JP2012015522A5 - - Google Patents

Download PDF

Info

Publication number
JP2012015522A5
JP2012015522A5 JP2011147115A JP2011147115A JP2012015522A5 JP 2012015522 A5 JP2012015522 A5 JP 2012015522A5 JP 2011147115 A JP2011147115 A JP 2011147115A JP 2011147115 A JP2011147115 A JP 2011147115A JP 2012015522 A5 JP2012015522 A5 JP 2012015522A5
Authority
JP
Japan
Prior art keywords
light emitting
emitting device
device package
package according
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2011147115A
Other languages
English (en)
Japanese (ja)
Other versions
JP5864147B2 (ja
JP2012015522A (ja
Filing date
Publication date
Priority claimed from KR1020100063563A external-priority patent/KR101705700B1/ko
Application filed filed Critical
Publication of JP2012015522A publication Critical patent/JP2012015522A/ja
Publication of JP2012015522A5 publication Critical patent/JP2012015522A5/ja
Application granted granted Critical
Publication of JP5864147B2 publication Critical patent/JP5864147B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2011147115A 2010-07-01 2011-07-01 発光素子パッケージ、照明システム Expired - Fee Related JP5864147B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0063563 2010-07-01
KR1020100063563A KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자

Publications (3)

Publication Number Publication Date
JP2012015522A JP2012015522A (ja) 2012-01-19
JP2012015522A5 true JP2012015522A5 (enExample) 2014-08-14
JP5864147B2 JP5864147B2 (ja) 2016-02-17

Family

ID=44802546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011147115A Expired - Fee Related JP5864147B2 (ja) 2010-07-01 2011-07-01 発光素子パッケージ、照明システム

Country Status (6)

Country Link
US (1) US9059385B2 (enExample)
EP (1) EP2402993B1 (enExample)
JP (1) JP5864147B2 (enExample)
KR (1) KR101705700B1 (enExample)
CN (1) CN102315207B (enExample)
TW (1) TWI527269B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130019929A1 (en) * 2011-07-19 2013-01-24 International Business Machines Reduction of light induced degradation by minimizing band offset
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
KR101430602B1 (ko) 2013-03-14 2014-08-18 미래정보산업(주) 발광 소자 모듈
TWI506812B (zh) * 2013-04-22 2015-11-01 隆達電子股份有限公司 具有側邊固晶結構之發光二極體元件及具有其之固定結構
TW201500687A (zh) 2013-06-24 2015-01-01 Beautiful Light Technology Corp 發光二極體燈泡
KR102486035B1 (ko) * 2016-01-28 2023-01-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 구비한 발광 장치
CN106287336B (zh) * 2016-08-31 2018-10-23 四川柯西澳光电科技有限公司 空气净化灯
JP2020092155A (ja) * 2018-12-05 2020-06-11 株式会社ダイセル 光半導体装置
KR102768192B1 (ko) * 2019-03-25 2025-02-14 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP7292352B2 (ja) * 2021-11-02 2023-06-16 三菱電機株式会社 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199447A (ja) 1987-02-16 1988-08-17 Oki Electric Ind Co Ltd 半導体装置のリ−ド
JP3117828B2 (ja) 1992-12-28 2000-12-18 ローム株式会社 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
US5629239A (en) * 1995-03-21 1997-05-13 Tessera, Inc. Manufacture of semiconductor connection components with frangible lead sections
EP2267798B1 (de) * 1997-07-29 2015-09-30 OSRAM Opto Semiconductors GmbH Optoelektronisches Bauelement
WO1999060626A1 (fr) * 1998-05-20 1999-11-25 Rohm Co., Ltd. Dispositif semi-conducteur
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP2002314138A (ja) 2001-04-09 2002-10-25 Toshiba Corp 発光装置
TW561636B (en) * 2002-10-11 2003-11-11 Highlink Technology Corp Optoelectronic device
JP4789433B2 (ja) * 2004-06-30 2011-10-12 三洋電機株式会社 Ｌｅｄ表示器用筺体及びｌｅｄ表示器
JP4473674B2 (ja) * 2004-08-06 2010-06-02 パナソニック株式会社 半導体パッケージ及びその製造方法
KR100659173B1 (ko) 2005-02-02 2006-12-19 럭스피아 주식회사 측면발광형 발광다이오드 패캐지
JP4922663B2 (ja) * 2006-05-18 2012-04-25 スタンレー電気株式会社 半導体光学装置
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP4952215B2 (ja) * 2006-08-17 2012-06-13 日亜化学工業株式会社 発光装置
JP2008060344A (ja) * 2006-08-31 2008-03-13 Toshiba Corp 半導体発光装置
JP2008198807A (ja) * 2007-02-14 2008-08-28 Nichia Corp 半導体装置
JP2008218764A (ja) * 2007-03-06 2008-09-18 Toyoda Gosei Co Ltd 発光装置
US7993038B2 (en) 2007-03-06 2011-08-09 Toyoda Gosei Co., Ltd. Light-emitting device
JP2009099771A (ja) * 2007-10-17 2009-05-07 Rohm Co Ltd 半導体発光モジュール
JP5349811B2 (ja) * 2008-02-06 2013-11-20 シャープ株式会社 半導体発光装置
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
US9022632B2 (en) * 2008-07-03 2015-05-05 Samsung Electronics Co., Ltd. LED package and a backlight unit unit comprising said LED package
KR101013976B1 (ko) 2008-12-03 2011-02-14 현대자동차주식회사 액티브 지오메트리 컨트롤 서스펜션의 진동 저감장치
US8901583B2 (en) * 2010-04-12 2014-12-02 Cree Huizhou Opto Limited Surface mount device thin package

Similar Documents

Publication Publication Date Title
JP2012015522A5 (enExample)
JP2011521480A5 (enExample)
EP2650590A3 (en) Light emitting package
RU2019114690A (ru) Светоизлучающее устройство
JP2008227531A5 (enExample)
JP2016082231A5 (enExample)
EP2538462A3 (en) Light emitting device module
EP2477242A3 (en) Light-emitting device package and method of manufacturing the same
JP2017183578A5 (enExample)
JP3175535U7 (enExample)
EP2565950A3 (en) Light emitting device
JP2020526004A5 (enExample)
CN203962803U (zh) 来令片散热改良结构
JP2013219357A5 (enExample)
JP2017142376A5 (enExample)
JP2014099547A5 (enExample)
JP2014057060A5 (enExample)
JP2006066813A5 (enExample)
JP2010034295A5 (enExample)
JP2006313943A5 (enExample)
JP2014120778A5 (enExample)
JP2015008237A5 (enExample)
JP2015159321A5 (enExample)
JP2015012287A5 (enExample)
EP2610933A3 (en) Molded package for light emitting device