WO2009014353A3 - Surface modified amine curing agent, and one-component type epoxy resin composition and anisotropic conductive adhesive having the same - Google Patents

Surface modified amine curing agent, and one-component type epoxy resin composition and anisotropic conductive adhesive having the same Download PDF

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Publication number
WO2009014353A3
WO2009014353A3 PCT/KR2008/004216 KR2008004216W WO2009014353A3 WO 2009014353 A3 WO2009014353 A3 WO 2009014353A3 KR 2008004216 W KR2008004216 W KR 2008004216W WO 2009014353 A3 WO2009014353 A3 WO 2009014353A3
Authority
WO
WIPO (PCT)
Prior art keywords
curing agent
amine curing
surface modified
resin composition
epoxy resin
Prior art date
Application number
PCT/KR2008/004216
Other languages
French (fr)
Other versions
WO2009014353A2 (en
Inventor
Seong-Jun Park
No-Hyung Park
Yong-Gyun Cho
Joon-Hee Kim
Mun-Seop Song
Chul-Hwan Lim
Original Assignee
Lg Chemical Ltd
Seong-Jun Park
No-Hyung Park
Yong-Gyun Cho
Joon-Hee Kim
Mun-Seop Song
Chul-Hwan Lim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lg Chemical Ltd, Seong-Jun Park, No-Hyung Park, Yong-Gyun Cho, Joon-Hee Kim, Mun-Seop Song, Chul-Hwan Lim filed Critical Lg Chemical Ltd
Publication of WO2009014353A2 publication Critical patent/WO2009014353A2/en
Publication of WO2009014353A3 publication Critical patent/WO2009014353A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/186—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/54—Amino amides>
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

A surface modified amine curing agent includes a core having an amine curing agent with a reactive amino group; and a peripheral layer formed by reaction between an organic acid compound and the reactive amino group existing on the surface of the core. A one-component epoxy resin composition and an anisotropic conductive adhesive including the above surface modified amine curing agent exhibits rapid curing property and improved storage stability.
PCT/KR2008/004216 2007-07-20 2008-07-18 Surface modified amine curing agent, and one-component type epoxy resin composition and anisotropic conductive adhesive having the same WO2009014353A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0073127 2007-07-20
KR1020070073127A KR20090009660A (en) 2007-07-20 2007-07-20 A surface modified amines curing agent, and a one-component type epoxy resin composition and anisotropic conductive adhesive comprising the curing agent

Publications (2)

Publication Number Publication Date
WO2009014353A2 WO2009014353A2 (en) 2009-01-29
WO2009014353A3 true WO2009014353A3 (en) 2009-03-19

Family

ID=40281968

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/004216 WO2009014353A2 (en) 2007-07-20 2008-07-18 Surface modified amine curing agent, and one-component type epoxy resin composition and anisotropic conductive adhesive having the same

Country Status (2)

Country Link
KR (1) KR20090009660A (en)
WO (1) WO2009014353A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7238795B2 (en) 2000-08-03 2007-07-03 Roche Molecular Systems, Inc. Nucleic acid binding compounds containing pyrazolo[3,4-d]pyrimidine analogues of purin-2,6-diamine and their uses
CN103387808B (en) * 2012-05-08 2015-08-19 长春市三化实业有限责任公司 One can be polished flame retardant resistance vehicle structure glue composition and preparation method thereof
CN109735276B (en) * 2019-01-11 2021-03-26 华玻视讯(珠海)科技有限公司 Micron copper sheet-polyphenyl ether-epoxy resin conductive adhesive and preparation method thereof
KR102311179B1 (en) * 2020-02-26 2021-10-13 한국과학기술원 Anisotropic conductive adhesives with solder conductive particles and flux additives for a thermo-compression bonding and electrical interconnection method of electrical component using the same
CN114573790B (en) * 2022-03-17 2023-11-17 宁波锋成绿能环保科技有限公司 Bio-based degradable epoxy resin, preparation method and application thereof

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05209041A (en) * 1991-10-03 1993-08-20 Texaco Chem Co Production of curable epoxy resin
JPH05247179A (en) * 1992-03-06 1993-09-24 Matsumoto Yushi Seiyaku Co Ltd Microcapsule for epoxy resin curing agent
JP2004269721A (en) * 2003-03-10 2004-09-30 Asahi Kasei Chemicals Corp Masterbatch curing agent and one-component type epoxy resin composition
KR20050057676A (en) * 2002-10-25 2005-06-16 아사히 가세이 케미칼즈 가부시키가이샤 Capsule type hardener and composition
KR20070031525A (en) * 2005-09-15 2007-03-20 주식회사 코오롱 Anisotropic conductive film, manufacturing method thereof and its usage

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05209041A (en) * 1991-10-03 1993-08-20 Texaco Chem Co Production of curable epoxy resin
JPH05247179A (en) * 1992-03-06 1993-09-24 Matsumoto Yushi Seiyaku Co Ltd Microcapsule for epoxy resin curing agent
KR20050057676A (en) * 2002-10-25 2005-06-16 아사히 가세이 케미칼즈 가부시키가이샤 Capsule type hardener and composition
JP2004269721A (en) * 2003-03-10 2004-09-30 Asahi Kasei Chemicals Corp Masterbatch curing agent and one-component type epoxy resin composition
KR20070031525A (en) * 2005-09-15 2007-03-20 주식회사 코오롱 Anisotropic conductive film, manufacturing method thereof and its usage

Also Published As

Publication number Publication date
KR20090009660A (en) 2009-01-23
WO2009014353A2 (en) 2009-01-29

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