JP2015115514A5 - - Google Patents

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Publication number
JP2015115514A5
JP2015115514A5 JP2013257665A JP2013257665A JP2015115514A5 JP 2015115514 A5 JP2015115514 A5 JP 2015115514A5 JP 2013257665 A JP2013257665 A JP 2013257665A JP 2013257665 A JP2013257665 A JP 2013257665A JP 2015115514 A5 JP2015115514 A5 JP 2015115514A5
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JP
Japan
Prior art keywords
metal film
outer peripheral
addition
peripheral end
leakage
Prior art date
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Application number
JP2013257665A
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English (en)
Japanese (ja)
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JP2015115514A (ja
JP6195514B2 (ja
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Priority to JP2013257665A priority Critical patent/JP6195514B2/ja
Priority claimed from JP2013257665A external-priority patent/JP6195514B2/ja
Publication of JP2015115514A publication Critical patent/JP2015115514A/ja
Publication of JP2015115514A5 publication Critical patent/JP2015115514A5/ja
Application granted granted Critical
Publication of JP6195514B2 publication Critical patent/JP6195514B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013257665A 2013-12-13 2013-12-13 配線基板およびその製造方法 Expired - Fee Related JP6195514B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013257665A JP6195514B2 (ja) 2013-12-13 2013-12-13 配線基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013257665A JP6195514B2 (ja) 2013-12-13 2013-12-13 配線基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2015115514A JP2015115514A (ja) 2015-06-22
JP2015115514A5 true JP2015115514A5 (cg-RX-API-DMAC10.html) 2016-12-15
JP6195514B2 JP6195514B2 (ja) 2017-09-13

Family

ID=53529038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013257665A Expired - Fee Related JP6195514B2 (ja) 2013-12-13 2013-12-13 配線基板およびその製造方法

Country Status (1)

Country Link
JP (1) JP6195514B2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021056427A1 (zh) * 2019-09-27 2021-04-01 庆鼎精密电子（淮安）有限公司 中介板、中介板的制作方法及电路板组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120658A (ja) * 1992-10-06 1994-04-28 Fujitsu Ltd 電源供給部を付加したプリント基板の製造方法
JP2005159330A (ja) * 2003-11-05 2005-06-16 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
JP2005191243A (ja) * 2003-12-25 2005-07-14 Ngk Spark Plug Co Ltd ビルドアップ多層配線基板
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板
JP2013062441A (ja) * 2011-09-14 2013-04-04 Fujikura Ltd プリント基板及びその製造方法

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