KR101705700B1 - 발광 소자 - Google Patents

발광 소자 Download PDF

Info

Publication number
KR101705700B1
KR101705700B1 KR1020100063563A KR20100063563A KR101705700B1 KR 101705700 B1 KR101705700 B1 KR 101705700B1 KR 1020100063563 A KR1020100063563 A KR 1020100063563A KR 20100063563 A KR20100063563 A KR 20100063563A KR 101705700 B1 KR101705700 B1 KR 101705700B1
Authority
KR
South Korea
Prior art keywords
light emitting
electrode
pad
light
upper electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020100063563A
Other languages
English (en)
Korean (ko)
Other versions
KR20120002849A (ko
Inventor
윤재준
Original Assignee
엘지이노텍 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100063563A priority Critical patent/KR101705700B1/ko
Priority to US13/173,396 priority patent/US9059385B2/en
Priority to TW100123056A priority patent/TWI527269B/zh
Priority to CN201110191007.2A priority patent/CN102315207B/zh
Priority to EP11172315.1A priority patent/EP2402993B1/en
Priority to JP2011147115A priority patent/JP5864147B2/ja
Publication of KR20120002849A publication Critical patent/KR20120002849A/ko
Application granted granted Critical
Publication of KR101705700B1 publication Critical patent/KR101705700B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/857—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020100063563A 2010-07-01 2010-07-01 발광 소자 Active KR101705700B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100063563A KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자
US13/173,396 US9059385B2 (en) 2010-07-01 2011-06-30 Light emitting device package
TW100123056A TWI527269B (zh) 2010-07-01 2011-06-30 發光元件封裝
CN201110191007.2A CN102315207B (zh) 2010-07-01 2011-07-01 发光器件封装
EP11172315.1A EP2402993B1 (en) 2010-07-01 2011-07-01 Lead frame used in a light emitting device package
JP2011147115A JP5864147B2 (ja) 2010-07-01 2011-07-01 発光素子パッケージ、照明システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100063563A KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자

Publications (2)

Publication Number Publication Date
KR20120002849A KR20120002849A (ko) 2012-01-09
KR101705700B1 true KR101705700B1 (ko) 2017-02-10

Family

ID=44802546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100063563A Active KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자

Country Status (6)

Country Link
US (1) US9059385B2 (enExample)
EP (1) EP2402993B1 (enExample)
JP (1) JP5864147B2 (enExample)
KR (1) KR101705700B1 (enExample)
CN (1) CN102315207B (enExample)
TW (1) TWI527269B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130019929A1 (en) * 2011-07-19 2013-01-24 International Business Machines Reduction of light induced degradation by minimizing band offset
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
KR101430602B1 (ko) 2013-03-14 2014-08-18 미래정보산업(주) 발광 소자 모듈
TWI506812B (zh) * 2013-04-22 2015-11-01 隆達電子股份有限公司 具有側邊固晶結構之發光二極體元件及具有其之固定結構
TW201500687A (zh) 2013-06-24 2015-01-01 Beautiful Light Technology Corp 發光二極體燈泡
KR102486035B1 (ko) * 2016-01-28 2023-01-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 구비한 발광 장치
CN106287336B (zh) * 2016-08-31 2018-10-23 四川柯西澳光电科技有限公司 空气净化灯
JP2020092155A (ja) * 2018-12-05 2020-06-11 株式会社ダイセル 光半導体装置
KR102768192B1 (ko) * 2019-03-25 2025-02-14 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP7292352B2 (ja) * 2021-11-02 2023-06-16 三菱電機株式会社 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049690A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 半導体パッケージ，その製造方法及び半導体デバイス
JP2008198807A (ja) 2007-02-14 2008-08-28 Nichia Corp 半導体装置
JP2009099771A (ja) * 2007-10-17 2009-05-07 Rohm Co Ltd 半導体発光モジュール
JP2009188201A (ja) 2008-02-06 2009-08-20 Sharp Corp 半導体発光装置

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63199447A (ja) 1987-02-16 1988-08-17 Oki Electric Ind Co Ltd 半導体装置のリ−ド
JP3117828B2 (ja) 1992-12-28 2000-12-18 ローム株式会社 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
US5629239A (en) * 1995-03-21 1997-05-13 Tessera, Inc. Manufacture of semiconductor connection components with frangible lead sections
EP1566846B1 (de) * 1997-07-29 2016-02-03 OSRAM Opto Semiconductors GmbH Optoelektronisches Bauelement
WO1999060626A1 (fr) * 1998-05-20 1999-11-25 Rohm Co., Ltd. Dispositif semi-conducteur
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP2002314138A (ja) 2001-04-09 2002-10-25 Toshiba Corp 発光装置
TW561636B (en) * 2002-10-11 2003-11-11 Highlink Technology Corp Optoelectronic device
JP4789433B2 (ja) * 2004-06-30 2011-10-12 三洋電機株式会社 Ｌｅｄ表示器用筺体及びｌｅｄ表示器
KR100659173B1 (ko) 2005-02-02 2006-12-19 럭스피아 주식회사 측면발광형 발광다이오드 패캐지
JP4922663B2 (ja) * 2006-05-18 2012-04-25 スタンレー電気株式会社 半導体光学装置
WO2007135707A1 (ja) 2006-05-18 2007-11-29 Nichia Corporation 樹脂成形体及び表面実装型発光装置並びにそれらの製造方法
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP4952215B2 (ja) * 2006-08-17 2012-06-13 日亜化学工業株式会社 発光装置
JP2008060344A (ja) * 2006-08-31 2008-03-13 Toshiba Corp 半導体発光装置
JP2008218764A (ja) * 2007-03-06 2008-09-18 Toyoda Gosei Co Ltd 発光装置
US7993038B2 (en) 2007-03-06 2011-08-09 Toyoda Gosei Co., Ltd. Light-emitting device
US8049230B2 (en) * 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
WO2010002226A2 (ko) * 2008-07-03 2010-01-07 삼성엘이디 주식회사 Led 패키지 및 그 led 패키지를 포함하는 백라이트 유닛
KR101013976B1 (ko) 2008-12-03 2011-02-14 현대자동차주식회사 액티브 지오메트리 컨트롤 서스펜션의 진동 저감장치
US8901583B2 (en) * 2010-04-12 2014-12-02 Cree Huizhou Opto Limited Surface mount device thin package

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049690A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 半導体パッケージ，その製造方法及び半導体デバイス
JP2008198807A (ja) 2007-02-14 2008-08-28 Nichia Corp 半導体装置
JP2009099771A (ja) * 2007-10-17 2009-05-07 Rohm Co Ltd 半導体発光モジュール
JP2009188201A (ja) 2008-02-06 2009-08-20 Sharp Corp 半導体発光装置

Also Published As

Publication number Publication date
CN102315207B (zh) 2015-11-25
US20120001216A1 (en) 2012-01-05
TWI527269B (zh) 2016-03-21
EP2402993B1 (en) 2019-09-18
CN102315207A (zh) 2012-01-11
JP2012015522A (ja) 2012-01-19
US9059385B2 (en) 2015-06-16
JP5864147B2 (ja) 2016-02-17
EP2402993A3 (en) 2014-06-04
EP2402993A2 (en) 2012-01-04
TW201205893A (en) 2012-02-01
KR20120002849A (ko) 2012-01-09

Similar Documents

Publication Publication Date Title
KR101705700B1 (ko) 발광 소자
JP5203528B2 (ja) 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法
JP6629382B2 (ja) 発光素子パッケージ
US8439513B2 (en) Light emitting diode module and back light assembly
JP2007279480A (ja) 液晶表示装置
US20120091489A1 (en) Substrate for mounting light-emitting elements, light-emitting device, and method for manufacturing same
KR101660721B1 (ko) 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛과 디스플레이장치
KR20120070683A (ko) 발광 다이오드 패키지, 이를 갖는 광원 모듈 및 백라이트 어셈블리
US8587008B2 (en) Light-emitting device
KR101676670B1 (ko) 발광 소자
US20140254182A1 (en) Light emitting device
KR100795178B1 (ko) 백라이트 유니트용 ｌｅｄ 패키지
KR101694178B1 (ko) 발광 소자
KR20120002848A (ko) 발광 소자
JP2021168229A (ja) 線状発光部材及び面状発光装置
WO2020262552A1 (ja) 線状発光装置
JP2008211157A (ja) 半導体発光モジュール、装置

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20200109

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000