KR101705700B1 - 발광 소자 - Google Patents

발광 소자 Download PDF

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Publication number
KR101705700B1
KR101705700B1 KR1020100063563A KR20100063563A KR101705700B1 KR 101705700 B1 KR101705700 B1 KR 101705700B1 KR 1020100063563 A KR1020100063563 A KR 1020100063563A KR 20100063563 A KR20100063563 A KR 20100063563A KR 101705700 B1 KR101705700 B1 KR 101705700B1
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KR
South Korea
Prior art keywords
light emitting
electrode
pad
light
upper electrode
Prior art date
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Active
Application number
KR1020100063563A
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English (en)
Korean (ko)
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KR20120002849A (ko
Inventor
윤재준
Original Assignee
엘지이노텍 주식회사
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Application filed by 엘지이노텍 주식회사 filed Critical 엘지이노텍 주식회사
Priority to KR1020100063563A priority Critical patent/KR101705700B1/ko
Priority to US13/173,396 priority patent/US9059385B2/en
Priority to TW100123056A priority patent/TWI527269B/zh
Priority to CN201110191007.2A priority patent/CN102315207B/zh
Priority to JP2011147115A priority patent/JP5864147B2/ja
Priority to EP11172315.1A priority patent/EP2402993B1/en
Publication of KR20120002849A publication Critical patent/KR20120002849A/ko
Application granted granted Critical
Publication of KR101705700B1 publication Critical patent/KR101705700B1/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/857—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/20—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00
    • H10H29/24—Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00 comprising multiple light-emitting semiconductor devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/80—Constructional details
    • H10H29/85—Packages
    • H10H29/858—Means for heat extraction or cooling
    • H10H29/8585—Means for heat extraction or cooling being an interconnection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8585—Means for heat extraction or cooling being an interconnection

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
KR1020100063563A 2010-07-01 2010-07-01 발광 소자 Active KR101705700B1 (ko)

Priority Applications (6)

Application Number Priority Date Filing Date Title
KR1020100063563A KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자
US13/173,396 US9059385B2 (en) 2010-07-01 2011-06-30 Light emitting device package
TW100123056A TWI527269B (zh) 2010-07-01 2011-06-30 發光元件封裝
CN201110191007.2A CN102315207B (zh) 2010-07-01 2011-07-01 发光器件封装
JP2011147115A JP5864147B2 (ja) 2010-07-01 2011-07-01 発光素子パッケージ、照明システム
EP11172315.1A EP2402993B1 (en) 2010-07-01 2011-07-01 Lead frame used in a light emitting device package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100063563A KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자

Publications (2)

Publication Number Publication Date
KR20120002849A KR20120002849A (ko) 2012-01-09
KR101705700B1 true KR101705700B1 (ko) 2017-02-10

Family

ID=44802546

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100063563A Active KR101705700B1 (ko) 2010-07-01 2010-07-01 발광 소자

Country Status (6)

Country Link
US (1) US9059385B2 (enExample)
EP (1) EP2402993B1 (enExample)
JP (1) JP5864147B2 (enExample)
KR (1) KR101705700B1 (enExample)
CN (1) CN102315207B (enExample)
TW (1) TWI527269B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130019929A1 (en) * 2011-07-19 2013-01-24 International Business Machines Reduction of light induced degradation by minimizing band offset
KR101908656B1 (ko) * 2012-04-09 2018-10-16 엘지이노텍 주식회사 발광 소자 패키지
KR101430602B1 (ko) * 2013-03-14 2014-08-18 미래정보산업(주) 발광 소자 모듈
TWI506812B (zh) * 2013-04-22 2015-11-01 隆達電子股份有限公司 具有側邊固晶結構之發光二極體元件及具有其之固定結構
TW201500687A (zh) 2013-06-24 2015-01-01 Beautiful Light Technology Corp 發光二極體燈泡
KR102486035B1 (ko) * 2016-01-28 2023-01-06 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 발광 소자 패키지 및 이를 구비한 발광 장치
CN106287336B (zh) * 2016-08-31 2018-10-23 四川柯西澳光电科技有限公司 空气净化灯
JP2020092155A (ja) * 2018-12-05 2020-06-11 株式会社ダイセル 光半導体装置
KR102768192B1 (ko) * 2019-03-25 2025-02-14 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
JP7292352B2 (ja) * 2021-11-02 2023-06-16 三菱電機株式会社 樹脂封止型半導体装置及び樹脂封止型半導体装置の製造方法

Citations (4)

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JP2006049690A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 半導体パッケージ，その製造方法及び半導体デバイス
JP2008198807A (ja) 2007-02-14 2008-08-28 Nichia Corp 半導体装置
JP2009099771A (ja) * 2007-10-17 2009-05-07 Rohm Co Ltd 半導体発光モジュール
JP2009188201A (ja) 2008-02-06 2009-08-20 Sharp Corp 半導体発光装置

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JPS63199447A (ja) 1987-02-16 1988-08-17 Oki Electric Ind Co Ltd 半導体装置のリ−ド
JP3117828B2 (ja) 1992-12-28 2000-12-18 ローム株式会社 合成樹脂封止型電子部品及びそのリード端子の曲げ加工方法
US5629239A (en) * 1995-03-21 1997-05-13 Tessera, Inc. Manufacture of semiconductor connection components with frangible lead sections
EP1004145B1 (de) * 1997-07-29 2005-06-01 Osram Opto Semiconductors GmbH Optoelektronisches bauelement
CN1219320C (zh) * 1998-05-20 2005-09-14 罗姆股份有限公司 半导体器件
DE19829197C2 (de) 1998-06-30 2002-06-20 Siemens Ag Strahlungsaussendendes und/oder -empfangendes Bauelement
JP2002314138A (ja) 2001-04-09 2002-10-25 Toshiba Corp 発光装置
TW561636B (en) * 2002-10-11 2003-11-11 Highlink Technology Corp Optoelectronic device
JP4789433B2 (ja) * 2004-06-30 2011-10-12 三洋電機株式会社 Ｌｅｄ表示器用筺体及びｌｅｄ表示器
KR100659173B1 (ko) 2005-02-02 2006-12-19 럭스피아 주식회사 측면발광형 발광다이오드 패캐지
US9502624B2 (en) 2006-05-18 2016-11-22 Nichia Corporation Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same
JP4922663B2 (ja) * 2006-05-18 2012-04-25 スタンレー電気株式会社 半導体光学装置
US8367945B2 (en) * 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
JP4952215B2 (ja) * 2006-08-17 2012-06-13 日亜化学工業株式会社 発光装置
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Publication number Priority date Publication date Assignee Title
JP2006049690A (ja) * 2004-08-06 2006-02-16 Matsushita Electric Ind Co Ltd 半導体パッケージ，その製造方法及び半導体デバイス
JP2008198807A (ja) 2007-02-14 2008-08-28 Nichia Corp 半導体装置
JP2009099771A (ja) * 2007-10-17 2009-05-07 Rohm Co Ltd 半導体発光モジュール
JP2009188201A (ja) 2008-02-06 2009-08-20 Sharp Corp 半導体発光装置

Also Published As

Publication number Publication date
TWI527269B (zh) 2016-03-21
EP2402993A2 (en) 2012-01-04
EP2402993B1 (en) 2019-09-18
CN102315207A (zh) 2012-01-11
KR20120002849A (ko) 2012-01-09
EP2402993A3 (en) 2014-06-04
US20120001216A1 (en) 2012-01-05
US9059385B2 (en) 2015-06-16
CN102315207B (zh) 2015-11-25
TW201205893A (en) 2012-02-01
JP5864147B2 (ja) 2016-02-17
JP2012015522A (ja) 2012-01-19

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