TW201309418A - 研磨載具及彼等之使用方法 - Google Patents

研磨載具及彼等之使用方法 Download PDF

Info

Publication number
TW201309418A
TW201309418A TW101124822A TW101124822A TW201309418A TW 201309418 A TW201309418 A TW 201309418A TW 101124822 A TW101124822 A TW 101124822A TW 101124822 A TW101124822 A TW 101124822A TW 201309418 A TW201309418 A TW 201309418A
Authority
TW
Taiwan
Prior art keywords
carrier
layer
substrate
outer polymer
abrasive
Prior art date
Application number
TW101124822A
Other languages
English (en)
Chinese (zh)
Inventor
Eric Carl Coad
Vincent D Romero
Gary Marven Palmgren
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW201309418A publication Critical patent/TW201309418A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/10—Single-purpose machines or devices
    • B24B7/16—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings
    • B24B7/17—Single-purpose machines or devices for grinding end-faces, e.g. of gauges, rollers, nuts, piston rings for simultaneously grinding opposite and parallel end faces, e.g. double disc grinders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
TW101124822A 2011-07-11 2012-07-10 研磨載具及彼等之使用方法 TW201309418A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201161506253P 2011-07-11 2011-07-11
US13/489,132 US20130017765A1 (en) 2011-07-11 2012-06-05 Lapping carrier and method of using the same

Publications (1)

Publication Number Publication Date
TW201309418A true TW201309418A (zh) 2013-03-01

Family

ID=46548849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101124822A TW201309418A (zh) 2011-07-11 2012-07-10 研磨載具及彼等之使用方法

Country Status (6)

Country Link
US (1) US20130017765A1 (OSRAM)
JP (1) JP2014522737A (OSRAM)
KR (1) KR20140046458A (OSRAM)
CN (1) CN103648716A (OSRAM)
TW (1) TW201309418A (OSRAM)
WO (1) WO2013009685A1 (OSRAM)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160147917A (ko) 2014-05-02 2016-12-23 쓰리엠 이노베이티브 프로퍼티즈 컴파니 불연속된 구조화된 연마 용품 및 작업편의 연마 방법
WO2015170556A1 (ja) * 2014-05-08 2015-11-12 冨士ベークライト株式会社 研磨キャリア及びその製造方法
CN105881198A (zh) * 2014-12-29 2016-08-24 天津西美科技有限公司 一种抛光模板用吸附垫片
CN105128448A (zh) * 2015-09-28 2015-12-09 无锡贺邦金属制品有限公司 高耐磨金属制品
JP6424809B2 (ja) * 2015-12-11 2018-11-21 信越半導体株式会社 ウェーハの両面研磨方法
KR20180112004A (ko) * 2016-02-16 2018-10-11 쓰리엠 이노베이티브 프로퍼티즈 컴파니 폴리싱 시스템 및 그의 제조 방법 및 사용 방법
US10556317B2 (en) * 2016-03-03 2020-02-11 P.R. Hoffman Machine Products Inc. Polishing machine wafer holder
WO2019092560A1 (en) * 2017-11-08 2019-05-16 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
CN110000696A (zh) * 2017-12-29 2019-07-12 比亚迪股份有限公司 耐磨治具及其制备方法
US20200171623A1 (en) * 2018-11-30 2020-06-04 Taiwan Semiconductor Manufacturing Co., Ltd. Wafer backside cleaning apparatus and method of cleaning wafer backside
JP7205423B2 (ja) * 2018-12-17 2023-01-17 Ａｇｃ株式会社 ガラス基板の保持用膜体、及びガラス基板の研磨方法
WO2020225750A1 (en) * 2019-05-07 2020-11-12 3M Innovative Properties Company Adhesive primer for flexographic plate mounting tape
CN113146465B (zh) * 2021-04-06 2023-03-21 安徽禾臣新材料有限公司 一种薄型晶片双面研磨用吸附垫及生产方法
CN115990825A (zh) * 2022-12-27 2023-04-21 西安奕斯伟材料科技股份有限公司 一种硅片双面抛光用的载具、双面抛光装置及硅片

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373265A (ja) * 1989-05-02 1991-03-28 Sekisui Chem Co Ltd 被研磨物保持用キャリヤ及びその製造方法
US5193316A (en) * 1991-10-29 1993-03-16 Texas Instruments Incorporated Semiconductor wafer polishing using a hydrostatic medium
US5882245A (en) * 1997-02-28 1999-03-16 Advanced Ceramics Research, Inc. Polymer carrier gears for polishing of flat objects
US6030280A (en) * 1997-07-23 2000-02-29 Speedfam Corporation Apparatus for holding workpieces during lapping, honing, and polishing
JPH1158223A (ja) * 1997-08-12 1999-03-02 Nitto Shinko Kk 研磨治具及びその製造方法
US6419555B1 (en) 1999-06-03 2002-07-16 Brian D. Goers Process and apparatus for polishing a workpiece
US6709981B2 (en) * 2000-08-16 2004-03-23 Memc Electronic Materials, Inc. Method and apparatus for processing a semiconductor wafer using novel final polishing method
JP2002371262A (ja) * 2001-06-14 2002-12-26 Nitto Denko Corp ウエハ加工用粘着シート用粘着剤およびウエハ加工用粘着シート
US20040040656A1 (en) * 2002-08-28 2004-03-04 Hengel Raymond J. Method and apparatus for CMP retaining ring
US20040261945A1 (en) * 2002-10-02 2004-12-30 Ensinger Kunststofftechnoligie Gbr Retaining ring for holding semiconductor wafers in a chemical mechanical polishing apparatus
US7008308B2 (en) * 2003-05-20 2006-03-07 Memc Electronic Materials, Inc. Wafer carrier
US7186629B2 (en) * 2003-11-19 2007-03-06 Advanced Materials Sciences, Inc. Protecting thin semiconductor wafers during back-grinding in high-volume production
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
EP2097221A4 (en) * 2006-11-21 2013-01-02 3M Innovative Properties Co OVERLAPPING CARRIER AND METHOD
DE102007056627B4 (de) * 2007-03-19 2023-12-21 Lapmaster Wolters Gmbh Verfahren zum gleichzeitigen Schleifen mehrerer Halbleiterscheiben
WO2010009242A2 (en) * 2008-07-16 2010-01-21 Zimmer, Inc. Thermally treated ceramic coating for implants
US20110256813A1 (en) 2008-12-31 2011-10-20 Fletcher Timothy D Coated carrier for lapping and methods of making and using

Also Published As

Publication number Publication date
KR20140046458A (ko) 2014-04-18
US20130017765A1 (en) 2013-01-17
CN103648716A (zh) 2014-03-19
WO2013009685A1 (en) 2013-01-17
JP2014522737A (ja) 2014-09-08

Similar Documents

Publication Publication Date Title
TW201309418A (zh) 研磨載具及彼等之使用方法
US8795033B2 (en) Lapping carrier and method
US9539695B2 (en) Carrier, method for coating a carrier, and method for the simultaneous double-side material-removing machining of semiconductor wafers
US20110256813A1 (en) Coated carrier for lapping and methods of making and using
EP2785496B1 (en) Polishing pad with foundation layer and polishing surface layer
KR102394677B1 (ko) 연마 패드 및 그의 제조 방법
JP4693024B2 (ja) 研磨材
US9358669B2 (en) High adhesion resin-mineral systems
JPWO2015046203A1 (ja) 保持パッド
KR20140013929A (ko) 연마 필름의 제조 방법, 연마 필름
JP2016124043A (ja) 研磨パッド
JP2021053748A (ja) 研磨パッド及び研磨加工物の製造方法
JP2005347456A (ja) 研磨パッド
US20240246195A1 (en) Method for producing resin member used in production process of electronic devices
CN119589499A (zh) 抛光材料及其制备方法以及抛光方法和砂光装置
JP2024174130A (ja) 研磨パッド及び研磨加工物の製造方法
JP2021053754A (ja) 研磨パッド及び研磨加工物の製造方法
JP2019058957A (ja) 研磨フィルム、及び該研磨フィルムの製造方法
JP2012071386A (ja) 研磨パッド