497B2 (ja) 2014-03-31 2015-01-30 半導体発光装置及び光半導体実装用基板
PCT/JP2015/059784 WO2015152097A1 (ja) 2014-03-31 2015-03-27 半導体発光装置及び光半導体実装用基板
US15/129,848 US10411174B2 (en) 2014-03-31 2015-03-27 Semiconductor light-emitting device and optical-semiconductor-mounting substrate
CN201580017903.3A CN106133929B (zh) 2014-03-31 2015-03-27 半导体发光装置及光半导体安装用基板
KR1020167026854A KR20160140660A (ko) 2014-03-31 2015-03-27 반도체 발광 장치 및 광 반도체 실장용 기판
TW104110278A TW201601353A (zh) 2014-03-31 2015-03-30 半導體發光裝置及光半導體安裝用基板

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014074828 2014-03-31
JP2014074828 2014-03-31
JP2015017933A JP5920497B2 (ja) 2014-03-31 2015-01-30 半導体発光装置及び光半導体実装用基板

Publications (3)

Publication Number Publication Date
JP2015201623A JP2015201623A (ja) 2015-11-12
JP2015201623A5 true JP2015201623A5 (enExample) 2015-12-24
JP5920497B2 JP5920497B2 (ja) 2016-05-18

Family

ID=54240420

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015017933A Expired - Fee Related JP5920497B2 (ja) 2014-03-31 2015-01-30 半導体発光装置及び光半導体実装用基板

Country Status (6)

Country Link
US (1) US10411174B2 (enExample)
JP (1) JP5920497B2 (enExample)
KR (1) KR20160140660A (enExample)
CN (1) CN106133929B (enExample)
TW (1) TW201601353A (enExample)
WO (1) WO2015152097A1 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102221601B1 (ko) * 2014-10-17 2021-03-02 엘지이노텍 주식회사 발광 소자 패키지 및 이를 포함하는 발광 모듈
US10164159B2 (en) * 2016-12-20 2018-12-25 Samsung Electronics Co., Ltd. Light-emitting diode package and method of manufacturing the same
JP2020055910A (ja) * 2018-09-28 2020-04-09 日亜化学工業株式会社 樹脂組成物、及び発光装置
WO2020232668A1 (en) * 2019-05-22 2020-11-26 Cree Huizhou Solid State Lighting Company Limited Arrangements for light emitting diode packages
TWI692816B (zh) * 2019-05-22 2020-05-01 友達光電股份有限公司 顯示裝置及其製作方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0560707A (ja) 1991-09-02 1993-03-12 Nippon Steel Corp 石炭の膨張性試験方法
JP2006070252A (ja) * 2004-08-03 2006-03-16 Mitsui Chemicals Inc ポリ４−メチル−１−ペンテン樹脂組成物、フィルムおよび電子部品封止体製造用型枠
JP5060707B2 (ja) 2004-11-10 2012-10-31 日立化成工業株式会社 光反射用熱硬化性樹脂組成物
CN101400492B (zh) * 2006-03-20 2012-07-25 三井化学株式会社 光学膜及其制造方法
JP2008144155A (ja) * 2006-11-14 2008-06-26 Mitsui Chemicals Inc ４−メチル−１−ペンテン系ランダム共重合体およびその製造方法ならびに該共重合体を含む組成物
EP2476731B1 (en) 2009-09-07 2016-07-20 Kuraray Co., Ltd. Reflector for led and light-emitting device equipped with same
JP5416629B2 (ja) 2010-03-19 2014-02-12 住友電気工業株式会社 白色樹脂成形体及びｌｅｄ用リフレクタ
JP5545246B2 (ja) * 2010-03-30 2014-07-09 信越化学工業株式会社 樹脂組成物及び発光半導体素子用リフレクター、及び発光半導体装置
US8704439B2 (en) * 2010-09-07 2014-04-22 Ube Material Industries, Ltd. Blue-light-emitting phosphor and light-emitting device equipped with the blue-light-emitting phosphor
JP2013077794A (ja) * 2011-09-16 2013-04-25 Sekisui Chem Co Ltd 光半導体装置
US9975284B2 (en) * 2012-01-17 2018-05-22 Dai Nipon Printing Co., Ltd. Electron beam curable resin composition, resin frame for reflectors, reflector, semiconductor light emitting device, and method for producing molded body
JP5970941B2 (ja) * 2012-04-27 2016-08-17 大日本印刷株式会社 光反射積層体及び半導体発光装置
JP2013243294A (ja) * 2012-05-22 2013-12-05 Kaneka Corp 半導体パッケージの製造方法
JP5932494B2 (ja) * 2012-06-01 2016-06-08 日亜化学工業株式会社 発光素子載置用基板及び発光装置
JP2014199285A (ja) * 2013-03-29 2014-10-23 積水化成品工業株式会社 光反射板

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