JP2015135255A5 - - Google Patents

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Publication number
JP2015135255A5
JP2015135255A5 JP2014006162A JP2014006162A JP2015135255A5 JP 2015135255 A5 JP2015135255 A5 JP 2015135255A5 JP 2014006162 A JP2014006162 A JP 2014006162A JP 2014006162 A JP2014006162 A JP 2014006162A JP 2015135255 A5 JP2015135255 A5 JP 2015135255A5
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JP
Japan
Prior art keywords
base
test jig
semiconductor test
metal
jig according
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JP2014006162A
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English (en)
Japanese (ja)
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JP2015135255A (ja
JP6233039B2 (ja
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Priority to JP2014006162A priority Critical patent/JP6233039B2/ja
Priority claimed from JP2014006162A external-priority patent/JP6233039B2/ja
Publication of JP2015135255A publication Critical patent/JP2015135255A/ja
Publication of JP2015135255A5 publication Critical patent/JP2015135255A5/ja
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Publication of JP6233039B2 publication Critical patent/JP6233039B2/ja
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JP2014006162A 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法 Active JP6233039B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014006162A JP6233039B2 (ja) 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014006162A JP6233039B2 (ja) 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法

Publications (3)

Publication Number Publication Date
JP2015135255A JP2015135255A (ja) 2015-07-27
JP2015135255A5 true JP2015135255A5 (enExample) 2016-06-30
JP6233039B2 JP6233039B2 (ja) 2017-11-22

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JP2014006162A Active JP6233039B2 (ja) 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法

Country Status (1)

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JP (1) JP6233039B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020026293A1 (ja) * 2018-07-30 2020-02-06 株式会社日立ハイテクノロジーズ 半導体検査装置及びプローブユニット
TWI679424B (zh) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 檢測裝置及其製法
CN112858735B (zh) * 2021-01-14 2022-08-16 强一半导体（苏州）有限公司 一种多节mems探针关键尺寸测量用探针装载载物台

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4244778B2 (ja) * 2003-10-21 2009-03-25 株式会社村田製作所 チップ型電子部品の特性測定装置
JP4894248B2 (ja) * 2005-12-01 2012-03-14 セイコーエプソン株式会社 電子デバイスの外部信号入力方法
JP2009128189A (ja) * 2007-11-22 2009-06-11 Fuji Electric Device Technology Co Ltd 素子試験装置及び素子試験方法
JP2012163515A (ja) * 2011-02-09 2012-08-30 Toyota Motor Corp 半導体検査装置
JP5696624B2 (ja) * 2011-09-02 2015-04-08 三菱電機株式会社 半導体試験治具
TWI447414B (zh) * 2012-06-07 2014-08-01 矽品精密工業股份有限公司 測試裝置及測試方法

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