JP2015070096A - 液滴塗布装置及び液滴塗布方法 - Google Patents

液滴塗布装置及び液滴塗布方法 Download PDF

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Publication number
JP2015070096A
JP2015070096A JP2013202614A JP2013202614A JP2015070096A JP 2015070096 A JP2015070096 A JP 2015070096A JP 2013202614 A JP2013202614 A JP 2013202614A JP 2013202614 A JP2013202614 A JP 2013202614A JP 2015070096 A JP2015070096 A JP 2015070096A
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Japan
Prior art keywords
coating
recess
solution
amount
annular wall
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Pending
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JP2013202614A
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English (en)
Japanese (ja)
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JP2015070096A5 (enrdf_load_stackoverflow
Inventor
昭宏 重山
Akihiro Shigeyama
昭宏 重山
千尋 手島
Chihiro Tejima
千尋 手島
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Shibaura Mechatronics Corp
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Shibaura Mechatronics Corp
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Priority to JP2013202614A priority Critical patent/JP2015070096A/ja
Publication of JP2015070096A publication Critical patent/JP2015070096A/ja
Publication of JP2015070096A5 publication Critical patent/JP2015070096A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2013202614A 2013-09-27 2013-09-27 液滴塗布装置及び液滴塗布方法 Pending JP2015070096A (ja)

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JP2013202614A JP2015070096A (ja) 2013-09-27 2013-09-27 液滴塗布装置及び液滴塗布方法

Applications Claiming Priority (1)

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JP2013202614A JP2015070096A (ja) 2013-09-27 2013-09-27 液滴塗布装置及び液滴塗布方法

Publications (2)

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JP2015070096A true JP2015070096A (ja) 2015-04-13
JP2015070096A5 JP2015070096A5 (enrdf_load_stackoverflow) 2016-11-04

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JP (1) JP2015070096A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115376943A (zh) * 2022-09-16 2022-11-22 大连佳峰自动化股份有限公司 一种芯片蘸锡装片的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148495A (ja) * 1994-11-25 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法、半導体装置におけるバンプ密着性評価方法
JP2003218149A (ja) * 2002-01-22 2003-07-31 Seiko Epson Corp 電子部品製造方法及び電子部品、半導体装置の製造方法並びに電子機器
JP2004228375A (ja) * 2003-01-23 2004-08-12 Seiko Epson Corp バンプの形成方法、デバイス、及び電子機器
JP2005028276A (ja) * 2003-07-11 2005-02-03 Seiko Epson Corp 膜形成方法、デバイス製造方法、電気光学装置、並びに電子機器
JP2010238825A (ja) * 2009-03-30 2010-10-21 Murata Mfg Co Ltd 導電性インク、バンプ形成方法及び電子部品

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08148495A (ja) * 1994-11-25 1996-06-07 Fujitsu Ltd 半導体装置及びその製造方法、半導体装置におけるバンプ密着性評価方法
JP2003218149A (ja) * 2002-01-22 2003-07-31 Seiko Epson Corp 電子部品製造方法及び電子部品、半導体装置の製造方法並びに電子機器
JP2004228375A (ja) * 2003-01-23 2004-08-12 Seiko Epson Corp バンプの形成方法、デバイス、及び電子機器
JP2005028276A (ja) * 2003-07-11 2005-02-03 Seiko Epson Corp 膜形成方法、デバイス製造方法、電気光学装置、並びに電子機器
JP2010238825A (ja) * 2009-03-30 2010-10-21 Murata Mfg Co Ltd 導電性インク、バンプ形成方法及び電子部品

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115376943A (zh) * 2022-09-16 2022-11-22 大连佳峰自动化股份有限公司 一种芯片蘸锡装片的方法

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