JP6195514B2 - 配線基板およびその製造方法 - Google Patents

配線基板およびその製造方法 Download PDF

Info

Publication number
JP6195514B2
JP6195514B2 JP2013257665A JP2013257665A JP6195514B2 JP 6195514 B2 JP6195514 B2 JP 6195514B2 JP 2013257665 A JP2013257665 A JP 2013257665A JP 2013257665 A JP2013257665 A JP 2013257665A JP 6195514 B2 JP6195514 B2 JP 6195514B2
Authority
JP
Japan
Prior art keywords
wiring
wiring board
metal film
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013257665A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015115514A (ja
JP2015115514A5 (cg-RX-API-DMAC10.html
Inventor
将任 岩崎
将任 岩崎
広幸 松浦
広幸 松浦
寿毅 関
寿毅 関
堀尾　俊和
俊和 堀尾
山本　洋
洋 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2013257665A priority Critical patent/JP6195514B2/ja
Publication of JP2015115514A publication Critical patent/JP2015115514A/ja
Publication of JP2015115514A5 publication Critical patent/JP2015115514A5/ja
Application granted granted Critical
Publication of JP6195514B2 publication Critical patent/JP6195514B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)
JP2013257665A 2013-12-13 2013-12-13 配線基板およびその製造方法 Expired - Fee Related JP6195514B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013257665A JP6195514B2 (ja) 2013-12-13 2013-12-13 配線基板およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013257665A JP6195514B2 (ja) 2013-12-13 2013-12-13 配線基板およびその製造方法

Publications (3)

Publication Number Publication Date
JP2015115514A JP2015115514A (ja) 2015-06-22
JP2015115514A5 JP2015115514A5 (cg-RX-API-DMAC10.html) 2016-12-15
JP6195514B2 true JP6195514B2 (ja) 2017-09-13

Family

ID=53529038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013257665A Expired - Fee Related JP6195514B2 (ja) 2013-12-13 2013-12-13 配線基板およびその製造方法

Country Status (1)

Country Link
JP (1) JP6195514B2 (cg-RX-API-DMAC10.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021056427A1 (zh) * 2019-09-27 2021-04-01 庆鼎精密电子（淮安）有限公司 中介板、中介板的制作方法及电路板组件

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06120658A (ja) * 1992-10-06 1994-04-28 Fujitsu Ltd 電源供給部を付加したプリント基板の製造方法
JP2005159330A (ja) * 2003-11-05 2005-06-16 Hitachi Chem Co Ltd 多層回路基板の製造方法及びこれから得られる多層回路基板、半導体チップ搭載基板並びにこの基板を用いた半導体パッケージ
JP2005191243A (ja) * 2003-12-25 2005-07-14 Ngk Spark Plug Co Ltd ビルドアップ多層配線基板
JP4473935B1 (ja) * 2009-07-06 2010-06-02 新光電気工業株式会社 多層配線基板
JP2013062441A (ja) * 2011-09-14 2013-04-04 Fujikura Ltd プリント基板及びその製造方法

Also Published As

Publication number Publication date
JP2015115514A (ja) 2015-06-22

Similar Documents

Publication Publication Date Title
JP6427817B2 (ja) 印刷回路基板及びその製造方法
JP5410660B2 (ja) 配線基板及びその製造方法と電子部品装置及びその製造方法
US20150014020A1 (en) Wiring substrate and method for manufacturing the same
KR101323541B1 (ko) 다층 배선기판
KR101281410B1 (ko) 다층 배선기판
US8945329B2 (en) Printed wiring board and method for manufacturing printed wiring board
KR20120067968A (ko) 다층배선기판 및 그의 제조방법
US9706663B2 (en) Printed wiring board, method for manufacturing the same and semiconductor device
CN102164464A (zh) 多层布线基板的制造方法及多层布线基板
JP2013149941A (ja) 多層配線基板及びその製造方法
JP2015198094A (ja) インターポーザ、半導体装置、およびそれらの製造方法
JP2015207580A (ja) 配線基板およびその製造方法
KR101522780B1 (ko) 전자부품 내장 인쇄회로기판 및 그 제조방법
JP2016111244A (ja) 配線基板及びその製造方法
JP5302920B2 (ja) 多層配線基板の製造方法
JP4332162B2 (ja) 配線基板の製造方法
TWI531291B (zh) 承載板及其製作方法
TWI507109B (zh) A supporting substrate for manufacturing a multilayer wiring board, and a method for manufacturing the multilayer wiring board
KR101055462B1 (ko) 인쇄회로기판 제조용 캐리어와 그 제조방법 및 이를 이용한 인쇄회로기판의 제조방법
JP6378616B2 (ja) 電子部品内蔵プリント配線板
JP5432354B2 (ja) 配線基板製造用の仮基板及びその製造方法
US10897823B2 (en) Circuit board, package structure and method of manufacturing the same
JP6324669B2 (ja) 多層配線基板及びその製造方法
JP2015115514A (ja) 配線基板およびその製造方法
JP2017073425A (ja) 配線基板及びその製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161028

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20161028

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170713

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170725

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170815

R150 Certificate of patent or registration of utility model

Ref document number: 6195514

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees