JP2015099912A - 蛍光体シートの評価方法およびその製造方法 - Google Patents

蛍光体シートの評価方法およびその製造方法 Download PDF

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Publication number
JP2015099912A
JP2015099912A JP2014187553A JP2014187553A JP2015099912A JP 2015099912 A JP2015099912 A JP 2015099912A JP 2014187553 A JP2014187553 A JP 2014187553A JP 2014187553 A JP2014187553 A JP 2014187553A JP 2015099912 A JP2015099912 A JP 2015099912A
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JP
Japan
Prior art keywords
liquid composition
phosphor sheet
composition
phosphor
chromaticity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014187553A
Other languages
English (en)
Japanese (ja)
Inventor
宗久 三谷
Munehisa Mitani
宗久 三谷
宏中 藤井
Hironaka Fujii
宏中 藤井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2014187553A priority Critical patent/JP2015099912A/ja
Priority to KR1020167009461A priority patent/KR20160072109A/ko
Priority to PCT/JP2014/074859 priority patent/WO2015056524A1/ja
Priority to CN201480056881.7A priority patent/CN105637334A/zh
Priority to TW103135564A priority patent/TW201522940A/zh
Publication of JP2015099912A publication Critical patent/JP2015099912A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/59—Transmissivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
    • G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
    • G01N21/64—Fluorescence; Phosphorescence
    • G01N2021/6491—Measuring fluorescence and transmission; Correcting inner filter effect
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/065—Integrating spheres
    • G01N2201/0655—Hemispheres
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements

Landscapes

  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Led Device Packages (AREA)
  • Spectrometry And Color Measurement (AREA)
  • Luminescent Compositions (AREA)
JP2014187553A 2013-10-16 2014-09-16 蛍光体シートの評価方法およびその製造方法 Pending JP2015099912A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014187553A JP2015099912A (ja) 2013-10-16 2014-09-16 蛍光体シートの評価方法およびその製造方法
KR1020167009461A KR20160072109A (ko) 2013-10-16 2014-09-19 형광체 시트의 평가 방법 및 그의 제조 방법
PCT/JP2014/074859 WO2015056524A1 (ja) 2013-10-16 2014-09-19 蛍光体シートの評価方法およびその製造方法
CN201480056881.7A CN105637334A (zh) 2013-10-16 2014-09-19 荧光体片的评价方法及其制造方法
TW103135564A TW201522940A (zh) 2013-10-16 2014-10-14 螢光體片材之評估方法及其製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013215502 2013-10-16
JP2013215502 2013-10-16
JP2014187553A JP2015099912A (ja) 2013-10-16 2014-09-16 蛍光体シートの評価方法およびその製造方法

Publications (1)

Publication Number Publication Date
JP2015099912A true JP2015099912A (ja) 2015-05-28

Family

ID=52827977

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014187553A Pending JP2015099912A (ja) 2013-10-16 2014-09-16 蛍光体シートの評価方法およびその製造方法

Country Status (5)

Country Link
JP (1) JP2015099912A (zh)
KR (1) KR20160072109A (zh)
CN (1) CN105637334A (zh)
TW (1) TW201522940A (zh)
WO (1) WO2015056524A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194948A1 (ja) * 2015-06-02 2016-12-08 日東電工株式会社 蛍光体樹脂シートの製造方法
WO2018163830A1 (ja) * 2017-03-08 2018-09-13 パナソニックＩｐマネジメント株式会社 光源装置
US10553765B2 (en) 2016-11-21 2020-02-04 Nichia Corporation Method for manufacturing light emitting device

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4272308B2 (ja) * 1999-02-04 2009-06-03 エムケー精工株式会社 オイル等劣化判定装置の試料収容セルおよびそれを使用したオイル等劣化判定装置
JP4166355B2 (ja) * 1999-03-08 2008-10-15 出光興産株式会社 蛍光変換膜用樹脂組成物、蛍光変換膜およびカラー化有機エレクトロルミネッセンス素子
US8679865B2 (en) * 2009-08-28 2014-03-25 Samsung Electronics Co., Ltd. Resin application apparatus, optical property correction apparatus and method, and method for manufacturing LED package
JP2011142254A (ja) * 2010-01-08 2011-07-21 Citizen Holdings Co Ltd Ｌｅｄ光源装置の色度調整方法
JP5869769B2 (ja) * 2011-03-07 2016-02-24 コニカミノルタ株式会社 蛍光体層の形成方法および発光装置の製造方法
JP2012227413A (ja) * 2011-04-21 2012-11-15 Mitsubishi Electric Corp 封止樹脂の塗布装置及び発光装置の製造方法
JP5413405B2 (ja) * 2011-05-30 2014-02-12 パナソニック株式会社 樹脂塗布装置および樹脂塗布方法
JP2013140848A (ja) 2011-12-28 2013-07-18 Nitto Denko Corp 封止用シートおよび光半導体素子装置
CN102522483B (zh) * 2011-11-18 2014-08-27 深圳市光峰光电技术有限公司 光波长转换片及其制造方法以及光源装置
WO2014038169A1 (ja) * 2012-09-06 2014-03-13 シャープ株式会社 発光素子基板およびその製造方法
JP2014056929A (ja) * 2012-09-12 2014-03-27 Sharp Corp 発光素子モジュールの製造方法および発光素子モジュール基板

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016194948A1 (ja) * 2015-06-02 2016-12-08 日東電工株式会社 蛍光体樹脂シートの製造方法
US10553765B2 (en) 2016-11-21 2020-02-04 Nichia Corporation Method for manufacturing light emitting device
WO2018163830A1 (ja) * 2017-03-08 2018-09-13 パナソニックＩｐマネジメント株式会社 光源装置

Also Published As

Publication number Publication date
TW201522940A (zh) 2015-06-16
KR20160072109A (ko) 2016-06-22
WO2015056524A1 (ja) 2015-04-23
CN105637334A (zh) 2016-06-01

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