JP2015195272A - 半導体装置及び半導体装置の製造方法 - Google Patents

半導体装置及び半導体装置の製造方法 Download PDF

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Publication number
JP2015195272A
JP2015195272A JP2014072410A JP2014072410A JP2015195272A JP 2015195272 A JP2015195272 A JP 2015195272A JP 2014072410 A JP2014072410 A JP 2014072410A JP 2014072410 A JP2014072410 A JP 2014072410A JP 2015195272 A JP2015195272 A JP 2015195272A
Authority
JP
Japan
Prior art keywords
substrate
semiconductor device
wiring
groove
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014072410A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015195272A5 (enExample
Inventor
朋治 藤井
Tomoharu Fujii
朋治 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2014072410A priority Critical patent/JP2015195272A/ja
Priority to US14/672,611 priority patent/US9977074B2/en
Priority to EP15162016.8A priority patent/EP2927702A1/en
Publication of JP2015195272A publication Critical patent/JP2015195272A/ja
Publication of JP2015195272A5 publication Critical patent/JP2015195272A5/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2818—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] using test structures on, or modifications of, the card under test, made for the purpose of testing, e.g. additional components or connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15192—Resurf arrangement of the internal vias
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09127—PCB or component having an integral separable or breakable part
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0989—Coating free areas, e.g. areas other than pads or lands free of solder resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/175—Configurations of connections suitable for easy deletion, e.g. modifiable circuits or temporary conductors for electroplating; Processes for deleting connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2014072410A 2014-03-31 2014-03-31 半導体装置及び半導体装置の製造方法 Pending JP2015195272A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014072410A JP2015195272A (ja) 2014-03-31 2014-03-31 半導体装置及び半導体装置の製造方法
US14/672,611 US9977074B2 (en) 2014-03-31 2015-03-30 Semiconductor device, semiconductor apparatus and method for manufacturing semiconductor device
EP15162016.8A EP2927702A1 (en) 2014-03-31 2015-03-31 Semiconductor device with removable wiring board portion for evaluation and corresponding method of manufacturing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014072410A JP2015195272A (ja) 2014-03-31 2014-03-31 半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2015195272A true JP2015195272A (ja) 2015-11-05
JP2015195272A5 JP2015195272A5 (enExample) 2017-01-26

Family

ID=53682428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014072410A Pending JP2015195272A (ja) 2014-03-31 2014-03-31 半導体装置及び半導体装置の製造方法

Country Status (3)

Country Link
US (1) US9977074B2 (enExample)
EP (1) EP2927702A1 (enExample)
JP (1) JP2015195272A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107202948A (zh) * 2016-03-18 2017-09-26 景硕科技股份有限公司 高测试密度的电路测试板
KR20190030839A (ko) * 2017-09-15 2019-03-25 엘지디스플레이 주식회사 전계 발광 표시 장치 및 전계 발광 표시 장치용 드라이버 ic 필름부
JP2020194801A (ja) * 2019-05-24 2020-12-03 新光電気工業株式会社 半導体装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015102866B4 (de) 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
KR20170009652A (ko) * 2015-07-17 2017-01-25 삼성전자주식회사 배선 기판 및 이를 포함하는 메모리 시스템
JP6815880B2 (ja) * 2017-01-25 2021-01-20 株式会社ディスコ 半導体パッケージの製造方法

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181177U (enExample) * 1984-10-31 1986-05-29
JPS61107238U (enExample) * 1984-12-17 1986-07-08
JPS63131160U (enExample) * 1987-02-17 1988-08-26
JPH0197575U (enExample) * 1987-12-22 1989-06-29
JPH07297507A (ja) * 1994-04-22 1995-11-10 Matsushita Electric Works Ltd プリント基板
JP2002164625A (ja) * 2000-11-27 2002-06-07 Sony Corp プリント配線基板及びプリント配線基板の信頼性試験方法
JP2005072256A (ja) * 2003-08-25 2005-03-17 Sharp Corp 基板、多層基板の製造方法および衛星放送受信装置
JP2005332975A (ja) * 2004-05-20 2005-12-02 Matsushita Electric Ind Co Ltd 回路基板
JP2007134411A (ja) * 2005-11-08 2007-05-31 Fujifilm Corp 多面取り基板
JP2012059793A (ja) * 2010-09-07 2012-03-22 Ccs Inc Ｌｅｄ配線基板及び光照射装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181177A (ja) 1984-09-26 1986-04-24 Toshiba Corp 交直変換装置の電力制御装置
JPS63131160A (ja) 1986-11-20 1988-06-03 Matsushita Electric Ind Co Ltd 現像装置
JPH0197575A (ja) 1987-10-08 1989-04-17 Babcock Hitachi Kk スタッドボルト着脱移送装置
JP3544168B2 (ja) * 2000-04-25 2004-07-21 松下電器産業株式会社 電子装置及びその製造方法
TW561263B (en) 2001-03-10 2003-11-11 Samsung Electronics Co Ltd Parallel test board used in testing semiconductor memory devices
DE602005003455T2 (de) 2005-05-12 2008-10-02 Harman Becker Automotive Systems Gmbh Elektronische Vorrichtung
TWI312568B (en) 2006-10-17 2009-07-21 Advanced Semiconductor Eng Substrate board and manufacturing method of package structure
US8362793B2 (en) * 2006-11-07 2013-01-29 Apple Inc. Circuit boards including removable test point portions and configurable testing platforms
US7863918B2 (en) * 2007-11-13 2011-01-04 International Business Machines Corporation Disposable built-in self-test devices, systems and methods for testing three dimensional integrated circuits
JP2012009586A (ja) * 2010-06-24 2012-01-12 Shinko Electric Ind Co Ltd 配線基板、半導体装置及び配線基板の製造方法
US9640456B2 (en) * 2013-03-15 2017-05-02 Taiwan Semiconductor Manufacturing Company Limited Support structure for integrated circuitry

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6181177U (enExample) * 1984-10-31 1986-05-29
JPS61107238U (enExample) * 1984-12-17 1986-07-08
JPS63131160U (enExample) * 1987-02-17 1988-08-26
JPH0197575U (enExample) * 1987-12-22 1989-06-29
JPH07297507A (ja) * 1994-04-22 1995-11-10 Matsushita Electric Works Ltd プリント基板
JP2002164625A (ja) * 2000-11-27 2002-06-07 Sony Corp プリント配線基板及びプリント配線基板の信頼性試験方法
JP2005072256A (ja) * 2003-08-25 2005-03-17 Sharp Corp 基板、多層基板の製造方法および衛星放送受信装置
JP2005332975A (ja) * 2004-05-20 2005-12-02 Matsushita Electric Ind Co Ltd 回路基板
JP2007134411A (ja) * 2005-11-08 2007-05-31 Fujifilm Corp 多面取り基板
JP2012059793A (ja) * 2010-09-07 2012-03-22 Ccs Inc Ｌｅｄ配線基板及び光照射装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107202948A (zh) * 2016-03-18 2017-09-26 景硕科技股份有限公司 高测试密度的电路测试板
CN107202948B (zh) * 2016-03-18 2019-09-24 景硕科技股份有限公司 高测试密度的电路测试板
KR20190030839A (ko) * 2017-09-15 2019-03-25 엘지디스플레이 주식회사 전계 발광 표시 장치 및 전계 발광 표시 장치용 드라이버 ic 필름부
KR102328314B1 (ko) 2017-09-15 2021-11-17 엘지디스플레이 주식회사 전계 발광 표시 장치 및 전계 발광 표시 장치용 드라이버 ic 필름부
JP2020194801A (ja) * 2019-05-24 2020-12-03 新光電気工業株式会社 半導体装置
JP7196014B2 (ja) 2019-05-24 2022-12-26 新光電気工業株式会社 半導体装置

Also Published As

Publication number Publication date
EP2927702A1 (en) 2015-10-07
US9977074B2 (en) 2018-05-22
US20150282325A1 (en) 2015-10-01

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