JP2015045541A - 検査装置 - Google Patents
検査装置 Download PDFInfo
- Publication number
- JP2015045541A JP2015045541A JP2013176093A JP2013176093A JP2015045541A JP 2015045541 A JP2015045541 A JP 2015045541A JP 2013176093 A JP2013176093 A JP 2013176093A JP 2013176093 A JP2013176093 A JP 2013176093A JP 2015045541 A JP2015045541 A JP 2015045541A
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- voltage
- constant
- gradient
- voltage gradient
- spark
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/14—Circuits therefor, e.g. for generating test voltages, sensing circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
- G01R31/1272—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of cable, line or wire insulation, e.g. using partial discharge measurements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2805—Bare printed circuit boards
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
Description
ΔV=I/C × Δt ……(1)
が成り立つ。
ΔV=(I−Ir)/C × Δt ……(2)
11 定電流源
12 電圧測定部
20 正常時電圧勾配算出部
21 電圧推算部
22 判定部
Claims (3)
- 回路基板に形成された配線パターンの絶縁性を検査する検査装置であって、
検査対象の配線パターンに一定の電流を供給する定電流源と、
前記配線パターンの電圧を測定する電圧測定部と、
前記電圧の時間に対する変化率である電圧勾配が一定であるか否かに基づいて、前記回路基板の良否を判定する判定部と、
を備えることを特徴とする検査装置。 - 請求項1に記載の検査装置であって、
前記電圧の測定結果のうち、所定の電圧勾配算出閾値未満の測定結果に基づいて、正常時の電圧勾配を求める正常時電圧勾配算出部を備え、
前記判定部は、前記電圧の測定結果と、前記正常時の電圧勾配に基づく電圧の推算値と、を比較することにより、前記電圧勾配が一定であるか否かを判定することを特徴とする検査装置。 - 請求項1又は2に記載の検査装置であって、
前記判定部は、前記電圧の測定結果のうち、所定の第1閾値以上、かつ所定の第2閾値未満、の範囲内の測定結果に基づいて、前記電圧勾配が一定であるか否かを判定することを特徴とする検査装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013176093A JP6229876B2 (ja) | 2013-08-27 | 2013-08-27 | 検査装置 |
KR1020140101810A KR102162144B1 (ko) | 2013-08-27 | 2014-08-07 | 검사 장치 |
CN201410410807.2A CN104422860B (zh) | 2013-08-27 | 2014-08-20 | 检测装置 |
TW103128644A TWI638171B (zh) | 2013-08-27 | 2014-08-20 | 檢測裝置 |
US14/470,293 US10228411B2 (en) | 2013-08-27 | 2014-08-27 | Testing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013176093A JP6229876B2 (ja) | 2013-08-27 | 2013-08-27 | 検査装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015045541A true JP2015045541A (ja) | 2015-03-12 |
JP6229876B2 JP6229876B2 (ja) | 2017-11-15 |
Family
ID=52584385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013176093A Active JP6229876B2 (ja) | 2013-08-27 | 2013-08-27 | 検査装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10228411B2 (ja) |
JP (1) | JP6229876B2 (ja) |
KR (1) | KR102162144B1 (ja) |
CN (1) | CN104422860B (ja) |
TW (1) | TWI638171B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016033511A (ja) * | 2014-07-29 | 2016-03-10 | ヤマハファインテック株式会社 | プリント基板検査装置及び検査方法 |
JP2016515695A (ja) * | 2013-03-29 | 2016-05-30 | 日本電産リード株式会社 | 絶縁検査装置および絶縁検査方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6474362B2 (ja) * | 2016-04-04 | 2019-02-27 | ファナック株式会社 | プリント基板の劣化検出装置 |
CN110023768B (zh) * | 2016-12-01 | 2021-11-23 | 日本电产理德股份有限公司 | 电阻测量装置和电阻测量方法 |
EP3505943B1 (de) * | 2017-12-29 | 2020-05-20 | Siemens Aktiengesellschaft | Nachweisen einer elektrischen überspannung |
DK3675302T3 (da) | 2018-12-27 | 2021-05-10 | Vito Nv | En fremgangsmåde og indretning til overvågning af isolation mellem en jævnstrømsbus og beskyttelsesjording |
DE102019103287A1 (de) * | 2019-02-11 | 2020-08-13 | Olympus Winter & Ibe Gmbh | Vorrichtung zur Ermittlung eines parasitären Widerstandes in Videoendoskopen |
US11162998B2 (en) * | 2019-09-03 | 2021-11-02 | Lear Corporation | Circuit for detection and warning of electro-migration on a printed circuit board |
WO2023214429A1 (en) * | 2022-05-05 | 2023-11-09 | Ultraviolette Automotive Private Limited | An unique test method for effectively detecting faults in electrical interconnection in a battery pack |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07146327A (ja) * | 1993-04-30 | 1995-06-06 | Sgs Thomson Microelettronica Spa | 集積されたパワー・デバイスを試験する方法及び装置 |
JP3536046B2 (ja) * | 2002-05-29 | 2004-06-07 | 独立行政法人 科学技術振興機構 | 遠隔観測による岩盤斜面安定性評価方法及びその装置 |
JP2008089485A (ja) * | 2006-10-04 | 2008-04-17 | Nidec-Read Corp | 絶縁検査装置及び絶縁検査方法 |
JP2009109379A (ja) * | 2007-10-31 | 2009-05-21 | Hioki Ee Corp | 絶縁検査装置 |
JP2012013590A (ja) * | 2010-07-02 | 2012-01-19 | Hioki Ee Corp | 測定装置および基板検査装置 |
JP2012018070A (ja) * | 2010-07-08 | 2012-01-26 | Hioki Ee Corp | 擬似放電発生器および回路基板検査装置 |
JP2012047675A (ja) * | 2010-08-30 | 2012-03-08 | Hioki Ee Corp | 検査装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS546046A (en) | 1977-06-16 | 1979-01-17 | Toray Ind Inc | Acrylonitrile polymer compsition |
JP3546046B2 (ja) | 2001-09-26 | 2004-07-21 | 日本電産リード株式会社 | 回路基板の絶縁検査装置及び絶縁検査方法 |
JP3953087B2 (ja) * | 2005-10-18 | 2007-08-01 | 日本電産リード株式会社 | 絶縁検査装置及び絶縁検査方法 |
JP2008039498A (ja) * | 2006-08-03 | 2008-02-21 | Nidec-Read Corp | 抵抗測定装置およびそれを備える基板検査装置ならびに抵抗測定方法およびそれを備える基板検査方法 |
JP4838193B2 (ja) * | 2007-05-10 | 2011-12-14 | 日置電機株式会社 | 回路基板検査装置 |
-
2013
- 2013-08-27 JP JP2013176093A patent/JP6229876B2/ja active Active
-
2014
- 2014-08-07 KR KR1020140101810A patent/KR102162144B1/ko active IP Right Grant
- 2014-08-20 CN CN201410410807.2A patent/CN104422860B/zh active Active
- 2014-08-20 TW TW103128644A patent/TWI638171B/zh active
- 2014-08-27 US US14/470,293 patent/US10228411B2/en active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07146327A (ja) * | 1993-04-30 | 1995-06-06 | Sgs Thomson Microelettronica Spa | 集積されたパワー・デバイスを試験する方法及び装置 |
US5521511A (en) * | 1993-04-30 | 1996-05-28 | Sgs-Thomson Microelectronics S.R.L. | Method and device for testing integrated power devices |
JP3536046B2 (ja) * | 2002-05-29 | 2004-06-07 | 独立行政法人 科学技術振興機構 | 遠隔観測による岩盤斜面安定性評価方法及びその装置 |
JP2008089485A (ja) * | 2006-10-04 | 2008-04-17 | Nidec-Read Corp | 絶縁検査装置及び絶縁検査方法 |
JP2009109379A (ja) * | 2007-10-31 | 2009-05-21 | Hioki Ee Corp | 絶縁検査装置 |
JP2012013590A (ja) * | 2010-07-02 | 2012-01-19 | Hioki Ee Corp | 測定装置および基板検査装置 |
JP2012018070A (ja) * | 2010-07-08 | 2012-01-26 | Hioki Ee Corp | 擬似放電発生器および回路基板検査装置 |
JP2012047675A (ja) * | 2010-08-30 | 2012-03-08 | Hioki Ee Corp | 検査装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016515695A (ja) * | 2013-03-29 | 2016-05-30 | 日本電産リード株式会社 | 絶縁検査装置および絶縁検査方法 |
JP2016033511A (ja) * | 2014-07-29 | 2016-03-10 | ヤマハファインテック株式会社 | プリント基板検査装置及び検査方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201508287A (zh) | 2015-03-01 |
JP6229876B2 (ja) | 2017-11-15 |
KR20150024772A (ko) | 2015-03-09 |
TWI638171B (zh) | 2018-10-11 |
US20150066399A1 (en) | 2015-03-05 |
US10228411B2 (en) | 2019-03-12 |
KR102162144B1 (ko) | 2020-10-06 |
CN104422860B (zh) | 2019-01-04 |
CN104422860A (zh) | 2015-03-18 |
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