JP2014503824A - 視覚検査装置 - Google Patents
視覚検査装置 Download PDFInfo
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- JP2014503824A JP2014503824A JP2013547309A JP2013547309A JP2014503824A JP 2014503824 A JP2014503824 A JP 2014503824A JP 2013547309 A JP2013547309 A JP 2013547309A JP 2013547309 A JP2013547309 A JP 2013547309A JP 2014503824 A JP2014503824 A JP 2014503824A
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- inspection object
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2504—Calibration devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
- G01B11/2513—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object with several lines being projected in more than one direction, e.g. grids, patterns
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Operations Research (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Pathology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Theoretical Computer Science (AREA)
- Quality & Reliability (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Image Input (AREA)
- Image Processing (AREA)
Abstract
【選択図】図1
Description
表面実装機は、表面実装部品を印刷回路基板上に実装する装備として、部品供給機(Feeder)から、テープ(Tape)、スティック(Stick)あるいはトレイ(Tray)の形態で供給される各種表面実装部品を受けて印刷回路基板上の実装位置に乗せる作業を行う。
20、30;カメラ部
40;映像処理部
50;制御部
Claims (4)
- 検査対象物をカメラで撮影して良好または不良を判定するための視覚検査装置において、
検査対象物を取付けるステージ部と、
レンズとイメージ感知部とを含んで構成され、前記検査対象物の映像を撮影するためのカメラ部と、
前記検査対象物を照明するための照明部と、
前記カメラ部で撮影された映像を判読して前記検査対象物の良好または不良を判定する映像処理部とを有し、
前記カメラ部のうち検査対象物が取付けられた平面に垂直な線に対して傾いて設置された側部カメラ内のイメージ感知部の表面は、前記検査対象物の中心と前記側部カメラ部内のカメラレンズ中心とを結ぶ線に垂直な平面に対して予め設定された角度で傾いて設置されることを特徴とする視覚検査装置。 - 前記カメラレンズ中心(Lo)から近い距離にある検査対象物の側端部(Ob)に対しては、前記カメラレンズの中心(Lo)から前記イメージ感知部の側端部(Cb)がより近く配置されるように構成されることを特徴とする請求項1に記載の視覚検査装置。
- 前記検査対象物が取付けられた平面に対して、前記検査対象物の中心(Oo)と前記側部カメラ部内のカメラレンズの中心(Lo)とを結ぶ線の角度(θo)が小くなるほど、前記イメージ感知部の表面は、前記検査対象物の中心(Oo)と前記側部カメラ部内のカメラレンズ中心(Lo)とを結ぶ線に垂直な平面(Pv)に対してより大きい角度に傾いて設置されることを特徴とする請求項2に記載の視覚検査装置。
- 前記イメージ感知部の表面37は、前記検査対象物の中心(Oo)と前記側部カメラ部内のカメラレンズ中心(Lo)とを結ぶ線に垂直な平面(Pv)に対して2度以上20度以下で傾いて設置されることを特徴とする請求項3に記載の視覚検査装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020100138460A KR101240947B1 (ko) | 2010-12-30 | 2010-12-30 | 비전검사장치 |
KR10-2010-0138460 | 2010-12-30 | ||
PCT/KR2011/009851 WO2012091344A2 (ko) | 2010-12-30 | 2011-12-20 | 비전검사장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2014503824A true JP2014503824A (ja) | 2014-02-13 |
Family
ID=46383639
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013547309A Pending JP2014503824A (ja) | 2010-12-30 | 2011-12-20 | 視覚検査装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130301904A1 (ja) |
EP (1) | EP2660586A2 (ja) |
JP (1) | JP2014503824A (ja) |
KR (1) | KR101240947B1 (ja) |
CN (1) | CN103430013A (ja) |
WO (1) | WO2012091344A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023012966A1 (ja) * | 2021-08-05 | 2023-02-09 | 株式会社オプト・システム | 半導体チップの良否判定方法及びその装置 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
HUE056308T2 (hu) * | 2013-03-19 | 2022-02-28 | Hennecke Systems Gmbh | Eljárás és rendszer sík félvezetõ tárgyak ellenõrzéséhez |
EP3224806B1 (en) | 2014-11-24 | 2024-06-05 | Kitov Systems Ltd. | Automated inspection |
ITUB20159510A1 (it) * | 2015-12-22 | 2017-06-22 | Sacmi | Apparato di ispezione ottica di oggetti |
US10600174B2 (en) * | 2015-12-29 | 2020-03-24 | Test Research, Inc. | Optical inspection apparatus |
CN106595516B (zh) * | 2016-11-29 | 2019-11-05 | 江苏瑞伯特视觉科技股份有限公司 | 一种基于定焦镜头的大景深结构光测量方法 |
ES2957791T3 (es) * | 2017-08-28 | 2024-01-25 | Daikin Ind Ltd | Dispositivo de procesamiento de aire |
WO2019044198A1 (ja) * | 2017-08-28 | 2019-03-07 | ダイキン工業株式会社 | 空気調和装置 |
KR102091014B1 (ko) * | 2017-12-27 | 2020-04-28 | 선문대학교 산학협력단 | 머신 비전 장치 및 머신 비전을 이용한 제품 검사 방법 |
CN108107614A (zh) * | 2017-12-28 | 2018-06-01 | 深圳市华星光电半导体显示技术有限公司 | 显示检查方法及显示检查装置 |
US20200160089A1 (en) * | 2018-11-15 | 2020-05-21 | International Business Machines Corporation | Visual pattern recognition with selective illumination for assisted inspection |
KR102520888B1 (ko) | 2022-07-12 | 2023-04-14 | 배종옥 | 인공지능 입체적 비전검사 시스템 |
KR20240059078A (ko) | 2022-10-27 | 2024-05-07 | 주식회사 코드기어 | 인공지능 기반의 불량품 판별 및 분류 자동화 시스템 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1014438A2 (en) * | 1998-12-23 | 2000-06-28 | MV Research Limited | A measurement system |
JP2004109106A (ja) * | 2002-07-22 | 2004-04-08 | Fujitsu Ltd | 表面欠陥検査方法および表面欠陥検査装置 |
JP2007327896A (ja) * | 2006-06-09 | 2007-12-20 | Canon Inc | 検査装置 |
JP2011085494A (ja) * | 2009-10-16 | 2011-04-28 | Nikon Corp | 表面検査装置 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH085573A (ja) * | 1994-06-16 | 1996-01-12 | Sumitomo Kinzoku Ceramics:Kk | ワーク表面の検査装置と検査方法 |
JPH10232114A (ja) | 1996-12-20 | 1998-09-02 | Komatsu Ltd | 半導体パッケージの端子検査装置 |
US6160906A (en) * | 1998-06-01 | 2000-12-12 | Motorola, Inc. | Method and apparatus for visually inspecting an object |
JP2000193432A (ja) | 1998-12-25 | 2000-07-14 | Tani Denki Kogyo Kk | 画像認識による計測方法および装置 |
KR100378490B1 (ko) * | 2001-04-06 | 2003-03-29 | 삼성테크윈 주식회사 | 씨씨디 카메라의 조명장치 |
KR100406843B1 (ko) * | 2001-04-06 | 2003-11-21 | (주) 인텍플러스 | 색정보를 이용한 실시간 3차원 표면형상 측정방법 및 장치 |
JP2003130801A (ja) * | 2001-10-22 | 2003-05-08 | Ushio Inc | 蛍光体の検査方法および装置 |
KR100541449B1 (ko) * | 2003-07-23 | 2006-01-11 | 삼성전자주식회사 | 패널검사장치 |
US20090295963A1 (en) * | 2006-02-10 | 2009-12-03 | Pascal Bamford | Method and apparatus and computer program product for collecting digital image data from microscope media-based specimens |
JP4669819B2 (ja) * | 2006-06-15 | 2011-04-13 | 第一実業ビスウィル株式会社 | 整列検査システム及び検査用照明装置 |
JP5252184B2 (ja) * | 2008-03-13 | 2013-07-31 | アイシン精機株式会社 | 凹凸表面検査装置 |
-
2010
- 2010-12-30 KR KR1020100138460A patent/KR101240947B1/ko active IP Right Grant
-
2011
- 2011-12-20 WO PCT/KR2011/009851 patent/WO2012091344A2/ko active Application Filing
- 2011-12-20 JP JP2013547309A patent/JP2014503824A/ja active Pending
- 2011-12-20 US US13/997,441 patent/US20130301904A1/en not_active Abandoned
- 2011-12-20 EP EP11852270.5A patent/EP2660586A2/en not_active Withdrawn
- 2011-12-20 CN CN2011800631766A patent/CN103430013A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1014438A2 (en) * | 1998-12-23 | 2000-06-28 | MV Research Limited | A measurement system |
JP2004109106A (ja) * | 2002-07-22 | 2004-04-08 | Fujitsu Ltd | 表面欠陥検査方法および表面欠陥検査装置 |
JP2007327896A (ja) * | 2006-06-09 | 2007-12-20 | Canon Inc | 検査装置 |
JP2011085494A (ja) * | 2009-10-16 | 2011-04-28 | Nikon Corp | 表面検査装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023012966A1 (ja) * | 2021-08-05 | 2023-02-09 | 株式会社オプト・システム | 半導体チップの良否判定方法及びその装置 |
Also Published As
Publication number | Publication date |
---|---|
CN103430013A (zh) | 2013-12-04 |
US20130301904A1 (en) | 2013-11-14 |
WO2012091344A3 (ko) | 2012-09-07 |
EP2660586A2 (en) | 2013-11-06 |
WO2012091344A2 (ko) | 2012-07-05 |
KR101240947B1 (ko) | 2013-03-18 |
KR20120076761A (ko) | 2012-07-10 |
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