JP2014514404A - 固体可塑剤を含有するポリオレフィン系ホットメルト接着剤 - Google Patents
固体可塑剤を含有するポリオレフィン系ホットメルト接着剤 Download PDFInfo
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- JP2014514404A JP2014514404A JP2014504074A JP2014504074A JP2014514404A JP 2014514404 A JP2014514404 A JP 2014514404A JP 2014504074 A JP2014504074 A JP 2014504074A JP 2014504074 A JP2014504074 A JP 2014504074A JP 2014514404 A JP2014514404 A JP 2014514404A
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- styrene
- composition
- block copolymer
- composition according
- ethylene
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
- C09J123/04—Homopolymers or copolymers of ethene
- C09J123/08—Copolymers of ethene
- C09J123/0807—Copolymers of ethene with unsaturated hydrocarbons only containing more than three carbon atoms
- C09J123/0815—Copolymers of ethene with aliphatic 1-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract
【選択図】なし
Description
(a)約20重量%から60重量%のメタロセン触媒によるポリオレフィン重合体;
(b)約15重量%から約65重量%の粘着付与樹脂;
(c)約2重量%から約20重量%のスチレン系ブロック共重合体;および
(d)約2重量%から約25重量%の固体可塑剤。
(a)ASTM方法E28によって測定される場合、10℃〜160℃のリングとボールの軟化点を有する脂肪族および環状脂肪族石油炭化水素樹脂であり、後者の樹脂は、主に脂肪族および/または環状脂肪族オレフィンおよびジオレフィンから成る単量体の重合化から生じる;さらに、水素化脂肪族および環状脂肪族石油炭化水素樹脂も含まれる;この種のC5オレフィンフラクションをベースとするかかる市販の樹脂の例としては、Hercules Corp.により販売されるPiccotac 95粘着付与樹脂およびExxonMobil Chemical Companyによって販売されるEscorez 1310LCである;
(b)芳香族石油炭化水素樹脂およびその水素化誘導体;
(c)脂肪族/芳香族石油由来炭化水素樹脂およびその水素化誘導体;
(d)芳香族変性環状脂肪族樹脂およびその水素化誘導体;;
(e)約10℃〜約140℃の軟化点を有するポリテルペン樹脂。後者のポリテルペン樹脂は、一般に、適度に低い温度において、フリーデル・クラフツ触媒の存在下で、ピネンとして知られるモノテルペンなどのテルペン炭化水素の重合化から生じる;さらに、水素化ポリテルペン樹脂も含まれる;および
(f)天然テルペンの共重合体および三元重合体、例えば、スチレン/テルペン、α−メチルスチレン/テルペンおよびビニルトルエン/テルペン。
(1)ASTM法D−1321により測定される硬度値が約0.1〜120で、ASTM軟化点が約66℃〜120℃である、低分子量、すなわち、100〜6000g/モルのポリエチレン;
(2)約130°〜170°の軟化点を有する、パラフィン蝋および約135°〜200°Fの軟化点を有する微結晶蝋などの石油蝋であり、後者の軟化点はASTM法D127−60により測定される;
(3)「Licocene」の名前でClariantから市販されている商品のようなメタロセン触媒によるプロピレン系蝋;
(4)例えば、米国特許第4,914,253号、第6,319,979号またはWO第97/33921号もしくはWO第98/03603号で記述されたもののような、メタロセン触媒による蝋または単一部位触媒による蝋。
(5)フィッシャー・トロプシュ(Fischer−Tropsch)ワックスなど、一酸化炭素と水素を重合することにより作成された合成蝋;
(6)ポリオレフィン蝋。本明細書中で使用される場合、「ポリオレフィン蝋」という用語は、オレフィン系単量体単位で構成されるこれらの高分子または長鎖エンティティを指す。これらの材料は、Eastman Chemical Co.から「Epoplene」の商品名で市販されている。本発明の組成物中で使用するのに好ましい材料は、200°F(93℃)〜350°F(177℃)のリングとボ−ルの軟化点を有する。
機器の特徴
性能評価
実施例1
実施例2
実施例3
Claims (34)
- (a)約20重量%〜60重量%のメタロセン触媒によるポリオレフィン重合体;
(b)約15重量%〜65重量%の粘着付与樹脂;
(c)約2重量%〜20重量%のスチレン系ブロック共重合体;および
(d)約2重量%〜25重量%の固体可塑剤
を含むホットメルト接着組成物。 - 前記ポリオレフィン重合体が、ポリエチレン重合体であることを特徴とする、請求項1に記載の組成物。
- 前記ポリエチレン重合体が、エチレンおよびC4〜C8アルファオレフィン共単量体の共重合体であることを特徴とする、請求項2に記載の組成物。
- 前記共単量体がブテン−1であることを特徴とする、請求項3に記載の組成物。
- 前記共単量体がオクテン−1であることを特徴とする、請求項3に記載の組成物。
- 前記重合体が、100g/10分を超えるメルトインデックスを有することを特徴とする、請求項3に記載の組成物。
- 前記共重合体が、200g/10分を超えるメルトインデックスを有することを特徴とする、請求項3に記載の組成物。
- 前記共重合体が、500g/10分を超えるメルトインデックスを有することを特徴とする、請求項3に記載の組成物。
- 前記粘着付与樹脂が、脂肪族および環状脂肪族石油炭化水素樹脂、水素化脂肪族および環状脂肪族石油炭化水素樹脂、水素化芳香族石油炭化水素樹脂、脂肪族/芳香族石油由来炭化水素樹脂、水素化脂肪族/芳香族由来炭化水素樹脂、芳香族変性環状脂肪族樹脂、水素化芳香族変性環状脂肪族樹脂、ポリテルペン樹脂、天然テルペンの共重合体および三元重合体、ならびにこれらの混合物から成る群から選択されることを特徴とする、請求項1に記載の組成物。
- 前記粘着付与樹脂が90℃を超える軟化点を有することを特徴とする、請求項9に記載の組成物。
- 前記スチレン系ブロック共重合体が、スチレン−ブタジエン(SB)、スチレン−ブタジエン−スチレン(SBS)、スチレン−イソプレン−スチレン(SIS)、スチレン−イソプレン(SI)、スチレン−イソプレン−ブタジエン−スチレン(SIBS)、スチレン−エチレン−ブチレン−スチレン(SEBS)、スチレン−エチレン−ブチレン(SEB)、スチレン−エチレン−プロピレン−スチレン(SEPS)、スチレン−エチレン−プロピレン(SEP)およびスチレン−エチレン−エチレン−プロピレン−スチレン(SEEPS)から成る群から選択されることを特徴とする、請求項1に記載の組成物。
- 前記スチレン系ブロック共重合体が約10重量%〜約30重量%のスチレン含有量を有することを特徴とする、請求項11に記載の組成物。
- 前記スチレン系ブロック共重合体が約10重量%〜約20重量%のスチレン含有量を有することを特徴とする、請求項11に記載の組成物。
- 前記スチレン系ブロック共重合体が約13重量%のスチレン含有量を有することを特徴とする、請求項11に記載の組成物。
- 前記スチレン系ブロック共重合体がスチレン−イソプレン−スチレン(SIS)共重合体であることを特徴とする、請求項12に記載の組成物。
- 前記スチレン系ブロック共重合体 がスチレン−エチレン−ブチレン−スチレン(SEBS)ブロック共重合体であることを特徴とする、請求項12に記載の組成物。
- スチレン系ブロック共重合体が、スチレン−エチレン−プロピレン−スチレン(SEPS)ブロック共重合体であることを特徴とする、特徴とする、請求項12に記載の組成物。
- 前記スチレン系ブロック共重合体がスチレン−エチレン−プロピレン(SEP)ブロック共重合体であることを特徴とする、請求項12に記載の組成物。
- 前記スチレン系ブロック共重合体がスチレン−エチレン−エチレン−プロピレン−スチレン(SEEPS)ブロック共重合体であることを特徴とする、請求項12に記載の組成物。
- 前記固体可塑剤が60℃以上の軟化点を有することを特徴とする、請求項1に記載の組成物。
- 前記固体可塑剤が、グリセロールトリベンゾエートおよび1,4−シクロヘキサンジメタノールジベンゾエートから成る群から選択されることを特徴とする、請求項20に記載の組成物。
- 約2重量%〜約20重量%の固体可塑剤を含む、請求項20に記載の組成物。
- 約2重量%〜約15重量%の前記可塑剤を含む、請求項20に記載の組成物。
- 約30重量%〜約60重量%の前記ポリエチレン重合体を含む、請求項3に記載の組成物。
- 約40重量%〜約60重量%の前記ポリエチレン重合体を含む、請求項3に記載の組成物。
- 約20,000センチポイズ以下の粘度を有する、請求項1に記載の組成物。
- 約15,000センチポイズ以下の粘度を有する、請求項1に記載の組成物。
- 約10,000センチポイズ以下の粘度を有する、請求項1に記載の組成物。
- 約2重量%〜約15重量%の前記スチレン系ブロック共重合体を含む、請求項1に記載の組成物。
- 約2重量%〜約12重量%の前記スチレン系ブロック共重合体を含む、請求項1に記載の組成物。
- 30℃での貯蔵弾性率G1が少なくとも1x106ダイン/cm2である請求項1に記載の組成物。
- 30℃での貯蔵弾性率G1対70℃での貯蔵弾性率G1の比率が100以上である、請求項1に記載の組成物。
- 30℃での貯蔵弾性率G1対70℃での貯蔵弾性率G1の比率が200以上である、請求項1に記載の組成物。
- 30℃での貯蔵弾性率G1対70℃での貯蔵弾性率G1の比率が500以上である、請求項1に記載の組成物。
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EP2467441B1 (en) | 2009-08-20 | 2014-03-05 | Henkel Corporation | Low application temperature hot melt adhesive |
EP2764067B1 (en) * | 2011-10-05 | 2017-01-04 | Bostik, Inc. | Petrolatum containing hot melt bottle labeling adhesive |
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- 2012-04-09 MX MX2013011722A patent/MX352280B/es active IP Right Grant
- 2012-04-09 AU AU2012239928A patent/AU2012239928B2/en not_active Ceased
- 2012-04-09 US US13/442,579 patent/US10815398B2/en active Active
- 2012-04-09 ES ES12715265.0T patent/ES2553653T3/es active Active
- 2012-04-09 WO PCT/US2012/032773 patent/WO2012139120A1/en active Application Filing
- 2012-04-09 EP EP12715265.0A patent/EP2694609B1/en active Active
- 2012-04-09 CN CN201280025747.1A patent/CN103562332B/zh active Active
- 2012-04-09 JP JP2014504074A patent/JP2014514404A/ja active Pending
- 2012-04-09 CA CA2832601A patent/CA2832601C/en active Active
- 2012-04-09 BR BR112013025928-0A patent/BR112013025928B1/pt active IP Right Grant
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2017
- 2017-05-31 JP JP2017107732A patent/JP6444452B2/ja not_active Expired - Fee Related
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Publication number | Priority date | Publication date | Assignee | Title |
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US11572493B2 (en) | 2016-07-14 | 2023-02-07 | Sunstar Engineering Inc. | Adhesive composition |
JP2019044058A (ja) * | 2017-08-31 | 2019-03-22 | 東洋インキScホールディングス株式会社 | 接着性樹脂組成物、それを用いたシート、容器用蓋材及び容器 |
Also Published As
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WO2012139120A1 (en) | 2012-10-11 |
ES2553653T3 (es) | 2015-12-10 |
EP2694609A1 (en) | 2014-02-12 |
CN103562332B (zh) | 2017-08-04 |
AU2012239928B2 (en) | 2016-04-28 |
US10815398B2 (en) | 2020-10-27 |
EP2694609B1 (en) | 2015-08-19 |
BR112013025928A2 (pt) | 2017-08-01 |
MX352280B (es) | 2017-11-16 |
MX2013011722A (es) | 2014-03-27 |
CA2832601A1 (en) | 2012-10-11 |
AU2012239928A1 (en) | 2013-10-24 |
BR112013025928B1 (pt) | 2021-02-09 |
JP6444452B2 (ja) | 2018-12-26 |
JP2017206701A (ja) | 2017-11-24 |
US20120259050A1 (en) | 2012-10-11 |
CA2832601C (en) | 2019-06-04 |
CN103562332A (zh) | 2014-02-05 |
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