JP2015103565A - 基板支持構造 - Google Patents
基板支持構造 Download PDFInfo
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- JP2015103565A JP2015103565A JP2013241137A JP2013241137A JP2015103565A JP 2015103565 A JP2015103565 A JP 2015103565A JP 2013241137 A JP2013241137 A JP 2013241137A JP 2013241137 A JP2013241137 A JP 2013241137A JP 2015103565 A JP2015103565 A JP 2015103565A
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- substrate
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- substrate support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
【解決手段】本発明の基板支持構造1は、基板支持部材2および保持部材3を備える。基板支持部材2は、基端側から先端側に向かって延び、上側に形成された支持部2Cにより被処理基板Wを支持する。保持部材3は、基板Wの支持位置の両側で、支持部2Cが基端2A側から先端2B側に向かって下方に傾斜するように基板支持部材2を保持する。
【選択図】 図1
Description
1…基板支持構造
2…基板支持部材
2A…基端
2B…先端
2C…支持部
21…ベース体
21A…凹部
21B…ボルト穴
22…支持体
23…ボルト
3…保持部材
4…処理容器
4A…側壁内面
100…処理空間
Claims (8)
- 被処理基板が収容されて処理される処理空間内の所定の支持位置に前記被処理基板を略水平姿勢に支持するための基板支持構造であって、
基端側から先端側に向かって延び、前記支持位置の両側で、基端側から先端側に向かって下方に傾斜する支持部により前記被処理基板を支持する基板支持部材を備えることを特徴とする基板支持構造。 - 前記処理空間は、処理容器の内部に形成され、前記処理容器の側壁内面における前記支持位置の両側に、前記基板支持部材の基端側を保持する保持部材が設けられた、請求項1に記載の基板支持構造。
- 前記基板支持部材が前記傾斜を可変に配設された、請求項1に記載の基板支持構造。
- 前記基板支持部材は、前記基端側から前記先端側に向かって延びるベース体と、前記支持部を有し、前記ベース体の上面から前記支持部を露出させるように前記ベース体に配設される支持体と、を備える、請求項1に記載の基板支持構造。
- 前記支持体が円筒側面を有し、前記ベース体の長手方向に沿った軸回りに回転自在に配設される、請求項4に記載の基板支持構造。
- 前記支持体が樹脂または石英にて形成される、請求項5に記載の基板支持構造。
- 前記基板支持部材が前記支持位置の片側について複数設けられる、請求項5に記載の基板支持構造。
- 前記支持位置の両側に対向して前記処理空間の奥行き方向に延びて設けられる保持部材であって、複数の前記基板支持部材に対応して設けられる保持部材を備える、請求項7に記載の基板支持構造。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013241137A JP6226712B2 (ja) | 2013-11-21 | 2013-11-21 | 基板支持構造 |
KR1020140091028A KR102182046B1 (ko) | 2013-11-21 | 2014-07-18 | 기판 지지구조체 |
CN201810869433.9A CN108807259B (zh) | 2013-11-21 | 2014-09-17 | 基板支承结构 |
CN201410474841.6A CN104658955B (zh) | 2013-11-21 | 2014-09-17 | 基板支承结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013241137A JP6226712B2 (ja) | 2013-11-21 | 2013-11-21 | 基板支持構造 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017120975A Division JP6378403B2 (ja) | 2017-06-21 | 2017-06-21 | 基板支持構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015103565A true JP2015103565A (ja) | 2015-06-04 |
JP6226712B2 JP6226712B2 (ja) | 2017-11-08 |
Family
ID=53249925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013241137A Active JP6226712B2 (ja) | 2013-11-21 | 2013-11-21 | 基板支持構造 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6226712B2 (ja) |
KR (1) | KR102182046B1 (ja) |
CN (2) | CN104658955B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7131334B2 (ja) * | 2018-11-29 | 2022-09-06 | 株式会社安川電機 | 基板支持装置、基板搬送ロボットおよびアライナ装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001358191A (ja) * | 2000-06-09 | 2001-12-26 | Asm Japan Kk | 半導体製造装置用の基板支持板 |
JP2004014829A (ja) * | 2002-06-07 | 2004-01-15 | Hitachi Kokusai Electric Inc | 熱処理装置及び半導体デバイスの製造方法 |
WO2011070741A1 (ja) * | 2009-12-11 | 2011-06-16 | 株式会社Sumco | Cvd用トレーおよびそれを用いた成膜方法 |
JP2012224352A (ja) * | 2011-04-18 | 2012-11-15 | Dainippon Printing Co Ltd | 基板保持用枠体と薄板基板の梱包体 |
US20130259457A1 (en) * | 2012-03-27 | 2013-10-03 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus for heating substrate by irradiating substrate with flash of light |
JP2013206896A (ja) * | 2012-03-27 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002100668A (ja) | 2000-09-25 | 2002-04-05 | Mitsubishi Materials Silicon Corp | 熱処理基板用支持具 |
GB2392309B (en) * | 2002-08-22 | 2004-10-27 | Leica Microsys Lithography Ltd | Substrate loading and unloading apparatus |
JP2004111786A (ja) | 2002-09-20 | 2004-04-08 | Hitachi Kokusai Electric Inc | 熱処理装置及び半導体デバイスの製造方法 |
KR100980024B1 (ko) * | 2003-06-19 | 2010-09-03 | 삼성전자주식회사 | 기판지지장치 |
JP2005340488A (ja) * | 2004-05-27 | 2005-12-08 | Matsushita Electric Ind Co Ltd | 電子デバイスの製造装置 |
CN101303993A (zh) * | 2007-05-10 | 2008-11-12 | 南亚科技股份有限公司 | 晶片承载装置 |
JP5261085B2 (ja) * | 2008-09-05 | 2013-08-14 | 東京エレクトロン株式会社 | 基板載置機構、基板処理装置、基板載置機構の制御方法及び記憶媒体 |
JP5456287B2 (ja) * | 2008-09-05 | 2014-03-26 | 東京エレクトロン株式会社 | 縦型熱処理装置 |
-
2013
- 2013-11-21 JP JP2013241137A patent/JP6226712B2/ja active Active
-
2014
- 2014-07-18 KR KR1020140091028A patent/KR102182046B1/ko active IP Right Grant
- 2014-09-17 CN CN201410474841.6A patent/CN104658955B/zh active Active
- 2014-09-17 CN CN201810869433.9A patent/CN108807259B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001358191A (ja) * | 2000-06-09 | 2001-12-26 | Asm Japan Kk | 半導体製造装置用の基板支持板 |
JP2004014829A (ja) * | 2002-06-07 | 2004-01-15 | Hitachi Kokusai Electric Inc | 熱処理装置及び半導体デバイスの製造方法 |
WO2011070741A1 (ja) * | 2009-12-11 | 2011-06-16 | 株式会社Sumco | Cvd用トレーおよびそれを用いた成膜方法 |
JP2012224352A (ja) * | 2011-04-18 | 2012-11-15 | Dainippon Printing Co Ltd | 基板保持用枠体と薄板基板の梱包体 |
US20130259457A1 (en) * | 2012-03-27 | 2013-10-03 | Dainippon Screen Mfg. Co., Ltd. | Heat treatment apparatus for heating substrate by irradiating substrate with flash of light |
JP2013206896A (ja) * | 2012-03-27 | 2013-10-07 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20150059072A (ko) | 2015-05-29 |
CN104658955A (zh) | 2015-05-27 |
JP6226712B2 (ja) | 2017-11-08 |
KR102182046B1 (ko) | 2020-11-23 |
CN104658955B (zh) | 2019-01-04 |
CN108807259A (zh) | 2018-11-13 |
CN108807259B (zh) | 2022-12-16 |
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