JP2011521480A5 - - Google Patents

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Publication number
JP2011521480A5
JP2011521480A5 JP2011510815A JP2011510815A JP2011521480A5 JP 2011521480 A5 JP2011521480 A5 JP 2011521480A5 JP 2011510815 A JP2011510815 A JP 2011510815A JP 2011510815 A JP2011510815 A JP 2011510815A JP 2011521480 A5 JP2011521480 A5 JP 2011521480A5
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JP
Japan
Prior art keywords
semiconductor device
chip
semiconductor
semiconductor chip
transmissive body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011510815A
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English (en)
Japanese (ja)
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JP2011521480A (ja
Filing date
Publication date
Priority claimed from DE102008025756.7A external-priority patent/DE102008025756B4/de
Application filed filed Critical
Publication of JP2011521480A publication Critical patent/JP2011521480A/ja
Publication of JP2011521480A5 publication Critical patent/JP2011521480A5/ja
Pending legal-status Critical Current

Links

JP2011510815A 2008-05-29 2009-04-20 半導体装置 Pending JP2011521480A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008025756.7 2008-05-29
DE102008025756.7A DE102008025756B4 (de) 2008-05-29 2008-05-29 Halbleiteranordnung
PCT/DE2009/000542 WO2009143795A1 (de) 2008-05-29 2009-04-20 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
JP2011521480A JP2011521480A (ja) 2011-07-21
JP2011521480A5 true JP2011521480A5 (enExample) 2012-02-02

Family

ID=41061228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011510815A Pending JP2011521480A (ja) 2008-05-29 2009-04-20 半導体装置

Country Status (7)

Country Link
US (1) US8461616B2 (enExample)
EP (1) EP2281315B1 (enExample)
JP (1) JP2011521480A (enExample)
KR (1) KR101634406B1 (enExample)
CN (1) CN101971376B (enExample)
DE (1) DE102008025756B4 (enExample)
WO (1) WO2009143795A1 (enExample)

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DE102014217986A1 (de) * 2014-03-27 2015-10-01 Tridonic Jennersdorf Gmbh LED Modul mit integrierter Sekundäroptik
US11005012B2 (en) 2015-10-19 2021-05-11 Lumileds Llc Wavelength converted light emitting device with textured substrate
CN109148674B (zh) 2017-06-28 2023-05-16 日亚化学工业株式会社 发光装置
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US20230042041A1 (en) * 2020-01-13 2023-02-09 Osram Opto Semiconductors Gmbh Housing, optoelectronic semiconductor component and production method

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