JP2014522737A - ラッピングキャリア及びその使用方法 - Google Patents

ラッピングキャリア及びその使用方法 Download PDF

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Publication number
JP2014522737A
JP2014522737A JP2014520236A JP2014520236A JP2014522737A JP 2014522737 A JP2014522737 A JP 2014522737A JP 2014520236 A JP2014520236 A JP 2014520236A JP 2014520236 A JP2014520236 A JP 2014520236A JP 2014522737 A JP2014522737 A JP 2014522737A
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JP
Japan
Prior art keywords
wrapping
layer
base
carrier
outer polymer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014520236A
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English (en)
Japanese (ja)
Other versions
JP2014522737A5 (OSRAM
Inventor
エリック シー． コード，
ヴィンセント ディー． ロメロ，
ゲーリー エム． パームグレン，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2014522737A publication Critical patent/JP2014522737A/ja
Publication of JP2014522737A5 publication Critical patent/JP2014522737A5/ja
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
JP2014520236A 2011-07-11 2012-07-09 ラッピングキャリア及びその使用方法 Pending JP2014522737A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201161506253P 2011-07-11 2011-07-11
US61/506,253 2011-07-11
US13/489,132 2012-06-05
US13/489,132 US20130017765A1 (en) 2011-07-11 2012-06-05 Lapping carrier and method of using the same
PCT/US2012/045926 WO2013009685A1 (en) 2011-07-11 2012-07-09 Lapping carrier and method of using the same

Publications (2)

Publication Number Publication Date
JP2014522737A true JP2014522737A (ja) 2014-09-08
JP2014522737A5 JP2014522737A5 (OSRAM) 2015-08-13

Family

ID=46548849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014520236A Pending JP2014522737A (ja) 2011-07-11 2012-07-09 ラッピングキャリア及びその使用方法

Country Status (6)

Country Link
US (1) US20130017765A1 (OSRAM)
JP (1) JP2014522737A (OSRAM)
KR (1) KR20140046458A (OSRAM)
CN (1) CN103648716A (OSRAM)
TW (1) TW201309418A (OSRAM)
WO (1) WO2013009685A1 (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019513161A (ja) * 2016-02-16 2019-05-23 スリーエム イノベイティブ プロパティズ カンパニー 研磨システム、並びにその製造方法及び使用方法

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160147917A (ko) 2014-05-02 2016-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불연속된 구조화된 연마 용품 및 작업편의 연마 방법
WO2015170556A1 (ja) * 2014-05-08 2015-11-12 冨士ベークライト株式会社 研磨キャリア及びその製造方法
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN105128448A (zh) * 2015-09-28 2015-12-09 无锡贺邦金属制品有限公司 高耐磨金属制品
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
WO2019092560A1 (en) * 2017-11-08 2019-05-16 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
CN110000696A (zh) * 2017-12-29 2019-07-12 比亚迪股份有限公司 耐磨治具及其制备方法
US20200171623A1 (en) * 2018-11-30 2020-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
JP7205423B2 (ja) * 2018-12-17 2023-01-17 Ａｇｃ株式会社 ガラス基板の保持用膜体、及びガラス基板の研磨方法
WO2020225750A1 (en) * 2019-05-07 2020-11-12 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
CN113146465B (zh) * 2021-04-06 2023-03-21 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235899A (ja) * 2007-03-19 2008-10-02 Siltronic Ag 複数の半導体ウェハを同時に研削するための方法

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JPH0373265A (ja) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd 被研磨物保持用キャリヤ及びその製造方法
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5882245A (en) * 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
US6030280A (en) * 1997-07-23 2000-02-29 Speedfam Corporation Apparatus for holding workpieces during lapping, honing, and polishing
JPH1158223A (ja) * 1997-08-12 1999-03-02 Nitto Shinko Kk 研磨治具及びその製造方法
US6419555B1 (en) 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002371262A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp ウエハ加工用粘着シート用粘着剤およびウエハ加工用粘着シート
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7186629B2 (en) * 2003-11-19 2007-03-06 Advanced Materials Sciences, Inc. Protecting thin semiconductor wafers during back-grinding in high-volume production
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
EP2097221A4 (en) * 2006-11-21 2013-01-02 3M Innovative Properties Co OVERLAPPING CARRIER AND METHOD
WO2010009242A2 (en) * 2008-07-16 2010-01-21 Zimmer, Inc. Thermally treated ceramic coating for implants
US20110256813A1 (en) 2008-12-31 2011-10-20 Fletcher Timothy D Coated carrier for lapping and methods of making and using

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235899A (ja) * 2007-03-19 2008-10-02 Siltronic Ag 複数の半導体ウェハを同時に研削するための方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019513161A (ja) * 2016-02-16 2019-05-23 スリーエム イノベイティブ プロパティズ カンパニー 研磨システム、並びにその製造方法及び使用方法

Also Published As

Publication number Publication date
KR20140046458A (ko) 2014-04-18
US20130017765A1 (en) 2013-01-17
CN103648716A (zh) 2014-03-19
TW201309418A (zh) 2013-03-01
WO2013009685A1 (en) 2013-01-17

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