JP2015181181A - 電子装置および電子装置の製造方法 - Google Patents
電子装置および電子装置の製造方法 Download PDFInfo
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- 238000004519 manufacturing process Methods 0.000 title description 3
- 239000000463 material Substances 0.000 claims abstract description 111
- 239000011248 coating agent Substances 0.000 claims abstract description 62
- 238000000576 coating method Methods 0.000 claims abstract description 62
- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 230000005693 optoelectronics Effects 0.000 claims description 92
- 229910000679 solder Inorganic materials 0.000 claims description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 238000002310 reflectometry Methods 0.000 claims description 7
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 abstract description 5
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000004382 potting Methods 0.000 description 6
- 239000000049 pigment Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- -1 nitride compound Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
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Abstract
【解決手段】・担体と、・当該担体上の少なくとも1つの接続面と、・少なくとも、前記接続面上にコンタクト材料を用いて固定されている、少なくとも1つの電子デバイスと、・前記担体上の前記接続面を包囲しているカバー面と、・被覆材料によって覆われている、少なくとも1つの被覆領域とを有しており、前記被覆材料は、前記カバー面と前記被覆領域との間の光学的なコントラストが最小化されるように構成されている、ことを特徴とする電子装置
【選択図】図1
Description
・担体と、
・当該担体上の少なくとも1つの接続面と、
・少なくとも、前記接続面上にコンタクト材料を用いて固定されている、少なくとも1つの電子デバイスと、
・前記担体上の前記接続面を包囲しているカバー面と、
・被覆材料によって覆われている、少なくとも1つの被覆領域とを有しており、
前記被覆材料は、前記カバー面と前記被覆領域との間の光学的なコントラストが最小化されるように構成されている、
ことを特徴とする電子装置によって解決される。
種々の実施形態は、オプトエレクトロニクスデバイスと、オプトエレクロニクスデバイスでないデバイスとを備えた電子装置を有している。スイッチオフ状態において、視覚的外観は均一である。
Claims (15)
- 電子装置(1)であって、
・担体(2)と、
・当該担体(2)上の少なくとも1つの接続面(6)と、
・少なくとも、前記接続面(6)上にコンタクト材料(4)を用いて固定されている、少なくとも1つの電子デバイス(3a、3b、3c)と、
・前記担体(2)上の前記接続面(6)を包囲しているカバー面(5)と、
・被覆材料(10)によって覆われている、少なくとも1つの被覆領域(15、16、17、18、19)とを有しており、
前記被覆材料(10)は、前記カバー面(5)と前記被覆領域(15、16、17、18、19)との間の光学的なコントラストが最小化されるように構成されている、
ことを特徴とする電子装置。 - 前記接続面(6)は、電気的なコンタクト面および/または接着面を含んでいる、請求項1記載の電子装置。
- 前記光学的なコントラストは、色コントラストおよび/または輝度コントラストである、請求項1または2記載の電子装置。
- 前記コンタクト材料(4)は、はんだおよび/または接着剤を有している、請求項1から3までのいずれか1項記載の電子装置。
- 前記電子デバイスは、オプトエレクトロニクスデバイス(3a)、殊にLEDを含んでいる、請求項1から4までのいずれか1項記載の電子装置。
- 前記電子デバイスは、オプトエレクトロニクスデバイスでないデバイス(3b、3c)であり、殊に、ESD半導体チップおよび/または受動的なデバイスを含んでいる、請求項1から5までのいずれか1項記載の電子装置。
- 前記被覆領域(17、19)は、前記オプトエレクトロニクスデバイスでないデバイス(3b、3c)の、前記担体(2)と反対側の面(8、8a)を含んでいる、請求項6記載の電子装置。
- 前記被覆領域(15、16、17)は、前記電子デバイス(3a、3b)の側面(7)を含んでいる、請求項1から7までのいずれか1項記載の電子装置。
- 前記被覆領域(15、16、17、18、19)は、前記電気デバイス(3a、3b、3c)によって覆われていない、前記接続面(6)の領域を含んでいる、請求項1から8までのいずれか1項記載の電子装置。
- 前記被覆領域(15、16、17、18、19)は、前記電気デバイス(3a、3b、3c)によって覆われていない、前記コンタクト材料(4)の領域を含んでいる、請求項1から9までのいずれか1項記載の電子装置。
- 前記カバー面(5)は、セラミック、有利には白色材料および/またはラミネート加工されたエポキシ樹脂および/またははんだストップラックを有している、請求項1から10までのいずれか1項記載の電子装置。
- 前記被覆材料(10)は色が付けられているシリコーン、および/または少なくとも1つの色が付けられているエポキシ樹脂、殊にはんだストップラック、および/または熱可塑性樹脂を含んでいる、請求項1から11までのいずれか1項記載の電子装置。
- 前記被覆材料(10)は色素(11)によって、殊にチタン二酸化物(TiO2)粒子によって色が付けられている、請求項12記載の電子装置。
- 前記チタン二酸化物粒子は、前記被覆材料(10)内に、70重量%までの割合、有利には約25重量%で設けられている、請求項13記載の電子装置。
- 前記カバー面(5)および/または前記被覆材料(10)は、それぞれ70%よりも高い反射率を有する高反射性である、請求項1から14までのいずれか1項記載の電子装置。
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US20170243850A1 (en) | 2017-08-24 |
KR20130071439A (ko) | 2013-06-28 |
EP2519984A1 (de) | 2012-11-07 |
WO2011147636A1 (de) | 2011-12-01 |
TWI546905B (zh) | 2016-08-21 |
US9681566B2 (en) | 2017-06-13 |
CN107123716B (zh) | 2019-04-02 |
US20130077280A1 (en) | 2013-03-28 |
EP2519984B1 (de) | 2019-06-05 |
CN102959742B (zh) | 2016-12-28 |
DE102010029368A1 (de) | 2011-12-01 |
JP2013529387A (ja) | 2013-07-18 |
US10026710B2 (en) | 2018-07-17 |
CN102959742A (zh) | 2013-03-06 |
CN107123716A (zh) | 2017-09-01 |
TW201203474A (en) | 2012-01-16 |
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