JP6233039B2 - 半導体試験治具、測定装置、試験方法 - Google Patents

半導体試験治具、測定装置、試験方法 Download PDF

Info

Publication number
JP6233039B2
JP6233039B2 JP2014006162A JP2014006162A JP6233039B2 JP 6233039 B2 JP6233039 B2 JP 6233039B2 JP 2014006162 A JP2014006162 A JP 2014006162A JP 2014006162 A JP2014006162 A JP 2014006162A JP 6233039 B2 JP6233039 B2 JP 6233039B2
Authority
JP
Japan
Prior art keywords
base
test jig
semiconductor test
metal
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014006162A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015135255A (ja
JP2015135255A5 (enExample
Inventor
岡田　章
章 岡田
貴也 野口
貴也 野口
竹迫　憲浩
憲浩 竹迫
欽也 山下
欽也 山下
肇 秋山
肇 秋山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2014006162A priority Critical patent/JP6233039B2/ja
Publication of JP2015135255A publication Critical patent/JP2015135255A/ja
Publication of JP2015135255A5 publication Critical patent/JP2015135255A5/ja
Application granted granted Critical
Publication of JP6233039B2 publication Critical patent/JP6233039B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Testing Of Individual Semiconductor Devices (AREA)
JP2014006162A 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法 Active JP6233039B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014006162A JP6233039B2 (ja) 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014006162A JP6233039B2 (ja) 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法

Publications (3)

Publication Number Publication Date
JP2015135255A JP2015135255A (ja) 2015-07-27
JP2015135255A5 JP2015135255A5 (enExample) 2016-06-30
JP6233039B2 true JP6233039B2 (ja) 2017-11-22

Family

ID=53767181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014006162A Active JP6233039B2 (ja) 2014-01-16 2014-01-16 半導体試験治具、測定装置、試験方法

Country Status (1)

Country Link
JP (1) JP6233039B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7168669B2 (ja) * 2018-07-30 2022-11-09 株式会社日立ハイテク 電子顕微鏡を用いた微小電子デバイス特性評価装置及びそのプローブユニット
TWI679424B (zh) * 2019-03-29 2019-12-11 矽品精密工業股份有限公司 檢測裝置及其製法
CN112858735B (zh) * 2021-01-14 2022-08-16 强一半导体（苏州）有限公司 一种多节mems探针关键尺寸测量用探针装载载物台

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4244778B2 (ja) * 2003-10-21 2009-03-25 株式会社村田製作所 チップ型電子部品の特性測定装置
JP4894248B2 (ja) * 2005-12-01 2012-03-14 セイコーエプソン株式会社 電子デバイスの外部信号入力方法
JP2009128189A (ja) * 2007-11-22 2009-06-11 Fuji Electric Device Technology Co Ltd 素子試験装置及び素子試験方法
JP2012163515A (ja) * 2011-02-09 2012-08-30 Toyota Motor Corp 半導体検査装置
JP5696624B2 (ja) * 2011-09-02 2015-04-08 三菱電機株式会社 半導体試験治具
TWI447414B (zh) * 2012-06-07 2014-08-01 矽品精密工業股份有限公司 測試裝置及測試方法

Also Published As

Publication number Publication date
JP2015135255A (ja) 2015-07-27

Similar Documents

Publication Publication Date Title
CN103135046B (zh) 半导体器件的检查装置和其所使用的吸盘台
JP6890921B2 (ja) プローブカード及び接触検査装置
JP5696624B2 (ja) 半導体試験治具
JP5432700B2 (ja) 半導体デバイスの検査装置
CN112542439B (zh) 具有传感器芯片和汇流排的传感器装置
US9202757B2 (en) Semiconductor module and method for manufacturing same
JP6652443B2 (ja) 多層配線基板及びこれを用いたプローブカード
JP6351763B2 (ja) 半導体装置評価用治具、半導体装置評価装置および半導体装置評価方法
JP6233039B2 (ja) 半導体試験治具、測定装置、試験方法
KR20100071204A (ko) 테스트 핸들러용 인서트 모듈 및 이의 제조 방법
JP2017050489A (ja) 半導体パッケージおよび半導体パッケージの製造方法
TW201336176A (zh) 含鉤狀接腳觸點邊緣的測試用插座
JP6480099B2 (ja) 半導体試験治具、測定装置、試験方法
JP6477947B2 (ja) 半導体試験治具、測定装置、試験方法
JP6237242B2 (ja) 半導体試験治具、試験方法
JP6418070B2 (ja) 測定装置、半導体装置の測定方法
CN203773016U (zh) 一种smd-0.5封装功率半导体器件热阻测试装置
JP2003270267A (ja) プローブユニット、プローブカード、測定装置及びプローブカードの製造方法
JP2015135255A5 (enExample)
JP6280495B2 (ja) 試料固定装置
JP6680176B2 (ja) 評価装置および半導体チップの評価方法
JP6144984B2 (ja) 補正用治具
CN104459272A (zh) 半导体装置的测定装置
CN103954804A (zh) 一种功率半导体芯片测试用覆铜陶瓷基板
US9972705B2 (en) Method for manufacturing semiconductor device

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160516

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160516

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170309

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170321

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170419

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170926

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20171009

R150 Certificate of patent or registration of utility model

Ref document number: 6233039

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250