JP2014507515A5 - - Google Patents

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Publication number
JP2014507515A5
JP2014507515A5 JP2013547666A JP2013547666A JP2014507515A5 JP 2014507515 A5 JP2014507515 A5 JP 2014507515A5 JP 2013547666 A JP2013547666 A JP 2013547666A JP 2013547666 A JP2013547666 A JP 2013547666A JP 2014507515 A5 JP2014507515 A5 JP 2014507515A5
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JP
Japan
Prior art keywords
polymer layer
substrate
layer
polymer
treatment
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Application number
JP2013547666A
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English (en)
Japanese (ja)
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JP2014507515A (ja
JP5937104B2 (ja
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Priority claimed from PCT/US2011/067761 external-priority patent/WO2012092447A1/en
Publication of JP2014507515A publication Critical patent/JP2014507515A/ja
Publication of JP2014507515A5 publication Critical patent/JP2014507515A5/ja
Application granted granted Critical
Publication of JP5937104B2 publication Critical patent/JP5937104B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013547666A 2010-12-29 2011-12-29 仮接着のためのポリマー組成物 Expired - Fee Related JP5937104B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061427859P 2010-12-29 2010-12-29
US61/427,859 2010-12-29
PCT/US2011/067761 WO2012092447A1 (en) 2010-12-29 2011-12-29 Polymer compositions for temporary bonding

Publications (3)

Publication Number Publication Date
JP2014507515A JP2014507515A (ja) 2014-03-27
JP2014507515A5 true JP2014507515A5 (https=) 2015-01-29
JP5937104B2 JP5937104B2 (ja) 2016-06-22

Family

ID=46381311

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013547666A Expired - Fee Related JP5937104B2 (ja) 2010-12-29 2011-12-29 仮接着のためのポリマー組成物

Country Status (5)

Country Link
US (2) US8633259B2 (https=)
JP (1) JP5937104B2 (https=)
KR (1) KR101455046B1 (https=)
TW (1) TWI558783B (https=)
WO (1) WO2012092447A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558783B (zh) 2010-12-29 2016-11-21 住友電木股份有限公司 用於暫時性黏合的聚合物組成物
JP6031264B2 (ja) * 2012-06-13 2016-11-24 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
DE102013100563A1 (de) * 2013-01-21 2014-07-24 Ev Group E. Thallner Gmbh Aufnahmeeinrichtung zur Handhabung strukturierter Substrate
WO2014137801A1 (en) * 2013-03-03 2014-09-12 John Moore Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
TWI741978B (zh) * 2015-03-31 2021-10-11 日商住友化學股份有限公司 光學積層體及液晶顯示裝置
CN104804682B (zh) * 2015-04-16 2017-05-24 深圳市化讯半导体材料有限公司 晶圆减薄的临时键合胶、其制备方法、键合及解键合方法
WO2018022952A1 (en) * 2016-07-28 2018-02-01 Promerus, Llc Nadic anhydride polymers and photosensitive compositions derived therefrom
JP7066507B2 (ja) * 2018-05-02 2022-05-13 アイカ工業株式会社 光硬化性粘着樹脂組成物およびそれを用いた粘着テープ
WO2019232008A1 (en) * 2018-05-31 2019-12-05 Corning Incorporated Device surface renewal and rework by bundled laminate structures
US20200075384A1 (en) * 2018-08-31 2020-03-05 Micron Technology, Inc. Carrier Bond and Debond Using Self-Depolymerizing Polymer

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004523598A (ja) * 2000-08-10 2004-08-05 ザ プロクター アンド ギャンブル カンパニー 湿気透過性構造のための改善された接着特性を有する熱可塑性親水性ポリマー組成物
US8030425B2 (en) * 2002-07-03 2011-10-04 Promerus Llc Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
CN101831163B (zh) * 2002-11-01 2013-07-10 佐治亚技术研究公司 牺牲组合物、其应用以及分解方法
JP4474854B2 (ja) * 2003-07-02 2010-06-09 Ｊｓｒ株式会社 感放射線性接着剤組成物およびこれを用いたウェハーの加工方法
WO2006093639A1 (en) 2005-03-01 2006-09-08 Dow Corning Corporation Temporary wafer bonding method for semiconductor processing
US8120168B2 (en) * 2006-03-21 2012-02-21 Promerus Llc Methods and materials useful for chip stacking, chip and wafer bonding
WO2007109326A2 (en) * 2006-03-21 2007-09-27 Promerus Llc Methods and materials useful for chip stacking, chip and wafer bonding
US20080200011A1 (en) 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US7713835B2 (en) * 2006-10-06 2010-05-11 Brewer Science Inc. Thermally decomposable spin-on bonding compositions for temporary wafer bonding
TWI418602B (zh) 2007-06-25 2013-12-11 布魯爾科技公司 高溫旋塗暫時結合組成物
JP5518743B2 (ja) * 2008-02-04 2014-06-11 フジフィルム・エレクトロニック・マテリアルズ・ユーエスエイ・インコーポレイテッド 新規なポジ型感光性樹脂組成物
TWI479259B (zh) * 2009-06-15 2015-04-01 住友電木股份有限公司 A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same
TWI558783B (zh) 2010-12-29 2016-11-21 住友電木股份有限公司 用於暫時性黏合的聚合物組成物

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