KR101634406B1 - 반도체 장치 - Google Patents
반도체 장치 Download PDFInfo
- Publication number
- KR101634406B1 KR101634406B1 KR1020107019817A KR20107019817A KR101634406B1 KR 101634406 B1 KR101634406 B1 KR 101634406B1 KR 1020107019817 A KR1020107019817 A KR 1020107019817A KR 20107019817 A KR20107019817 A KR 20107019817A KR 101634406 B1 KR101634406 B1 KR 101634406B1
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- semiconductor chip
- semiconductor device
- semiconductor
- radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F19/00—Integrated devices, or assemblies of multiple devices, comprising at least one photovoltaic cell covered by group H10F10/00, e.g. photovoltaic modules
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/853—Encapsulations characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Led Device Packages (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008025756.7 | 2008-05-29 | ||
| DE102008025756.7A DE102008025756B4 (de) | 2008-05-29 | 2008-05-29 | Halbleiteranordnung |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110030417A KR20110030417A (ko) | 2011-03-23 |
| KR101634406B1 true KR101634406B1 (ko) | 2016-06-28 |
Family
ID=41061228
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107019817A Active KR101634406B1 (ko) | 2008-05-29 | 2009-04-20 | 반도체 장치 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8461616B2 (enExample) |
| EP (1) | EP2281315B1 (enExample) |
| JP (1) | JP2011521480A (enExample) |
| KR (1) | KR101634406B1 (enExample) |
| CN (1) | CN101971376B (enExample) |
| DE (1) | DE102008025756B4 (enExample) |
| WO (1) | WO2009143795A1 (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9142740B2 (en) | 2003-07-04 | 2015-09-22 | Epistar Corporation | Optoelectronic element and manufacturing method thereof |
| US9000461B2 (en) * | 2003-07-04 | 2015-04-07 | Epistar Corporation | Optoelectronic element and manufacturing method thereof |
| US10686106B2 (en) | 2003-07-04 | 2020-06-16 | Epistar Corporation | Optoelectronic element |
| DE102009017946A1 (de) * | 2009-04-17 | 2010-10-21 | Osram Opto Semiconductors Gmbh | Linse, optoelektronisches Bauelement aufweisend eine Linse und Verfahren zur Herstellung einer Linse |
| DE102009024425B4 (de) * | 2009-06-09 | 2011-11-17 | Diehl Aerospace Gmbh | Anschlusseinrichtung für eine lichtemittierende Diode und Beleuchtungseinheit |
| DE102010055265A1 (de) | 2010-12-20 | 2012-06-21 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
| CN102651446B (zh) * | 2011-02-25 | 2014-12-10 | 展晶科技(深圳)有限公司 | 发光二极管封装结构及光源装置 |
| DE102011102350A1 (de) | 2011-05-24 | 2012-11-29 | Osram Opto Semiconductors Gmbh | Optisches Element, optoelektronisches Bauelement und Verfahren zur Herstellung dieser |
| DE102011102590A1 (de) * | 2011-05-27 | 2012-11-29 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen von Leuchtdioden-Bauelementen |
| KR102071088B1 (ko) * | 2012-01-17 | 2020-01-29 | 루미리즈 홀딩 비.브이. | 큰 각도로 광을 방출하는 반도체 발광 디바이스 램프 |
| DE102012102122A1 (de) * | 2012-03-13 | 2013-09-19 | Osram Opto Semiconductors Gmbh | Flächenlichtquelle |
| DE102012102114B4 (de) * | 2012-03-13 | 2021-09-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes Halbleiterbauteil, Beleuchtungsvorrichtung und Anzeigevorrichtung |
| US8889439B2 (en) * | 2012-08-24 | 2014-11-18 | Tsmc Solid State Lighting Ltd. | Method and apparatus for packaging phosphor-coated LEDs |
| KR102204741B1 (ko) * | 2013-07-26 | 2021-01-20 | 루미리즈 홀딩 비.브이. | 내부의 높은 인덱스 기둥을 가지는 led 돔 |
| EP2854186A1 (en) * | 2013-09-26 | 2015-04-01 | Seoul Semiconductor Co., Ltd. | Light source module, fabrication method therefor, and backlight unit including the same |
| JP2017504215A (ja) * | 2014-01-23 | 2017-02-02 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | セルフアライン式プリフォームレンズを有する発光デバイス |
| JP2015165536A (ja) * | 2014-03-03 | 2015-09-17 | ウシオ電機株式会社 | 発光装置および発光モジュール |
| DE102014217986A1 (de) * | 2014-03-27 | 2015-10-01 | Tridonic Jennersdorf Gmbh | LED Modul mit integrierter Sekundäroptik |
| KR102657885B1 (ko) | 2015-10-19 | 2024-04-17 | 루미리즈 홀딩 비.브이. | 텍스처화된 기판을 갖는 파장 변환된 발광 디바이스 |
| CN109148674B (zh) | 2017-06-28 | 2023-05-16 | 日亚化学工业株式会社 | 发光装置 |
| JP6899412B2 (ja) * | 2018-07-27 | 2021-07-07 | 住友化学株式会社 | Ledデバイスの製造方法 |
| CN114930523B (zh) * | 2020-01-13 | 2025-06-10 | 欧司朗光电半导体有限公司 | 壳体、光电子半导体器件和制造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203396A (ja) | 2000-01-20 | 2001-07-27 | Sanyo Electric Co Ltd | 光照射装置 |
| JP2004281606A (ja) * | 2003-03-14 | 2004-10-07 | Toyoda Gosei Co Ltd | 発光装置およびその製造方法 |
| JP2007242820A (ja) | 2006-03-08 | 2007-09-20 | Asahi Kasei Corp | 発光デバイス及び発光デバイスモジュール |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5216805A (en) * | 1990-12-12 | 1993-06-08 | Eastman Kodak Company | Method of manufacturing an optoelectronic device package |
| BRPI9715293B1 (pt) | 1996-06-26 | 2016-11-01 | Osram Ag | elemento de cobertura para um elemento de construção optoeletrônico |
| DE19625622A1 (de) | 1996-06-26 | 1998-01-02 | Siemens Ag | Lichtabstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| DE19638667C2 (de) | 1996-09-20 | 2001-05-17 | Osram Opto Semiconductors Gmbh | Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| DE10023353A1 (de) * | 2000-05-12 | 2001-11-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung |
| US6345903B1 (en) * | 2000-09-01 | 2002-02-12 | Citizen Electronics Co., Ltd. | Surface-mount type emitting diode and method of manufacturing same |
| US7053419B1 (en) * | 2000-09-12 | 2006-05-30 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| US7064355B2 (en) * | 2000-09-12 | 2006-06-20 | Lumileds Lighting U.S., Llc | Light emitting diodes with improved light extraction efficiency |
| TW474034B (en) | 2000-11-07 | 2002-01-21 | United Epitaxy Co Ltd | LED and the manufacturing method thereof |
| US7160478B2 (en) | 2001-08-24 | 2007-01-09 | Schott Ag | Method for producing electronic componets |
| KR100638379B1 (ko) * | 2001-08-24 | 2006-10-26 | 쇼오트 아게 | 집적회로의 컨택 제조 및 하우징 공정 |
| EP1536487A4 (en) | 2002-05-28 | 2008-02-06 | Matsushita Electric Works Ltd | ELECTROLUMINESCENT ELEMENT, LIGHT EMITTING DEVICE AND SURFACE EMISSION LIGHTING DEVICE USING THE SAME |
| JP2004128057A (ja) * | 2002-09-30 | 2004-04-22 | Fuji Photo Film Co Ltd | 発光装置およびその製造方法 |
| CN1777999B (zh) * | 2003-02-26 | 2010-05-26 | 美商克立股份有限公司 | 复合式白色光源及其制造方法 |
| US7061065B2 (en) | 2003-03-31 | 2006-06-13 | National Chung-Hsing University | Light emitting diode and method for producing the same |
| US7791274B2 (en) | 2004-01-07 | 2010-09-07 | Panasonic Corporation | LED lamp |
| US7361938B2 (en) * | 2004-06-03 | 2008-04-22 | Philips Lumileds Lighting Company Llc | Luminescent ceramic for a light emitting device |
| US20050280016A1 (en) | 2004-06-17 | 2005-12-22 | Mok Thye L | PCB-based surface mount LED device with silicone-based encapsulation structure |
| DE102004036157B4 (de) | 2004-07-26 | 2023-03-16 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Leuchtmodul |
| DE102004047640A1 (de) | 2004-09-30 | 2006-04-13 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement |
| US7419839B2 (en) | 2004-11-12 | 2008-09-02 | Philips Lumileds Lighting Company, Llc | Bonding an optical element to a light emitting device |
| WO2006114745A2 (en) * | 2005-04-28 | 2006-11-02 | Koninklijke Philips Electronics N.V. | Light source comprising led arranged in recess |
| DE102006037737A1 (de) | 2005-12-09 | 2007-06-14 | Osram Opto Semiconductors Gmbh | Optische Vorrichtung, optoelektronische Vorrichtung und Verfahren zur Herstellung einer optoelektronischen Vorrichtung |
| TW200735327A (en) | 2005-12-14 | 2007-09-16 | Koninkl Philips Electronics Nv | Collimation arrangement and illumination system and display device using the same |
| US7375379B2 (en) * | 2005-12-19 | 2008-05-20 | Philips Limileds Lighting Company, Llc | Light-emitting device |
| US7798678B2 (en) * | 2005-12-30 | 2010-09-21 | 3M Innovative Properties Company | LED with compound encapsulant lens |
| TWI303105B (en) * | 2006-01-11 | 2008-11-11 | Advanced Semiconductor Eng | Wafer level package for image sensor components and its fabricating method |
| US7674641B2 (en) | 2006-04-12 | 2010-03-09 | Atomic Energy Council | Method for fabricating white-light-emitting flip-chip diode having silicon quantum dots |
| US7521862B2 (en) | 2006-11-20 | 2009-04-21 | Philips Lumileds Lighting Co., Llc | Light emitting device including luminescent ceramic and light-scattering material |
| US7964888B2 (en) * | 2007-04-18 | 2011-06-21 | Cree, Inc. | Semiconductor light emitting device packages and methods |
| DE102007019776A1 (de) | 2007-04-26 | 2008-10-30 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung einer Mehrzahl optoelektronischer Bauelemente |
| DE102007019775B4 (de) | 2007-04-26 | 2024-11-28 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement |
| US7999283B2 (en) * | 2007-06-14 | 2011-08-16 | Cree, Inc. | Encapsulant with scatterer to tailor spatial emission pattern and color uniformity in light emitting diodes |
| KR101378418B1 (ko) * | 2007-11-01 | 2014-03-27 | 삼성전자주식회사 | 이미지센서 모듈 및 그 제조방법 |
| JP2010161321A (ja) * | 2009-01-09 | 2010-07-22 | Panasonic Corp | 光学デバイスおよびその製造方法 |
-
2008
- 2008-05-29 DE DE102008025756.7A patent/DE102008025756B4/de active Active
-
2009
- 2009-04-20 JP JP2011510815A patent/JP2011521480A/ja active Pending
- 2009-04-20 CN CN200980109077XA patent/CN101971376B/zh active Active
- 2009-04-20 KR KR1020107019817A patent/KR101634406B1/ko active Active
- 2009-04-20 WO PCT/DE2009/000542 patent/WO2009143795A1/de not_active Ceased
- 2009-04-20 EP EP09753511.6A patent/EP2281315B1/de active Active
- 2009-04-20 US US12/995,181 patent/US8461616B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001203396A (ja) | 2000-01-20 | 2001-07-27 | Sanyo Electric Co Ltd | 光照射装置 |
| JP2004281606A (ja) * | 2003-03-14 | 2004-10-07 | Toyoda Gosei Co Ltd | 発光装置およびその製造方法 |
| JP2007242820A (ja) | 2006-03-08 | 2007-09-20 | Asahi Kasei Corp | 発光デバイス及び発光デバイスモジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| US20110266571A1 (en) | 2011-11-03 |
| JP2011521480A (ja) | 2011-07-21 |
| CN101971376B (zh) | 2013-01-02 |
| DE102008025756A1 (de) | 2009-12-03 |
| KR20110030417A (ko) | 2011-03-23 |
| EP2281315B1 (de) | 2018-10-17 |
| EP2281315A1 (de) | 2011-02-09 |
| DE102008025756B4 (de) | 2023-02-23 |
| US8461616B2 (en) | 2013-06-11 |
| CN101971376A (zh) | 2011-02-09 |
| WO2009143795A1 (de) | 2009-12-03 |
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