DK2201336T3 - Halvleder-mikroanemometer og fremgangsmåde til fremstilling heraf - Google Patents

Halvleder-mikroanemometer og fremgangsmåde til fremstilling heraf

Info

Publication number
DK2201336T3
DK2201336T3 DK08837158.8T DK08837158T DK2201336T3 DK 2201336 T3 DK2201336 T3 DK 2201336T3 DK 08837158 T DK08837158 T DK 08837158T DK 2201336 T3 DK2201336 T3 DK 2201336T3
Authority
DK
Denmark
Prior art keywords
semiconductor wafer
microanemometer
cavity
resistor
peripheral edge
Prior art date
Application number
DK08837158.8T
Other languages
English (en)
Inventor
Thomas E Plowman
Warren R Jewett
Original Assignee
Memsys Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Memsys Inc filed Critical Memsys Inc
Application granted granted Critical
Publication of DK2201336T3 publication Critical patent/DK2201336T3/da

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/6845—Micromachined devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/68—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using thermal effects
    • G01F1/684—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
    • G01F1/688—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element
    • G01F1/69—Structural arrangements; Mounting of elements, e.g. in relation to fluid flow using a particular type of heating, cooling or sensing element of resistive type
    • G01F1/692—Thin-film arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Glass Compositions (AREA)
  • Lubricants (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Measuring Volume Flow (AREA)
  • Micromachines (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Bipolar Transistors (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
DK08837158.8T 2007-10-11 2008-10-08 Halvleder-mikroanemometer og fremgangsmåde til fremstilling heraf DK2201336T3 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/870,612 US7500392B1 (en) 2007-10-11 2007-10-11 Solid state microanemometer device and method of fabrication
PCT/US2008/079153 WO2009048918A1 (en) 2007-10-11 2008-10-08 Solid state microanemometer device and method of fabrication

Publications (1)

Publication Number Publication Date
DK2201336T3 true DK2201336T3 (da) 2011-07-04

Family

ID=40260756

Family Applications (1)

Application Number Title Priority Date Filing Date
DK08837158.8T DK2201336T3 (da) 2007-10-11 2008-10-08 Halvleder-mikroanemometer og fremgangsmåde til fremstilling heraf

Country Status (9)

Country Link
US (1) US7500392B1 (da)
EP (1) EP2201336B1 (da)
JP (1) JP2011501126A (da)
AT (1) ATE503170T1 (da)
AU (1) AU2008310945A1 (da)
CA (1) CA2702049A1 (da)
DE (1) DE602008005779D1 (da)
DK (1) DK2201336T3 (da)
WO (1) WO2009048918A1 (da)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
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GB0720905D0 (en) 2007-10-25 2007-12-05 Cambridge Entpr Ltd Shear stress sensors
EP2260245B1 (de) * 2008-03-07 2015-01-07 Belimo Holding AG Vorrichtung zum messen und regeln eines volumenstroms in einem lüftungsrohr
JP2014016237A (ja) * 2012-07-09 2014-01-30 Azbil Corp フローセンサ
US9741375B2 (en) * 2015-11-19 2017-08-22 Seagate Technology Llc Slider trailing edge contamination sensor
DE102015121866A1 (de) * 2015-12-15 2017-06-22 Jobst Technologies Gmbh Verfahren zur Bestimmung einer Flussrate bzw. Strömungsgeschwindigkeit eines Mediums
US10739175B1 (en) * 2020-02-07 2020-08-11 King Faisal University Microflow sensor and flow sensor package
CN113295224B (zh) * 2021-05-25 2022-07-22 中国科学院上海微系统与信息技术研究所 气液两用热式流量传感器及其制备方法

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JP3920247B2 (ja) 2003-07-02 2007-05-30 三菱電機株式会社 感熱式流量検出素子およびその製造方法
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US7316965B2 (en) 2005-06-21 2008-01-08 Freescale Semiconductor, Inc. Substrate contact for a capped MEMS and method of making the substrate contact at the wafer level

Also Published As

Publication number Publication date
US7500392B1 (en) 2009-03-10
EP2201336A1 (en) 2010-06-30
ATE503170T1 (de) 2011-04-15
CA2702049A1 (en) 2009-04-16
JP2011501126A (ja) 2011-01-06
DE602008005779D1 (de) 2011-05-05
AU2008310945A1 (en) 2009-04-16
WO2009048918A1 (en) 2009-04-16
EP2201336B1 (en) 2011-03-23

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