JP2015070200A5 - - Google Patents
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- Publication number
- JP2015070200A5 JP2015070200A5 JP2013205137A JP2013205137A JP2015070200A5 JP 2015070200 A5 JP2015070200 A5 JP 2015070200A5 JP 2013205137 A JP2013205137 A JP 2013205137A JP 2013205137 A JP2013205137 A JP 2013205137A JP 2015070200 A5 JP2015070200 A5 JP 2015070200A5
- Authority
- JP
- Japan
- Prior art keywords
- face
- electrode pad
- semiconductor layer
- type semiconductor
- conductive type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 19
- 239000000758 substrate Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013205137A JP6238226B2 (ja) | 2013-09-30 | 2013-09-30 | 半導体レーザ装置 |
| US14/500,093 US9397473B2 (en) | 2013-09-30 | 2014-09-29 | Laser diode and transmitter module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013205137A JP6238226B2 (ja) | 2013-09-30 | 2013-09-30 | 半導体レーザ装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015070200A JP2015070200A (ja) | 2015-04-13 |
| JP2015070200A5 true JP2015070200A5 (enExample) | 2016-11-17 |
| JP6238226B2 JP6238226B2 (ja) | 2017-11-29 |
Family
ID=52740148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013205137A Active JP6238226B2 (ja) | 2013-09-30 | 2013-09-30 | 半導体レーザ装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9397473B2 (enExample) |
| JP (1) | JP6238226B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6512602B2 (ja) | 2014-06-02 | 2019-05-15 | 住友電工デバイス・イノベーション株式会社 | 半導体レーザ素子 |
| JP6897928B2 (ja) * | 2016-01-14 | 2021-07-07 | 住友電工デバイス・イノベーション株式会社 | 光半導体素子の製造方法および光半導体素子 |
| KR101929465B1 (ko) * | 2016-10-18 | 2019-03-14 | 주식회사 옵텔라 | 광학모듈 |
| US20220140567A1 (en) * | 2019-03-08 | 2022-05-05 | Rohm Co., Ltd. | Semiconductor laser device |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03203281A (ja) * | 1989-12-28 | 1991-09-04 | Toshiba Corp | 半導体レーザ装置 |
| JPH0582907A (ja) * | 1991-09-20 | 1993-04-02 | Fujitsu Ltd | 半導体レーザアレイおよびその駆動方法 |
| JPH0851256A (ja) * | 1995-07-21 | 1996-02-20 | Hitachi Ltd | 半導体レーザ |
| US6553044B1 (en) * | 1998-10-20 | 2003-04-22 | Quantum Devices, Inc. | Method and apparatus for reducing electrical and thermal crosstalk of a laser array |
| JP3896723B2 (ja) * | 1999-03-26 | 2007-03-22 | 松下電器産業株式会社 | 窒化物半導体レーザ素子およびその製造方法 |
| US6653662B2 (en) * | 2000-11-01 | 2003-11-25 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device, method for fabricating the same, and method for driving the same |
| DE10239003A1 (de) * | 2001-09-17 | 2003-04-03 | Heidelberger Druckmasch Ag | Mehrstrahllaserlichtquelle mit variablem Laserlichtquellenabstand zur Bebilderung von Druckformen |
| JP2003264334A (ja) * | 2002-03-08 | 2003-09-19 | Hitachi Ltd | 半導体レーザ素子及び半導体レーザモジュール |
| JP2004281682A (ja) * | 2003-03-14 | 2004-10-07 | Sumitomo Electric Ind Ltd | 光送信装置 |
| JP4620401B2 (ja) * | 2004-07-21 | 2011-01-26 | 三菱電機株式会社 | 半導体レーザ素子 |
| JP4815814B2 (ja) * | 2005-02-04 | 2011-11-16 | 三菱電機株式会社 | 光モジュール |
| JP4411540B2 (ja) * | 2005-09-15 | 2010-02-10 | ソニー株式会社 | 半導体レーザ装置 |
| US7492798B2 (en) * | 2005-12-20 | 2009-02-17 | Finisar Corporation | Modular transistor outline can with internal components |
| US7656914B1 (en) * | 2007-02-15 | 2010-02-02 | Bookham Technology Plc | Directly-modulated diode lasers with reduced overshoot |
| JP2010272569A (ja) * | 2009-05-19 | 2010-12-02 | Panasonic Corp | 半導体レーザ装置 |
| JP2010272784A (ja) * | 2009-05-25 | 2010-12-02 | Panasonic Corp | 半導体レーザ装置 |
| US8821042B2 (en) | 2011-07-04 | 2014-09-02 | Sumitomo Electic Industries, Ltd. | Optical module with lens assembly directly mounted on carrier by soldering and laser diode indirectly mounted on carrier through sub-mount |
-
2013
- 2013-09-30 JP JP2013205137A patent/JP6238226B2/ja active Active
-
2014
- 2014-09-29 US US14/500,093 patent/US9397473B2/en active Active
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