JP2014501303A5 - - Google Patents

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Publication number
JP2014501303A5
JP2014501303A5 JP2013546179A JP2013546179A JP2014501303A5 JP 2014501303 A5 JP2014501303 A5 JP 2014501303A5 JP 2013546179 A JP2013546179 A JP 2013546179A JP 2013546179 A JP2013546179 A JP 2013546179A JP 2014501303 A5 JP2014501303 A5 JP 2014501303A5
Authority
JP
Japan
Prior art keywords
adhesive composition
epoxy
mixed
thiol
curing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013546179A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014501303A (ja
Filing date
Publication date
Priority claimed from EP10196904A external-priority patent/EP2468792A1/en
Application filed filed Critical
Publication of JP2014501303A publication Critical patent/JP2014501303A/ja
Publication of JP2014501303A5 publication Critical patent/JP2014501303A5/ja
Pending legal-status Critical Current

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JP2013546179A 2010-12-23 2011-12-05 硬化性接着剤組成物 Pending JP2014501303A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10196904A EP2468792A1 (en) 2010-12-23 2010-12-23 Curable adhesive composition
EP10196904.6 2010-12-23
PCT/US2011/063254 WO2012087546A1 (en) 2010-12-23 2011-12-05 Curable adhesive composition

Publications (2)

Publication Number Publication Date
JP2014501303A JP2014501303A (ja) 2014-01-20
JP2014501303A5 true JP2014501303A5 (OSRAM) 2015-01-29

Family

ID=44232849

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013546179A Pending JP2014501303A (ja) 2010-12-23 2011-12-05 硬化性接着剤組成物

Country Status (6)

Country Link
US (1) US20130255879A1 (OSRAM)
EP (2) EP2468792A1 (OSRAM)
JP (1) JP2014501303A (OSRAM)
KR (1) KR20130131402A (OSRAM)
CN (1) CN103270073A (OSRAM)
WO (1) WO2012087546A1 (OSRAM)

Families Citing this family (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103184022B (zh) * 2011-12-30 2017-09-19 汉高股份有限及两合公司 用于硅片制备中的暂时性粘合用粘合剂组合物
AR098269A1 (es) 2013-11-18 2016-05-18 Rohm & Haas Poliéster terminado en epoxi
AR098268A1 (es) 2013-11-18 2016-05-18 Rohm & Haas Composición adhesiva
AR098267A1 (es) 2013-11-18 2016-05-18 Rohm & Haas Poliéster terminado en epoxi
AR098270A1 (es) 2013-11-18 2016-05-18 Rohm & Haas Poliéster terminado en epoxi
KR20170029533A (ko) * 2014-07-03 2017-03-15 쓰리엠 이노베이티브 프로퍼티즈 컴파니 저감된 에지 침입 및 개선된 색상 안정성을 갖는 양자점 물품
BR112017015236A2 (pt) * 2015-02-11 2018-01-09 Dow Global Technologies Llc adesivos curáveis em baixa temperatura e uso dos mesmos
CN107406576B (zh) 2015-02-27 2019-04-26 3M创新有限公司 包含增韧的固化剂的双组分粘合剂
US20170096577A1 (en) * 2015-10-01 2017-04-06 PRC-DeSoto International. Inc. Primer-less coated substrates
EP3170860B1 (en) 2015-11-19 2020-07-29 3M Innovative Properties Company Structural adhesive with improved corrosion resistance
EP3170657B1 (en) 2015-11-19 2020-09-09 3M Innovative Properties Company Multilayer structural adhesive film
ES2887114T5 (en) 2016-05-12 2025-03-05 3M Innovative Properties Company Structural adhesive film
EP3385297A1 (en) * 2017-04-04 2018-10-10 3M Innovative Properties Company Epoxy-silicone hybrid sealant composition with low shrinkage and lower postcuring properties with chemical resistance for aerospace applications
US20210130663A1 (en) * 2017-09-12 2021-05-06 Ddp Specialty Electronics Materials Us, Inc. One-component toughened epoxy adhesives
KR102707896B1 (ko) 2018-02-09 2024-09-19 피피지 인더스트리즈 오하이오 인코포레이티드 코팅 조성물
WO2019155327A2 (en) * 2018-02-12 2019-08-15 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
US11168237B2 (en) * 2018-06-14 2021-11-09 3M Innovative Properties Company Adhesion promoters for curable compositions
CN113039017A (zh) * 2018-11-19 2021-06-25 3M创新有限公司 适合用作催化剂的包含羟基基团和叔胺基团的聚合物
EP3677560A1 (en) 2019-01-03 2020-07-08 Sika Technology Ag Modified oxyalkilamines as shrinkage reducing agents in cementitious compositions
JP7256642B2 (ja) * 2019-01-07 2023-04-12 日東電工株式会社 粘接着シート
KR102273807B1 (ko) * 2019-03-14 2021-07-06 주식회사 케이씨씨 아민-아마이드 수지 조성물 및 이의 제조 방법
EP3947560A1 (en) * 2019-03-25 2022-02-09 3M Innovative Properties Company Curable compositions, articles therefrom, and methods of making and using same
WO2020199156A1 (en) * 2019-04-03 2020-10-08 Henkel Ag & Co. Kgaa Two component (2k) composition based on modified epoxy resins
EP3959281B1 (en) * 2019-04-25 2024-07-17 3M Innovative Properties Company Adhesion promoters for structural adhesive applications
JP7329623B2 (ja) * 2019-05-15 2023-08-18 ダウ グローバル テクノロジーズ エルエルシー 2成分接着剤組成物、それで調製された物品、およびその調製方法
EP4017897A1 (en) * 2019-08-23 2022-06-29 PRC-Desoto International, Inc. Coating compositions
EP3798246B1 (en) * 2019-09-27 2024-01-31 Henkel AG & Co. KGaA One component (1k) composition based on modified epoxy resin
CN110728078B (zh) * 2019-11-14 2022-11-25 吉林大学 一种基于胶粘剂化学特性的粘接结构在全服役温度区间下的力学性能的预测方法
US20240124754A1 (en) * 2019-11-15 2024-04-18 Zephyros, Inc. Methods and Compositions for Adhering to Low Surface Energy Materials
EP4077573B1 (en) * 2019-12-16 2025-07-30 3M Innovative Properties Company Two-part curable adhesive
EP4143252A1 (en) 2020-04-28 2023-03-08 3M Innovative Properties Company Curable composition
US11884815B2 (en) * 2020-07-22 2024-01-30 Arisawa Mfg. Co., Ltd. Thermosetting resin composition, coverlay film, adhesive sheet, and flexible printed wiring board
WO2022053954A2 (en) * 2020-09-11 2022-03-17 3M Innovative Properties Company Color stable epoxy compositions
CN112812721B (zh) * 2021-02-08 2022-12-06 Sika技术股份公司 可固化的环氧树脂组合物
CN113150700B (zh) * 2021-03-25 2022-03-04 湖南神力铃胶粘剂制造有限公司 一种耐黄变、低粘度、可亲水固化的环氧石材修补面胶及其制备方法
CN113831062A (zh) * 2021-11-12 2021-12-24 深圳市华厦环境科技有限公司 无机固废固化剂专用粘合剂及其制备方法
CN114316807B (zh) * 2021-12-15 2023-06-02 武汉市科达云石护理材料有限公司 一种低粘度耐黄变快固石材面胶及其制备方法与应用
ES3005219T3 (en) * 2022-03-15 2025-03-14 Basf Se New epoxy resin composition for use as structural adhesive

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4197389A (en) * 1977-07-18 1980-04-08 Hoechst Aktiengesellschaft Hardening agent for aqueous epoxy resin compositions
JPS5657820A (en) * 1979-10-18 1981-05-20 Semedain Kk Curable epoxy resin composition
WO1987000188A1 (en) 1985-06-26 1987-01-15 The Dow Chemical Company Rubber-modified epoxy compounds
CN1033283A (zh) * 1987-11-21 1989-06-07 青岛港务局环境工程研究所 油面胶粘剂
DE19525826C1 (de) * 1995-07-15 1996-10-24 Herberts Gmbh Wäßriges zweikomponentiges Überzugsmittel und dessen Verwendung bei Verfahren zur Herstellung von Mehrschichtlackierungen
EP0847420B1 (en) 1995-08-29 2000-02-16 Exxon Chemical Patents Inc. Radiation tolerant polypropylene and its useful articles
ES2203787T3 (es) * 1996-03-11 2004-04-16 Vantico Ag Composiciones curables de resina epoxi, que contienen endurecedores de poliamida procesables en agua.
DE19630277A1 (de) * 1996-07-26 1998-01-29 Hoechst Ag Härter für wasserverdünnbare Epoxidharzsysteme mit Topfzeit-Anzeige
CN1217991C (zh) * 2000-06-21 2005-09-07 三井化学株式会社 塑性液晶显示元件用密封剂组合物
US6632872B1 (en) 2000-09-19 2003-10-14 3M Innovative Properties Company Adhesive compositions including self-assembling molecules, adhesives, articles, and methods
CN1471551A (zh) * 2000-10-26 2004-01-28 万迪科股份公司 高官能性聚合物
US6916505B2 (en) * 2003-03-04 2005-07-12 Air Products And Chemicals, Inc. Mannich based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application
US9528035B2 (en) * 2009-09-11 2016-12-27 3M Innovative Properties Company Curable and cured adhesive compositions

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