JP2014523485A5 - - Google Patents

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Publication number
JP2014523485A5
JP2014523485A5 JP2014516238A JP2014516238A JP2014523485A5 JP 2014523485 A5 JP2014523485 A5 JP 2014523485A5 JP 2014516238 A JP2014516238 A JP 2014516238A JP 2014516238 A JP2014516238 A JP 2014516238A JP 2014523485 A5 JP2014523485 A5 JP 2014523485A5
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JP
Japan
Prior art keywords
copper plating
substrate
acid
formula
leveler additive
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JP2014516238A
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English (en)
Japanese (ja)
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JP6012723B2 (ja
JP2014523485A (ja
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Publication date
Priority claimed from EP11171055A external-priority patent/EP2537962A1/en
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Publication of JP2014523485A publication Critical patent/JP2014523485A/ja
Publication of JP2014523485A5 publication Critical patent/JP2014523485A5/ja
Application granted granted Critical
Publication of JP6012723B2 publication Critical patent/JP6012723B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014516238A 2011-06-22 2012-05-07 銅めっきする方法 Expired - Fee Related JP6012723B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11171055A EP2537962A1 (en) 2011-06-22 2011-06-22 Method for copper plating
EP11171055.4 2011-06-22
PCT/EP2012/058377 WO2012175249A1 (en) 2011-06-22 2012-05-07 Method for copper plating

Publications (3)

Publication Number Publication Date
JP2014523485A JP2014523485A (ja) 2014-09-11
JP2014523485A5 true JP2014523485A5 (cg-RX-API-DMAC7.html) 2015-06-25
JP6012723B2 JP6012723B2 (ja) 2016-10-25

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ID=44583606

Family Applications (1)

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JP2014516238A Expired - Fee Related JP6012723B2 (ja) 2011-06-22 2012-05-07 銅めっきする方法

Country Status (9)

Country Link
US (1) US9506158B2 (cg-RX-API-DMAC7.html)
EP (2) EP2537962A1 (cg-RX-API-DMAC7.html)
JP (1) JP6012723B2 (cg-RX-API-DMAC7.html)
KR (1) KR101899621B1 (cg-RX-API-DMAC7.html)
CN (1) CN103703167B (cg-RX-API-DMAC7.html)
ES (1) ES2555140T3 (cg-RX-API-DMAC7.html)
PT (1) PT2723921E (cg-RX-API-DMAC7.html)
TW (1) TWI560326B (cg-RX-API-DMAC7.html)
WO (1) WO2012175249A1 (cg-RX-API-DMAC7.html)

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US9512529B2 (en) * 2013-06-04 2016-12-06 Rohm And Haas Electronic Materials Llc Electroplating baths of silver and tin alloys
JP6585434B2 (ja) * 2014-10-06 2019-10-02 株式会社荏原製作所 めっき方法
CN107004599B (zh) 2014-12-17 2020-02-18 三井化学株式会社 基板中间体、贯通通孔电极基板及贯通通孔电极形成方法
CN107771227B (zh) 2015-04-20 2019-04-02 埃托特克德国有限公司 电解铜镀液组合物及其用法
US20160312372A1 (en) * 2015-04-27 2016-10-27 Rohm And Haas Electronic Materials Llc Acid copper electroplating bath and method for electroplating low internal stress and good ductiility copper deposits
JP6612525B2 (ja) * 2015-05-13 2019-11-27 石原ケミカル株式会社 電気銅メッキ用の前処理液及び電気銅メッキ方法
JP5907301B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銀コート銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銀コート銅粉の製造方法
JP5907302B1 (ja) 2015-05-15 2016-04-26 住友金属鉱山株式会社 銅粉及びそれを用いた銅ペースト、導電性塗料、導電性シート、並びに銅粉の製造方法
EP3135709B1 (en) 2015-08-31 2018-01-10 ATOTECH Deutschland GmbH Imidazoyl urea polymers and their use in metal or metal alloy plating bath compositions
US10767275B2 (en) 2015-08-31 2020-09-08 Atotech Deutschland Gmbh Aqueous copper plating baths and a method for deposition of copper or copper alloy onto a substrate
EP3141633B1 (en) 2015-09-10 2018-05-02 ATOTECH Deutschland GmbH Copper plating bath composition
US10508357B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
US10512174B2 (en) 2016-02-15 2019-12-17 Rohm And Haas Electronic Materials Llc Method of filling through-holes to reduce voids and other defects
KR101733141B1 (ko) * 2016-03-18 2017-05-08 한국생산기술연구원 고평탄 구리도금막 형성을 위한 전해 구리 도금용 유기첨가제 및 이를 포함하는 전해구리 도금액
JP7064115B2 (ja) 2016-08-15 2022-05-10 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 電解銅めっきのための酸性水性組成物
US10060034B2 (en) * 2017-01-23 2018-08-28 Rohm And Haas Electronic Materials Llc Electroless copper plating compositions
EP3360988B1 (en) 2017-02-09 2019-06-26 ATOTECH Deutschland GmbH Pyridinium compounds, a synthesis method therefor, metal or metal alloy plating baths containing said pyridinium compounds and a method for use of said metal or metal alloy plating baths
JP6948587B2 (ja) * 2017-04-19 2021-10-13 石原ケミカル株式会社 低応力皮膜形成用の電気銅メッキ浴及び電気銅メッキ方法
TWI626989B (zh) * 2017-04-21 2018-06-21 國立中興大學 化學鍍銅的前處理方法及其使用的銅離子錯合物觸媒溶液及調節液
ES2881029T3 (es) 2018-01-09 2021-11-26 Atotech Deutschland Gmbh Aditivo de ureileno, su uso y un método para su preparación
KR102075729B1 (ko) * 2018-02-19 2020-02-11 한국생산기술연구원 고평탄 구리 도금 전해 방법
KR102104261B1 (ko) * 2018-05-25 2020-04-24 한국생산기술연구원 고평탄 구리 도금 전해 방법
EP3901331A1 (en) 2020-04-23 2021-10-27 ATOTECH Deutschland GmbH Acidic aqueous composition for electrolytically depositing a copper deposit
CN111945192B (zh) * 2020-08-11 2021-08-06 深圳市创智成功科技有限公司 用于hdi板和载板的盲孔填孔电镀铜溶液
EP4032930B1 (en) 2021-01-22 2023-08-30 Atotech Deutschland GmbH & Co. KG Biuret-based quaternized polymers and their use in metal or metal alloy plating baths
CN117661051A (zh) * 2022-08-31 2024-03-08 华为技术有限公司 组合物及其应用、整平剂及其制备方法

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