JP2015163689A - 蛍光体及びこれを用いた発光装置 - Google Patents
蛍光体及びこれを用いた発光装置 Download PDFInfo
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- JP2015163689A JP2015163689A JP2015012038A JP2015012038A JP2015163689A JP 2015163689 A JP2015163689 A JP 2015163689A JP 2015012038 A JP2015012038 A JP 2015012038A JP 2015012038 A JP2015012038 A JP 2015012038A JP 2015163689 A JP2015163689 A JP 2015163689A
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- Prior art keywords
- phosphor
- light
- light emitting
- emitting device
- nitride
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 179
- 239000000203 mixture Substances 0.000 claims abstract description 39
- 239000002245 particle Substances 0.000 claims abstract description 22
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 16
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 13
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000001301 oxygen Substances 0.000 claims abstract description 12
- 230000005284 excitation Effects 0.000 claims description 19
- 229910052712 strontium Inorganic materials 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- 229910052693 Europium Inorganic materials 0.000 claims description 9
- 229910052788 barium Inorganic materials 0.000 claims description 8
- 229910052688 Gadolinium Inorganic materials 0.000 claims description 6
- 229910052733 gallium Inorganic materials 0.000 claims description 5
- 229910052765 Lutetium Inorganic materials 0.000 claims description 4
- 229910052771 Terbium Inorganic materials 0.000 claims description 4
- 229910052727 yttrium Inorganic materials 0.000 claims description 4
- 229910017639 MgSi Inorganic materials 0.000 claims description 3
- 229910004283 SiO 4 Inorganic materials 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 abstract description 48
- 238000000034 method Methods 0.000 abstract description 12
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000011575 calcium Substances 0.000 description 41
- 230000000052 comparative effect Effects 0.000 description 38
- 238000000295 emission spectrum Methods 0.000 description 31
- 239000002994 raw material Substances 0.000 description 31
- 238000010304 firing Methods 0.000 description 17
- 238000009877 rendering Methods 0.000 description 17
- 230000004907 flux Effects 0.000 description 16
- 238000004519 manufacturing process Methods 0.000 description 16
- 239000000463 material Substances 0.000 description 12
- 239000012299 nitrogen atmosphere Substances 0.000 description 12
- -1 cerium activated yttrium Chemical class 0.000 description 11
- 239000000126 substance Substances 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 238000002156 mixing Methods 0.000 description 10
- 238000007789 sealing Methods 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 150000001875 compounds Chemical class 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 7
- 239000013078 crystal Substances 0.000 description 7
- 229910052761 rare earth metal Inorganic materials 0.000 description 7
- 229910052796 boron Inorganic materials 0.000 description 6
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 6
- 238000001228 spectrum Methods 0.000 description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000005121 nitriding Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 238000010298 pulverizing process Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 102100032047 Alsin Human genes 0.000 description 4
- 101710187109 Alsin Proteins 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 229910052582 BN Inorganic materials 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052684 Cerium Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000012300 argon atmosphere Substances 0.000 description 4
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- 239000012071 phase Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- PSBUJOCDKOWAGJ-UHFFFAOYSA-N azanylidyneeuropium Chemical compound [Eu]#N PSBUJOCDKOWAGJ-UHFFFAOYSA-N 0.000 description 3
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- 150000004820 halides Chemical class 0.000 description 3
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- 150000002910 rare earth metals Chemical class 0.000 description 3
- 230000009257 reactivity Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 238000003746 solid phase reaction Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- BTBUEUYNUDRHOZ-UHFFFAOYSA-N Borate Chemical compound [O-]B([O-])[O-] BTBUEUYNUDRHOZ-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 229910052692 Dysprosium Inorganic materials 0.000 description 2
- 229910052691 Erbium Inorganic materials 0.000 description 2
- 229910052689 Holmium Inorganic materials 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052775 Thulium Inorganic materials 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000012190 activator Substances 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 150000004645 aluminates Chemical class 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 150000001639 boron compounds Chemical class 0.000 description 2
- 230000006690 co-activation Effects 0.000 description 2
- 229910001940 europium oxide Inorganic materials 0.000 description 2
- AEBZCFFCDTZXHP-UHFFFAOYSA-N europium(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Eu+3].[Eu+3] AEBZCFFCDTZXHP-UHFFFAOYSA-N 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 150000004678 hydrides Chemical class 0.000 description 2
- 229910052746 lanthanum Inorganic materials 0.000 description 2
- 230000031700 light absorption Effects 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052700 potassium Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000010189 synthetic method Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 101100219382 Caenorhabditis elegans cah-2 gene Proteins 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 229910019018 Mg 2 Si Inorganic materials 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 229910052777 Praseodymium Inorganic materials 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910052769 Ytterbium Inorganic materials 0.000 description 1
- 229910001514 alkali metal chloride Inorganic materials 0.000 description 1
- 229910001515 alkali metal fluoride Inorganic materials 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- XCNGEWCFFFJZJT-UHFFFAOYSA-N calcium;azanidylidenecalcium Chemical compound [Ca+2].[Ca]=[N-].[Ca]=[N-] XCNGEWCFFFJZJT-UHFFFAOYSA-N 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000004442 gravimetric analysis Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910021480 group 4 element Inorganic materials 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 238000009616 inductively coupled plasma Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000013014 purified material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- XTQHKBHJIVJGKJ-UHFFFAOYSA-N sulfur monoxide Chemical compound S=O XTQHKBHJIVJGKJ-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77342—Silicates
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7728—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing europium
- C09K11/77348—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
- C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
- C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
- C09K11/7766—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals containing two or more rare earth metals
- C09K11/7774—Aluminates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Luminescent Compositions (AREA)
- Led Device Packages (AREA)
Abstract
Description
(ただし、0.5≦t<1、0<v≦0.5、0.01<w≦0.03、t+v+w<1、0.90≦x≦1.1、0.90≦y≦1.1、2.5≦z≦3.5)
(蛍光体)
(フラックス)
(蛍光体の製造方法)
(粒径)
(発光装置)
(発光素子10)
(蛍光体70)
(封止部材50)
(蛍光体の実施例)
(比較例1、2、実施例1〜6)
(反射率)
(実施例11〜16、比較例11〜12)
(発光装置の発光スペクトル)
10…発光素子
20、30…リード電極
40…パッケージ
50…封止樹脂
60…導電性ワイヤ
70…蛍光体
Claims (10)
- 紫外線から可視光の領域の光を吸収して発光ピーク波長が600nm〜650nmの範囲の光を発光可能な蛍光体であって、
組成が下記一般式で示され、かつ
前記発光ピーク波長と半値幅との差が、543nmより大きいことを特徴とする蛍光体。
SrtCavEuwAlxSiyNz
(ただし、0.5≦t<1、0<v≦0.5、0.01<w≦0.03、t+v+w<1、0.90≦x≦1.1、0.90≦y≦1.1、2.5≦z≦3.5) - 請求項1に記載の蛍光体であって、
平均粒径が5μm以上20μm以下であることを特徴とする蛍光体。 - 請求項1又は2に記載の蛍光体であって、
酸素含有量が0.5重量%以上2.0重量%以下であることを特徴とする蛍光体。 - 請求項1〜3のいずれか一項に記載の蛍光体であって、
前記発光ピーク波長と半値幅との差が640nmよりも小さいことを特徴とする蛍光体。 - 請求項1〜4のいずれか一項に記載の蛍光体であって、
前記発光ピーク波長が、610nm以上625nm以下のときに半値幅が79nm以下であることを特徴とする蛍光体。 - 請求項1〜4のいずれか一項に記載の蛍光体であって、
前記発光ピーク波長が、625nm以上635nm以下のときに半値幅が90nm以下であることを特徴とする蛍光体。 - 請求項1〜6のいずれか一項に記載の蛍光体であって、
波長が550nmの光に対する反射率が、15%〜28%であることを特徴とする蛍光体。 - 請求項1〜7のいずれか一項に記載の蛍光体と、紫外線から可視光の領域の光を発する励起光源とを有することを特徴とする発光装置。
- 請求項8に記載の発光装置であって、
前記励起光源のピーク波長が、430nm〜470nmであることを特徴とする発光装置。 - 請求項8又は9に記載の発光装置であって、
前記蛍光体に加え、(Y,Gd,Tb,Lu)3(Al,Ga)5O12:Ce、(Ba,Sr,Ca)2SiO4:Eu,Si6-zAlzOzN8-z:Eu(0<z<4.2),(Ca,Sr)8MgSi4O16Cl2:Eu、Ca3Sc2Si3O12:Ce、CaSc2O4:Ce,SrGa2S4:Euなる群より選ばれた少なくとも1種以上の蛍光体を含むことを特徴とする発光装置。
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015142056A (ja) * | 2014-01-29 | 2015-08-03 | 日亜化学工業株式会社 | 半導体発光装置 |
US9735323B2 (en) | 2015-06-30 | 2017-08-15 | Nichia Corporation | Light emitting device having a triple phosphor fluorescent member |
JP2018078285A (ja) * | 2016-10-31 | 2018-05-17 | 日亜化学工業株式会社 | 発光装置 |
JP2018533210A (ja) * | 2015-11-30 | 2018-11-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス部品、ディスプレイ用背景照明およびオプトエレクトロニクス部品の製造方法 |
JP2019019271A (ja) * | 2017-07-20 | 2019-02-07 | デンカ株式会社 | 赤色蛍光体及び発光装置 |
KR20190047016A (ko) * | 2016-09-12 | 2019-05-07 | 루미레즈 엘엘씨 | 감소된 멜라노픽 스펙트럴 성분을 갖는 조명 시스템 |
JP2020109850A (ja) * | 2016-10-31 | 2020-07-16 | 日亜化学工業株式会社 | 発光装置の製造方法 |
US10818827B2 (en) | 2017-09-28 | 2020-10-27 | Nichia Corporation | Light-emitting device |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9373761B2 (en) * | 2014-09-23 | 2016-06-21 | Osram Sylvania Inc. | Patterned thin-film wavelength converter and method of making same |
CN105623658B (zh) * | 2016-01-29 | 2017-04-12 | 江苏博睿光电有限公司 | 一种氮氧化物荧光粉及其制备方法、氮氧化物发光体和发光器件 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012017949A1 (ja) * | 2010-08-04 | 2012-02-09 | 宇部興産株式会社 | 珪窒化物蛍光体用窒化珪素粉末並びにそれを用いたCaAlSiN3系蛍光体、Sr2Si5N8系蛍光体、(Sr,Ca)AlSiN3系蛍光体及びLa3Si6N11系蛍光体、及びその製造方法 |
JP2012077300A (ja) * | 2010-09-30 | 2012-04-19 | Chi Mei Corp | 精密に制御された元素組成物を有する蛍光体を提供する方法、同方法で提供された蛍光体、蛍光体、及び該蛍光体を含む発光デバイス |
JP2012512307A (ja) * | 2008-12-15 | 2012-05-31 | インテマティックス・コーポレーション | Rgb(赤−緑−青)ライティングシステムにおける窒化物系赤色発光蛍光体 |
WO2015002139A1 (ja) * | 2013-07-03 | 2015-01-08 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5140163A (en) * | 1987-08-17 | 1992-08-18 | Agfa-Gevaert, N.V. | Reproduction of X-ray images with photostimulable phosphor |
TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
JP3837588B2 (ja) | 2003-11-26 | 2006-10-25 | 独立行政法人物質・材料研究機構 | 蛍光体と蛍光体を用いた発光器具 |
US20060083694A1 (en) * | 2004-08-07 | 2006-04-20 | Cabot Corporation | Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same |
WO2006095285A1 (en) * | 2005-03-09 | 2006-09-14 | Philips Intellectual Property & Standards Gmbh | Illumination system comprising a radiation source and a fluorescent material |
JP5130640B2 (ja) | 2005-04-01 | 2013-01-30 | 三菱化学株式会社 | 蛍光体の製造方法 |
CN103254894A (zh) * | 2005-04-01 | 2013-08-21 | 三菱化学株式会社 | 无机功能材料原料用合金粉末及荧光体 |
KR20080097174A (ko) | 2006-02-28 | 2008-11-04 | 미쓰비시 가가꾸 가부시키가이샤 | 형광체 원료 및 형광체 원료용 합금의 제조 방법 |
JP5181492B2 (ja) | 2006-02-28 | 2013-04-10 | 三菱化学株式会社 | 蛍光体原料及び蛍光体原料用合金の製造方法 |
DE102006036577A1 (de) | 2006-08-04 | 2008-02-07 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Rot emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff |
US9428688B2 (en) | 2008-11-17 | 2016-08-30 | Cree, Inc. | Phosphor composition |
JP5632961B2 (ja) * | 2010-05-14 | 2014-11-26 | ライトスケープ マテリアルズ インコーポレイテッド | オキシ炭窒化物蛍光体およびこれを使用する発光素子 |
EP2614683A4 (en) * | 2010-09-10 | 2014-04-16 | Lightscape Materials Inc | PHOSPHORESCENT SUBSTANCES BASED ON SILICON CARBIDONITRIDE AND LIGHTING DEVICES USING SAME |
JP5864851B2 (ja) | 2010-12-09 | 2016-02-17 | シャープ株式会社 | 発光装置 |
US8906263B2 (en) * | 2011-06-03 | 2014-12-09 | Cree, Inc. | Red nitride phosphors |
US9318669B2 (en) * | 2012-01-30 | 2016-04-19 | Cree, Inc. | Methods of determining and making red nitride compositions |
JP2012207228A (ja) | 2012-07-09 | 2012-10-25 | Mitsubishi Chemicals Corp | 蛍光体及びそれを使用した発光装置 |
-
2015
- 2015-01-26 JP JP2015012038A patent/JP6528418B2/ja active Active
- 2015-01-29 US US14/608,191 patent/US9515231B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012512307A (ja) * | 2008-12-15 | 2012-05-31 | インテマティックス・コーポレーション | Rgb(赤−緑−青)ライティングシステムにおける窒化物系赤色発光蛍光体 |
WO2012017949A1 (ja) * | 2010-08-04 | 2012-02-09 | 宇部興産株式会社 | 珪窒化物蛍光体用窒化珪素粉末並びにそれを用いたCaAlSiN3系蛍光体、Sr2Si5N8系蛍光体、(Sr,Ca)AlSiN3系蛍光体及びLa3Si6N11系蛍光体、及びその製造方法 |
JP2012077300A (ja) * | 2010-09-30 | 2012-04-19 | Chi Mei Corp | 精密に制御された元素組成物を有する蛍光体を提供する方法、同方法で提供された蛍光体、蛍光体、及び該蛍光体を含む発光デバイス |
WO2015002139A1 (ja) * | 2013-07-03 | 2015-01-08 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015142056A (ja) * | 2014-01-29 | 2015-08-03 | 日亜化学工業株式会社 | 半導体発光装置 |
US9735323B2 (en) | 2015-06-30 | 2017-08-15 | Nichia Corporation | Light emitting device having a triple phosphor fluorescent member |
US11158769B2 (en) | 2015-11-30 | 2021-10-26 | Osram Oled Gmbh | Optoelectronic component and background lighting for a display |
JP2018533210A (ja) * | 2015-11-30 | 2018-11-08 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | オプトエレクトロニクス部品、ディスプレイ用背景照明およびオプトエレクトロニクス部品の製造方法 |
KR20190047016A (ko) * | 2016-09-12 | 2019-05-07 | 루미레즈 엘엘씨 | 감소된 멜라노픽 스펙트럴 성분을 갖는 조명 시스템 |
JP2019535129A (ja) * | 2016-09-12 | 2019-12-05 | ルミレッズ リミテッド ライアビリティ カンパニー | メラノピックスペクトル量を低減した照明システム |
KR102253975B1 (ko) | 2016-09-12 | 2021-05-18 | 루미레즈 엘엘씨 | 감소된 멜라노픽 스펙트럴 성분을 갖는 조명 시스템 |
US11230665B2 (en) | 2016-09-12 | 2022-01-25 | Lumileds Llc | Lighting system having reduced melanopic spectral content |
US10243113B2 (en) | 2016-10-31 | 2019-03-26 | Nichia Corporation | Light emitting device |
JP2020109850A (ja) * | 2016-10-31 | 2020-07-16 | 日亜化学工業株式会社 | 発光装置の製造方法 |
JP2018078285A (ja) * | 2016-10-31 | 2018-05-17 | 日亜化学工業株式会社 | 発光装置 |
JP2019019271A (ja) * | 2017-07-20 | 2019-02-07 | デンカ株式会社 | 赤色蛍光体及び発光装置 |
JP7428465B2 (ja) | 2017-07-20 | 2024-02-06 | デンカ株式会社 | 赤色蛍光体及び発光装置 |
US10818827B2 (en) | 2017-09-28 | 2020-10-27 | Nichia Corporation | Light-emitting device |
US11605761B2 (en) | 2017-09-28 | 2023-03-14 | Nichia Corporation | Light-emitting device |
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