KR101455046B1 - 일시적 접착용 폴리머 조성물 - Google Patents

일시적 접착용 폴리머 조성물 Download PDF

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Publication number
KR101455046B1
KR101455046B1 KR1020137016286A KR20137016286A KR101455046B1 KR 101455046 B1 KR101455046 B1 KR 101455046B1 KR 1020137016286 A KR1020137016286 A KR 1020137016286A KR 20137016286 A KR20137016286 A KR 20137016286A KR 101455046 B1 KR101455046 B1 KR 101455046B1
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South Korea
Prior art keywords
polymer
substrate
polymer layer
layer
wafer
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Expired - Fee Related
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KR1020137016286A
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English (en)
Korean (ko)
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KR20130119949A (ko
Inventor
래리 에프. 로데스
레아 제이. 랭스도르프
벤캐트 램 두끼패티
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스미토모 베이클라이트 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/41—Compounds containing sulfur bound to oxygen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/15—Heterocyclic compounds having oxygen in the ring
    • C08K5/151—Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1535—Five-membered rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5425—Silicon-containing compounds containing oxygen containing at least one C=C bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/548—Silicon-containing compounds containing sulfur
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7422—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020137016286A 2010-12-29 2011-12-29 일시적 접착용 폴리머 조성물 Expired - Fee Related KR101455046B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201061427859P 2010-12-29 2010-12-29
US61/427,859 2010-12-29
PCT/US2011/067761 WO2012092447A1 (en) 2010-12-29 2011-12-29 Polymer compositions for temporary bonding

Publications (2)

Publication Number Publication Date
KR20130119949A KR20130119949A (ko) 2013-11-01
KR101455046B1 true KR101455046B1 (ko) 2014-10-28

Family

ID=46381311

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137016286A Expired - Fee Related KR101455046B1 (ko) 2010-12-29 2011-12-29 일시적 접착용 폴리머 조성물

Country Status (5)

Country Link
US (2) US8633259B2 (https=)
JP (1) JP5937104B2 (https=)
KR (1) KR101455046B1 (https=)
TW (1) TWI558783B (https=)
WO (1) WO2012092447A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5937104B2 (ja) 2010-12-29 2016-06-22 プロメラス， エルエルシー 仮接着のためのポリマー組成物
JP6031264B2 (ja) * 2012-06-13 2016-11-24 富士フイルム株式会社 半導体装置製造用仮接着剤、並びに、それを用いた接着性支持体、及び、半導体装置の製造方法
DE102013100563A1 (de) * 2013-01-21 2014-07-24 Ev Group E. Thallner Gmbh Aufnahmeeinrichtung zur Handhabung strukturierter Substrate
WO2014137801A1 (en) * 2013-03-03 2014-09-12 John Moore Temporary adhesive with tunable adhesion force sufficient for processing thin solid materials
TWI741978B (zh) * 2015-03-31 2021-10-11 日商住友化學股份有限公司 光學積層體及液晶顯示裝置
CN104804682B (zh) * 2015-04-16 2017-05-24 深圳市化讯半导体材料有限公司 晶圆减薄的临时键合胶、其制备方法、键合及解键合方法
JP6765501B2 (ja) * 2016-07-28 2020-10-07 プロメラス， エルエルシー 無水ナジック酸重合体及びそれに由来する感光性組成物
JP7066507B2 (ja) * 2018-05-02 2022-05-13 アイカ工業株式会社 光硬化性粘着樹脂組成物およびそれを用いた粘着テープ
US20190366682A1 (en) * 2018-05-31 2019-12-05 Corning Incorporated Device surface renewal and rework by bundled laminate structures
US20200075384A1 (en) * 2018-08-31 2020-03-05 Micron Technology, Inc. Carrier Bond and Debond Using Self-Depolymerizing Polymer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173970A1 (en) 2006-10-06 2008-07-24 Pillalamarri Sunil K Thermally decomposable spin-on bonding compositions for temporary wafer bonding
US20080200011A1 (en) 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US20090197067A1 (en) 2008-02-04 2009-08-06 Fujifilm Electronic Materials U.S.A., Inc. Novel Positive Photosensitive Resin Compositions

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004523598A (ja) * 2000-08-10 2004-08-05 ザ プロクター アンド ギャンブル カンパニー 湿気透過性構造のための改善された接着特性を有する熱可塑性親水性ポリマー組成物
US8030425B2 (en) * 2002-07-03 2011-10-04 Promerus Llc Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
JP4608317B2 (ja) * 2002-11-01 2011-01-12 ジョージア・テック・リサーチ・コーポレーション 犠牲組成物、その使用方法、及びその分解方法
JP4474854B2 (ja) * 2003-07-02 2010-06-09 Ｊｓｒ株式会社 感放射線性接着剤組成物およびこれを用いたウェハーの加工方法
KR101278460B1 (ko) 2005-03-01 2013-07-02 다우 코닝 코포레이션 반도체 가공을 위한 임시 웨이퍼 접착방법
TWI443783B (zh) * 2006-03-21 2014-07-01 普洛梅魯斯有限公司 用於晶片堆疊，晶片及晶圓結合之方法及材料
US8120168B2 (en) * 2006-03-21 2012-02-21 Promerus Llc Methods and materials useful for chip stacking, chip and wafer bonding
US7935780B2 (en) 2007-06-25 2011-05-03 Brewer Science Inc. High-temperature spin-on temporary bonding compositions
TWI479259B (zh) * 2009-06-15 2015-04-01 住友電木股份有限公司 A temporary fixing agent for a semiconductor wafer, and a method of manufacturing the semiconductor device using the same
JP5937104B2 (ja) 2010-12-29 2016-06-22 プロメラス， エルエルシー 仮接着のためのポリマー組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080173970A1 (en) 2006-10-06 2008-07-24 Pillalamarri Sunil K Thermally decomposable spin-on bonding compositions for temporary wafer bonding
US20080200011A1 (en) 2006-10-06 2008-08-21 Pillalamarri Sunil K High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach
US20090197067A1 (en) 2008-02-04 2009-08-06 Fujifilm Electronic Materials U.S.A., Inc. Novel Positive Photosensitive Resin Compositions

Also Published As

Publication number Publication date
US20120172479A1 (en) 2012-07-05
TW201231591A (en) 2012-08-01
JP5937104B2 (ja) 2016-06-22
US8633259B2 (en) 2014-01-21
KR20130119949A (ko) 2013-11-01
US9051452B2 (en) 2015-06-09
TWI558783B (zh) 2016-11-21
WO2012092447A1 (en) 2012-07-05
US20140102631A1 (en) 2014-04-17
JP2014507515A (ja) 2014-03-27

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